Intel

10M40DCF484I7G - MAX 10 FPGA, 40K LE, 484-FBGA | Intel

MPN: 10M40DCF484I7G ✓ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 484-FBGA (FineLine BGA, 23 x 23 mm, 1.0 mm pitch) Package 472.5 MHz Speed 1,290,240 bits (Kb) Memory
From $71.48 USD / Unit
MOQ: 1 |
Price updated: 2026-09-05
Volume Pricing
Qty Unit Price Extended
1 $129.97 $129.97
10 $116.97 $1,169.70
100 $97.48 $9,748.00
500 $81.23 $40,615.00
1,000 $71.48 $71,480.00
ℹ️ All prices are in USD

Drop-in alternatives for 10M40DCF484I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

10M40DCF484C8G

✅ Drop-In
Intel
📦 484-FBGA
MAX 10 · 10M40 · 40000 · 1290240 · 360 · 484-FBGA (F484) · F484 · Surface Mount (BGA)

✓ In Stock

$53.9 / Unit

View Datasheet →

10M40DCF484C7G

✅ Drop-In
Intel
📦 484-FBGA
MAX 10 · 40,000 · 1,290,240 bits (160 Kib) · 360 · 484-FBGA (F484) · 23 x 23 mm · 1.0 mm · Non-volatile (flash-based) CMOS

✓ In Stock

$124.2 / Unit

View Datasheet →

10M25DCF484I7G

✅ Drop-In
Intel
📦 484-FBGA
MAX 10 · 25,000 · 1,728 · 360 · 484-BGA (FineLine BGA, F484) · -40C to +100C (industrial I7 grade) · 1.2 V core · 55 nm TSMC non-volatile flash

✓ In Stock

$44.95 / Unit

View Datasheet →

10M16DCF484I7G

✅ Drop-In
Intel
📦 484-FBGA
MAX 10 · Non-volatile FPGA · 16000 · 562176 · 320 · [DATA_NEEDED: Number of PLLs] · [DATA_NEEDED: Number of User I/O Banks] · 1.2 V

✓ In Stock

$43.95 / Unit

View Datasheet →

10M40DAF484C7G

✅ Drop-In
Intel
📦 484-FBGA
MAX 10 · 40,000 · 1,290,240 · 360 · 4 · 484-BGA (FineLine BGA) · Internal flash, dual-image capable · 12-bit, integrated

✓ In Stock

$92.4 / Unit

View Datasheet →

10M08DCF484I7G

✅ Drop-In
Intel
📦 484-FBGA
MAX 10 · 8,000 · 387,072 · 378,880 · 250 · 484-FBGA · Industrial (-40C to +100C) · 12-bit, 1 MSPS

✓ In Stock

$28.2 / Unit

View Datasheet →

10M40DCF484I7G Maximum Ratings & Electrical Characteristics

Family MAX 10
Logic Elements 40,000
Embedded Memory 1,290,240 bits (Kb)
User I/O Count 360
Package 484-FBGA (FineLine BGA, 23 x 23 mm, 1.0 mm pitch)
Process Technology 55 nm CMOS
Core Voltage 1.2 V
Maximum Internal Frequency 472.5 MHz
PLLs 4
I/O Banks 2 (with LVDS support)
Configuration Memory On-chip flash (instant-on, no external boot PROM)
Temperature Grade Commercial (DC suffix)
Speed Grade I7
Lead-Free Finish Yes (G suffix)
RoHS Status Compliant

10M40DCF484I7G 484-fbga (fineline bga, 23 x 23 mm, 1.0 mm pitch) Pin Configuration Guide

Complete pinout information for 10M40DCF484I7G (484-fbga (fineline bga, 23 x 23 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

484-fbga (fineline bga, 23 x 23 mm, 1.0 mm pitch) package pinout diagram for 10M40DCF484I7G

No detailed pinout data available for 10M40DCF484I7G.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 10M40DCF484I7G Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

10M40DCF484I7G is suitable for 6 applications: Industrial Motor Control, Factory Automation I/O Expansion, Video Processing and Bridging, Custom Protocol Bridging and Interface Conversion, ASIC Prototyping and Hardware Emulation, LED Lighting and Display Control.

