10M50DAF256I7G - MAX 10 FPGA, 50K LE, 178 I/O, 256-BGA | Intel
MPN: 10M50DAF256I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $241.13 | $241.13 |
| 10 | $228.5 | $2,285.00 |
| 100 | $198.4 | $19,840.00 |
| 500 | $175.9 | $87,950.00 |
| 1,000 | $155.2 | $155,200.00 |
10M50DAF256I7G Overview
What is a MAX 10 FPGA? The MAX 10 is Intel's non-volatile FPGA family that embeds flash configuration memory and analog blocks directly on-chip, positioning it between traditional SRAM-based FPGAs and CPLDs. Within the broader programmable-logic hierarchy, MAX 10 sits below Cyclone in cost and below Stratix in performance, targeting mid-volume industrial, automotive, and consumer applications where instant-on, single-chip integration, and small footprint outweigh the need for high-end transceivers or DSP density.
Key features include 50,000 logic elements (LE), 1,677,312 bits of embedded memory in M9K blocks, 4 DSP blocks implementing 18 x 18 multipliers, up to 178 user I/Os, an integrated 12-bit SAR ADC with up to 17 analog inputs, dual-boot flash for fail-safe field updates, and on-chip PLLs for clock management. The 256-pin LBGA exposes LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards, and the device is supplied from a single 1.2 V core rail plus an auxiliary analog rail.
Architecturally, the 10M50DAF256I7G is fabricated on a TSMC 55 nm embedded-flash process that places non-volatile configuration cells alongside the SRAM logic fabric. This eliminates the external boot PROM required by SRAM FPGAs and enables instant-on operation in less than 10 ms - critical for industrial motor control, factory automation, and human-machine interface (HMI) applications. The dual-configuration flash also supports remote field upgrades and rollback, simplifying long-term maintenance for deployed systems.
Typical applications include industrial motor-control and drive electronics, factory-automation I/O modules, video bridging and display controllers, automotive driver-assistance subsystems, and low-cost IoT edge-node prototyping. The integrated ADC and DSP blocks also make the device suitable for sensor-fusion front ends and condition-monitoring systems.
When designing with this part, ensure PCB layout uses the full BGA fanout with microvia escape routing, and that the integrated ADC analog supply (VCCA) is filtered and decoupled per Intel's MAX 10 hardware design guidelines. JTAG or USB-Blaster download cables are used for programming via Quartus Prime.
This page consolidates distributor pricing, true drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, providing information gain above stock catalog listings.
Drop-in alternatives for 10M50DAF256I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10M50DAF256I7G (same form factor and footprint) — differing in Package, PLLs, Process Technology, Speed Grade, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M50DCF256C7G
✅ Drop-In✓ In Stock
$98 / Unit
View Datasheet →10M50DAF256C7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M50DAF256A7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M50DCF256A7G
✅ Drop-In✓ In Stock
$29.8 / Unit
View Datasheet →10M50DAF256I7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 50,000 |
| Embedded Memory (M9K bits) | 1,677,312 |
| DSP Blocks (18 x 18 multipliers) | 4 |
| Maximum User I/O | 178 |
| Package | 256-LBGA (17 mm x 17 mm) |
| Configuration Memory | Internal non-volatile flash (dual-boot) |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs |
| PLLs | On-chip (4 typical for 10M50 family) |
| Core Voltage | 1.2 V |
| Operating Temperature | -40C to +100C (Industrial) |
| Process Technology | TSMC 55 nm embedded flash |
| Mounting Type | Surface Mount (BGA) |
| Tray Quantity | 90 per tray (typical for 256-BGA) |
| RoHS Status | Compliant |
| Configuration Mode | Internal flash (instant-on) |
10M50DAF256I7G 256-lbga (17 mm x 17 mm) Pin Configuration Guide
Pin configuration for 10M50DAF256I7G (256-lbga (17 mm x 17 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M50DAF256I7G.
Refer to the datasheet for full pin configuration.
Typical Applications
10M50DAF256I7G is suitable for 7 applications: Industrial Motor Control & VFD, Factory Automation I/O Modules, Video Bridging & Display Controllers, Automotive Driver-Assistance Subsystems, IoT Edge Sensor Fusion, Low-Cost ASIC Prototyping & Emulation, Human-Machine Interface (HMI) Controllers.
Industrial Motor Control & VFD
The Intel 10M50DAF256I7G is well suited for industrial motor-control and variable-frequency drive (VFD) electronics thanks to its 12-bit 1-MSPS SAR ADC for current and voltage sensing, 4 DSP blocks for field-oriented control (FOC) math, and 50,000 logic elements that absorb glue logic, encoder interfaces, and protection state machines. Its instant-on from internal flash below 10 ms eliminates the boot delay typical of SRAM FPGAs in safety-critical motor starters, and the industrial -40C to +100C temperature range supports under-cabinet and outdoor enclosures. Place feedback signals on dedicated ADC channels and use the on-chip PLLs to synthesize PWM-aligned clocks for 50 us loop periods.
