10M40DCF484I7G vs 10M50DAF484I7P Comparison
Detailed side-by-side comparison of 10M40DCF484I7G by Intel and 10M50DAF484I7P by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M40DCF484I7G | 10M50DAF484I7P |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $71.48 | $112.00 |
| Family | MAX 10 | — |
| Logic Elements | 40,000 | — |
| Embedded Memory | 1,290,240 bits (Kb) | — |
| User I/O Count | 360 | — |
| Package | 484-FBGA (FineLine BGA, 23 x 23 mm, 1.0 mm pitch) | 484-ball FineLine BGA (F484) |
| Process Technology | 55 nm CMOS | — |
| Core Voltage | 1.2 V | — |
| Maximum Internal Frequency | 472.5 MHz | — |
| PLLs | 4 | 8 (general-purpose, fractional on selected devices) |
| I/O Banks | 2 (with LVDS support) | — |
| Configuration Memory | On-chip flash (instant-on, no external boot PROM) | — |
| Temperature Grade | Commercial (DC suffix) | — |
| Speed Grade | I7 | 7 (slowest industrial bin, highest margin) |
| Lead-Free Finish | Yes (G suffix) | — |
| RoHS Status | Compliant | Compliant |
| Product Family | — | MAX 10 |
| Logic Elements (LE) | — | 50,000 |
| Embedded Memory (bits) | — | 1,677,312 |
| Embedded Memory Blocks | — | M9K (and M144K) |
| 18x18 Multipliers | — | 312 |
| User I/O Pins (max) | — | 360 |
| Pitch | — | 1.0 mm |
| Process Node | — | 55 nm embedded flash (TSMC) |
| On-die Configuration Flash | — | Yes (non-volatile, instant-on) |
| On-die ADC | — | Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs |
| Global Clock Networks | — | 20 |
| Operating Temperature | — | -40C to +100C (Tj, industrial) |
| Configuration Modes | — | Internal flash, JTAG, dual-boot image support |