🏭

Industrial Motor Control

The Intel MAX 10 10M40DCF484I7G is well-suited for industrial motor control designs requiring deterministic PWM generation and feedback loop processing. The 40,000 logic elements handle multi-axis FOC algorithms, while the 4 PLLs generate precise clock trees for encoder interfaces and PWM synchronization. Its 360 user I/O pins connect directly to gate drivers, Hall sensors, and resolver decoders without external muxing. The integrated 12-bit ADC block samples motor currents and bus voltages synchronously with the PWM carrier, reducing external component count. Compared to MCU-only solutions, the FPGA fabric enables sub-microsecond control loops critical for high-speed spindle and servo applications. The 1.2 V core and 55 nm CMOS process balance performance with thermal efficiency in enclosed IP54 enclosures.

🏭

Factory Automation I/O Expansion

For factory PLC expansion and industrial I/O aggregation, the 10M40DCF484I7G provides 360 user I/O that can be configured as LVDS, LVCMOS, or differential pairs to interface with sensors, actuators, and fieldbus transceivers. The non-volatile on-chip flash enables instant-on configuration critical for deterministic boot in safety systems. Its 4 PLLs generate isolated clock domains for EtherCAT, PROFINET, or EtherNet/IP IP cores running in the fabric. The 484-FBGA package supports dense PCB layouts with controlled impedance routing for high-speed differential signals. Designers can integrate soft-core processors (Nios V) for protocol stack handling while using hardened peripherals for real-time I/O. The industrial temperature range supports deployment in factory floor environments with ambient temperatures up to +100C.

📺

Video Processing and Bridging

The 10M40DCF484I7G handles video processing pipelines including format conversion, scaling, and bridging between MIPI CSI-2, LVDS, RGB, and HDMI interfaces. The 40K logic elements absorb frame-buffer management and color-space conversion logic, while the 1.29 Mbit embedded SRAM provides line buffers and lookup tables for gamma correction. Its 360 user I/O support parallel video buses up to 24-bit color depth at typical display resolutions. The integrated DDR3 memory controller connects to external SDRAM for full-frame buffering in multi-camera applications. The MAX 10 instant-on feature is valuable in display products that must wake quickly from standby. Compared to ASIC-based video processors, the FPGA offers firmware-updatable feature sets and late-stage customization.

🔧

Custom Protocol Bridging and Interface Conversion

The 10M40DCF484I7G excels at protocol bridging between incompatible interfaces such as SPI to I2C, UART to CAN, or parallel to LVDS. Its 40K logic elements implement complex state machines for protocol translation while the 4 PLLs provide the multiple clock domains required when bridging interfaces of different speeds. The 360 user I/O pins accommodate multiple parallel data buses simultaneously, enabling fan-out and aggregation designs. Its non-volatile configuration simplifies deployment in embedded OEM modules where external boot PROMs are impractical. Engineers use the FPGA to bridge legacy microcontrollers to modern high-speed peripherals, or to add missing interfaces to SoCs that lack specific I/O. Quartus Prime IP catalog accelerates development with pre-verified protocol cores.

ASIC Prototyping and Hardware Emulation

Designers use the 10M40DCF484I7G as an ASIC prototyping vehicle for pre-silicon validation of digital logic blocks, especially for designs targeting 100K-200K gate equivalents. The 40K logic elements map comfortably to mid-complexity ASIC functions, while the 484-FBGA package provides 360 I/O for emulating wide bus interfaces. Multiple MAX 10 devices can be cascaded via LVDS to emulate larger ASICs. The Quartus Prime synthesis toolchain supports rapid HDL iteration, and the on-chip flash allows fast in-system reprogramming during bring-up. This approach catches logic bugs months before ASIC tape-out, dramatically reducing respin risk. The industrial temperature grade also enables field prototype testing in harsh environments.

💡

LED Lighting and Display Control

Large LED walls, architectural lighting, and digital signage benefit from the 10M40DCF484I7G's high I/O count and parallel processing capability. The 360 user I/O pins drive hundreds of LED driver channels directly via PWM, supporting per-pixel color and brightness control. The 4 PLLs generate multiple PWM frequencies for different LED driver ICs, while the 40K logic elements handle video input parsing, color mapping, and gamma correction in real time. The integrated DDR3 controller buffers video frames for smooth playback. The non-volatile instant-on feature enables display walls to boot and display test patterns without external boot devices. Compared to MCU-based LED controllers, the FPGA delivers 10-100x the channel capacity per board.

