10M25DAF484A7G vs 10M25DAF484C8G Vergleich
Detaillierter Direktvergleich von 10M25DAF484A7G von Intel und 10M25DAF484C8G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M25DAF484A7G | 10M25DAF484C8G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $52,75 | $50,00 |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 25,000 | 25,000 |
| Embedded Memory (bits) | 691,200 | — |
| Embedded Memory Blocks | 360 (M9K) | — |
| 18x18 Multipliers | 25 | — |
| User I/O Pins | 360 | — |
| Gehäuse | 484-ball BGA | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch |
| Betriebstemperatur | -40C to +125C (automotive) | 0 °C to 85 °C (Commercial) |
| Configuration Memory | On-chip flash (non-volatile) | On-chip dual-configuration flash |
| PLLs | 8 | Yes (up to 4 analog PLLs per device) |
| Global Clock Networks | 16 | — |
| On-chip ADC | 12-bit SAR, 16 channels, up to 1 Msps | — |
| Hard Memory Controller | DDR3 / LPDDR3 | — |
| Core Voltage | 1.2 V | — |
| I/O Voltage | 2.5 V / 3.3 V (bank-dependent) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Embedded Memory (Kbits) | — | 1638 |
| User I/O Count | — | 360 |
| Process Technology | — | 55 nm CMOS |
| Core Supply Voltage (VCCINT) | — | 1.2 V (1.15 V min / 1.25 V max) |
| Speed Grade | — | -8 |
| ADC | — | Integrated 12-bit ADC (where enabled) |
| MSL-Level | — | MSL3 |
| Number of I/O Banks | — | 8 (per F484 pinout) |