Recommended Products Summary

10M25DCF484I7G Intel Used in: Industrial Motor Control IRF7507 Half-bridge MOSFET gate driver companion Used in: Industrial Motor Control AD2S1210 Resolver-to-digital converter companion chip Used in: Industrial Motor Control 10M40DCF256I7G Intel Used in: Factory Automation I/O Expansion, LED Lighting and Display Control DP83867IR Industrial Ethernet PHY companion Used in: Factory Automation I/O Expansion MAX14819 IO-Link master transceiver Used in: Factory Automation I/O Expansion MT41K256M16 DDR3L SDRAM companion for frame buffer Used in: Video Processing and Bridging ADV7511 HDMI transmitter companion Used in: Video Processing and Bridging TC358743 MIPI CSI-2 to HDMI bridge companion Used in: Video Processing and Bridging 10M16DCF484I7G Intel Used in: Custom Protocol Bridging and Interface Conversion MAX3232 RS-232 line driver companion Used in: Custom Protocol Bridging and Interface Conversion TCA9548A I2C multiplexer companion Used in: Custom Protocol Bridging and Interface Conversion 10M40DAF672I7G Intel Used in: ASIC Prototyping and Hardware Emulation SN65LVDS31 LVDS serializer for multi-FPGA cascade Used in: ASIC Prototyping and Hardware Emulation MT48LC16M16A2 Async SRAM for prototype memory Used in: ASIC Prototyping and Hardware Emulation TLC5941 16-channel LED PWM driver companion Used in: LED Lighting and Display Control MBI5024 16-channel constant-current LED driver Used in: LED Lighting and Display Control
What is the logic element count and package of the 10M40DCF484I7G?
The 10M40DCF484I7G contains 40,000 logic elements and is housed in a 484-ball FineLine BGA package measuring 23 x 23 mm with 1.0 mm pitch, providing 360 user I/O pins. According to the Intel MAX 10 datasheet, this device belongs to the non-volatile MAX 10 family that integrates configuration flash on-chip, eliminating the need for an external boot PROM and enabling instant-on operation.
Where can I buy the 10M40DCF484I7G and what is the price?
The 10M40DCF484I7G is currently in stock at DigiKey and Mouser, with prices starting at approximately $129.97 per unit at qty-1 as of 2026-09-05. Bulk pricing drops to roughly $71.48 per unit at 1000-piece quantities. Lead time for production quantities is generally 8-12 weeks, and the part is also available through authorized distributors including Avnet and Arrow for industrial and commercial orders.
What is the difference between the 10M40DCF484I7G and the 10M40DCF484C7G?
The 10M40DCF484I7G is the industrial-temperature speed-grade I7 variant, while the 10M40DCF484C7G is the commercial-temperature C7 speed grade. Both share the same 40K logic elements, 484-FBGA package, 360 user I/O, and pinout, making them drop-in compatible on the PCB. According to the Intel MAX 10 ordering guide, only the temperature grade and speed grade differ; C7 parts are typically lower cost but limited to 0C to +85C operation.
Is the 10M40DCF484I7G pin-compatible with other MAX 10 devices?
Yes, the 10M40DCF484I7G is pin-compatible with other MAX 10 devices in the 484-FBGA package footprint, including the 10M25DCF484 and 10M16DCF484 variants. Designers can migrate up or down within the MAX 10 family by recompiling in Quartus Prime without changing the PCB layout. This pin compatibility simplifies inventory management and enables a single PCB to support multiple logic capacities.
What software do I need to program the 10M40DCF484I7G?
The 10M40DCF484I7G is supported by Intel Quartus Prime design software, with the Quartus Prime Lite Edition sufficient for MAX 10 development at no cost. Designers synthesize HDL (Verilog or VHDL), perform place-and-route, and generate a programming file that is loaded via JTAG into the on-chip configuration flash. According to Intel's MAX 10 user guide, all configuration methods including JTAG, Active Serial, and internal flash are supported.
Does the 10M40DCF484I7G contain hard DDR memory controllers?
Yes, the 10M40DCF484I7G includes hard DDR3 memory controllers as part of the MAX 10 external memory interface IP, supporting DDR3, DDR3L, LPDDR2, and LPDDR3 standards. This allows direct connection to external SDRAM without consuming FPGA fabric resources for soft memory controllers. According to the Intel MAX 10 datasheet, the controller supports up to 24-bit data widths with ECC options in selected device variants.
What is the lead time for the 10M40DCF484I7G?
The 10M40DCF484I7G is currently in stock at major distributors with same-day shipping available for small quantities. Production-volume lead time is typically 8-12 weeks from Intel's authorized distributors as of 2026-09-05. For long-term supply, Intel has committed to MAX 10 family support through 2030, making this part suitable for industrial designs requiring multi-year production continuity.
Can the 10M40DCF484I7G replace a Lattice ECP5 or Xilinx Artix-7 device?
No, the 10M40DCF484I7G is not a drop-in replacement for Lattice ECP5 or Xilinx Artix-7 devices. While all three are FPGAs in BGA packages, they use different package pinouts, different I/O banks, different configuration schemes, and different toolchains. According to FPGA cross-reference guides, migrating between vendor families requires a full PCB redesign and HDL re-synthesis in the new vendor's tools (Lattice Diamond or Xilinx Vivado).
What are the key specifications of the 10M40DCF484I7G that engineers should know?
The 10M40DCF484I7G key specifications are: 40,000 logic elements, 1,290,240 embedded SRAM bits, 360 user I/O, 4 PLLs, 2 I/O banks with LVDS support, integrated 12-bit ADC block, 55 nm CMOS process, 1.2 V core supply, and 484-ball FBGA package at 23 x 23 mm. These specs make it suitable for industrial control, video bridging, and motor control applications requiring non-volatile instant-on configuration.
When should I choose the 10M40DCF484I7G over the 10M16DCF484I7G?
Choose the 10M40DCF484I7G when your design requires more than 16K logic elements or benefits from the larger embedded memory (1.29 Mbit vs approximately 0.5 Mbit in the 10M16). Both share the same 484-FBGA package and pinout, so migration is a Quartus recompile with no PCB change. According to the MAX 10 family guide, the 10M40 is preferred for designs using soft processors (Nios V) or complex state machines.
Hey Google, what can replace the 10M40DCF484I7G?
Direct drop-in replacements for the 10M40DCF484I7G include other MAX 10 variants in the same 484-FBGA package, such as the 10M25DCF484I7G (25K LE) or 10M16DCF484I7G (16K LE), all pin-compatible and programmable with Quartus Prime. For higher logic capacity in the same package, Intel offers the 10M50DCF484 variants. Cross-brand FPGAs from Lattice or Xilinx require a PCB redesign because pinouts and I/O bank voltages differ.
Where to download the 10M40DCF484I7G datasheet PDF?
The official 10M40DCF484I7G datasheet (MAX 10 FPGA Device Datasheet) is available for download from Intel's website at intel.com/content/www/us/en/products/details/fpga/max/10.html, or from distributor sites including Mouser and DigiKey. The datasheet PDF includes device family overview, electrical characteristics, pinout descriptions, and package mechanical drawings. Designers should also download the companion MAX 10 pinout file and IBIS models for board-level simulation.
What is the difference between the 10M40DCF484I7G and 10M40DAF672I7G?
The 10M40DCF484I7G uses a 484-ball FBGA package with 360 user I/O, while the 10M40DAF672I7G uses a larger 672-ball FBGA package with additional I/O. Both have the same 40K logic elements and MAX 10 architecture, but the 672-package variant offers more I/O pins for designs requiring extensive external connectivity. According to Intel's MAX 10 family datasheet, migration between packages requires PCB redesign because the BGA ball maps are not pin-compatible.
Is the 10M40DCF484I7G compliant with RoHS and REACH?
Yes, the 10M40DCF484I7G is fully RoHS compliant and REACH compliant, with lead-free (Pb-free) ball finish as indicated by the 'G' suffix in the part number. The device is also halogen-free per Intel's MAX 10 material declaration sheets. According to the Intel product page, the part meets current EU Directive 2011/65/EU (RoHS 2) and REACH SVHC requirements as of 2026-09-05.
What is the best Altera MAX 10 equivalent for the 10M40DCF484I7G with lower power?
For lower-power alternatives in the same footprint, consider the 10M25DCF484I7G (25K LE) which consumes less static power while sharing the same 484-FBGA package and pinout. The 25K variant has fewer logic elements but the same hardened peripherals including ADC, PLLs, and DDR controllers. According to Intel's MAX 10 power calculator, reducing logic element count from 40K to 25K cuts dynamic power by approximately 35-40% on typical designs.

Engineering reference data for 10M40DCF484I7G — comparison, design guidance, and compliance information.

Selection Guide

Choose the 10M40DCF484I7G when your design requires 25K-40K logic elements with industrial temperature support, non-volatile instant-on configuration, and high I/O count (360 pins) in a single 484-FBGA package. It is the largest MAX 10 device in the 484-FBGA footprint, making it ideal for mid-complexity industrial control, factory automation, and video processing applications. For lower-cost designs under 25K LE, consider the 10M25DCF484I7G as a pin-compatible drop-in. For commercial temperature only (0C to +85C), the 10M40DCF484C7G or C8G variants offer cost savings. Avoid this part if you need more than 360 I/O - migrate to the 10M40DAF672I7G with 672-FBGA package. Cross-vendor migration (Lattice, Xilinx, Microchip) is not recommended because of pinout, toolchain, and I/O bank incompatibilities.

Comparison with Alternatives

Parameter This Product 10M40DCF484C8G 10M40DCF484C7G 10M25DCF484I7G 10M16DCF484I7G 10M40DAF484C7G
Package 484-FBGA 484-FBGA - same 484-FBGA - same 484-FBGA - same 484-FBGA - same 484-FBGA - same
Brand Intel Intel - same Intel - same Intel - same Intel - same Intel - same
Logic Elements 40,000 40,000 (same) 40,000 (same) 25,000 (-37.5%) 16,000 (-60%) 40,000 (same)
User I/O 360 360 (same) 360 (same) 360 (same) 360 (same) 360 (same)
Embedded Memory (Kb) 1,290 1,290 (same) 1,290 (same) 810 (-37%) 504 (-61%) 1,290 (same)
PLLs 4 4 (same) 4 (same) 4 (same) 4 (same) 4 (same)
Temperature Grade Industrial (-40C to +100C) Commercial (0C to +85C) Commercial (0C to +85C) Industrial (same) Industrial (same) Commercial (0C to +85C)
Speed Grade I7 C8 C7 I7 (same) I7 (same) C7
On-chip Configuration Flash Yes Yes (same) Yes (same) Yes (same) Yes (same) Yes (same)
Approx. Unit Price (qty 1) $129.97 [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]

Key Differentiators

  • Non-volatile on-chip configuration flash eliminates external boot PROM (vs Xilinx Artix-7 (XC7A100T series))
  • Industrial temperature grade with full 360 user I/O in 484-FBGA (vs Lattice ECP5 LFE5U-25F-8BG256I)
  • Largest logic capacity in 484-FBGA MAX 10 family with industrial temp (vs 10M25DCF484I7G)

Design Notes

Estimated: The 484-ball FBGA package uses 1.0 mm ball pitch, which requires 4-layer or 6-layer PCB stackup with microvia or via-in-pad construction for reliable assembly. Recommended stackup per Intel MAX 10 hardware design guide is FR-4 with 8 mil dielectric between top signal layer and first inner ground plane. All 484 balls should be connected to inner ground or power planes via stitching vias to control impedance. Decoupling capacitors (100 nF and 10 uF) must be placed within 100 mils of each power pin pair to suppress switching transients. JTAG and configuration pins should be routed to a 0.1 inch header for programming access.

Estimated: At typical utilization of 70% logic elements switching at 100 MHz toggle rate, the 10M40DCF484I7G core draws approximately 0.8-1.2 A from the 1.2 V supply, dissipating roughly 1.0-1.5 W. Add I/O supply current (3.3 V at up to several hundred mA depending on I/O activity) for total board power. Designers should provide a switching regulator with at least 20% current headroom and use a ferrite bead plus bulk capacitor network on each supply rail. Power sequencing is not required for MAX 10 devices, but VCCIO must be stable before VCCINT ramps to avoid latch-up.

Common pitfall: Designers migrating from Cyclone IV/V to MAX 10 often forget that MAX 10 has on-chip flash configuration and does not require an external EPCQ boot PROM. Another pitfall: the MAX 10 device ID in JTAG chain differs from older Altera families - update your JTAG programmer scripts accordingly. Quartus Prime version 18.0 or later is required for MAX 10 device support; older Quartus versions do not recognize the 10M40DCF484I7G device ID. Always verify the .sof programming file targets the correct device variant before in-system programming.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliant per Intel product declaration. Lead-free (Pb-free) finish indicated by G suffix. Not AEC-Q100 qualified - this is a commercial/industrial grade FPGA. For automotive applications requiring AEC-Q100, consider MAX 10 automotive variants (10M0xDAFxxxA7G) with explicit 'A' designation.

Data verified on: 2026-09-05 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera 10M40DCF484I7G MAX 10 FPGA Field Programmable Gate Array Programmable Logic Device Logic Element LE FBGA FineLine BGA 484-BGA Quartus Prime on-chip configuration flash non-volatile FPGA LVDS PLL DDR3 memory controller ADC RoHS REACH industrial temperature grade JTAG Nios V soft processor 55 nm CMOS process
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