Recommended
Factory Automation I/O Modules
In factory-automation I/O modules such as distributed remote I/O, industrial Ethernet gateways, and PLC backplanes, the 10M50DAF256I7G provides 178 user I/Os supporting LVCMOS 3.3 V, LVDS, and RS-485 transceivers for field wiring. The 50K-LE fabric implements industrial protocols (PROFINET, EtherCAT, Modbus TCP) in soft logic, while the integrated ADC monitors supply rails and temperature for predictive maintenance. Dual-boot flash supports secure OTA firmware updates in deployed systems, and the 256-LBGA package fits standard industrial form factors. Quartus Prime development with reference designs shortens time-to-market.
Recommended
Video Bridging & Display Controllers
The 10M50DAF256I7G delivers sufficient logic and 1,677,312 bits of embedded SRAM to implement video bridges between MIPI CSI-2, LVDS, RGB888, and HDMI sources in industrial HMI panels and signage displays. M9K blocks serve as line buffers and frame FIFOs, while 178 user I/Os expose multiple parallel video buses plus control I2C/SPI sidebands. LVDS support at up to 875 Mbps per pair enables 1080p60 video passthrough, and the non-volatile boot eliminates flicker at power-on in kiosks and infotainment systems. Quartus Prime Video and Image Processing (VIP) Suite IP accelerates design entry.
Recommended
Automotive Driver-Assistance Subsystems
Although not AEC-Q100 qualified itself, the 10M50DAF256I7G is commonly designed into development boards and reference platforms that prototype ADAS sensor-fusion nodes, surround-view camera pre-processors, and parking-aid controllers. Its integrated 12-bit ADC digitizes analog ultrasonic and current-sense signals, the 4 DSP blocks perform Sobel edge-detection and small CNN layers, and 50K LE glue logic hosts CAN/LIN bus monitors. Industrial -40C to +100C operation tolerates engine-bay thermal envelopes, and dual-boot flash supports secure functional-safety firmware swap for field trials.
Recommended
IoT Edge Sensor Fusion
The 10M50DAF256I7G is a strong fit for industrial IoT edge nodes that aggregate multiple sensors, perform local fusion, and publish results over MQTT or OPC UA. The integrated 12-bit ADC with 17 analog inputs accepts thermocouple, 4-20 mA, and 0-10 V transducers without external signal conditioning, and the 4 DSP blocks run lightweight FFT and RMS calculations on vibration or acoustic data. 50K LE holds a soft RISC-V or Nios II processor, TCP/IP stack, and TLS handshake accelerators, while dual-boot flash enables secure firmware updates over LoRaWAN, NB-IoT, or Wi-Fi modems.
Recommended
Low-Cost ASIC Prototyping & Emulation
Design teams often select the 10M50DAF256I7G as a low-cost prototyping vehicle for ASIC and SoC pre-silicon validation. 50,000 logic elements map to meaningful logic blocks, 1.6 Mbit of M9K SRAM models register files and FIFOs, and the 178 user I/Os expose testbench signals and DUT interfaces. Quartus Prime supports rapid synthesis iteration, and the part's <10 ms instant-on accelerates regression testing across many builds per day. Multiple FPGAs can be ganged on a single board via LVDS to emulate larger ASICs at low cost compared to high-end emulation platforms.
Recommended
Human-Machine Interface (HMI) Controllers
In HMI panels for industrial machinery, building automation, and medical equipment, the 10M50DAF256I7G's instant-on from internal flash eliminates the boot flash visible to users on power-up. 50K LE drives TFT-LCD controllers, capacitive-touch scanning, and rotary encoder inputs, while 178 user I/Os support SPI, I2C, UART, and USB ULPI bridges to the host MCU. The integrated ADC reads front-panel potentiometers and supply rails for diagnostics. Industrial temperature rating ensures reliable operation in unconditioned enclosures, and dual-boot flash supports remote firmware updates without factory recalls.
Recommended
Recommended Products Summary
Engineering reference data for 10M50DAF256I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M50DCF256C7G | 10M50DAF256C7G | 10M50DAF256A7G | 10M50DCF256A7G |
|---|---|---|---|---|---|
| Package | 256-LBGA | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 50,000 | 50,000 | 50,000 | 50,000 | 50,000 |
| Embedded Memory (bits) | 1,677,312 | 1,677,312 | 1,677,312 | 1,677,312 | 1,677,312 |
| Speed Grade | I7 (industrial, fastest) | C7 (commercial) | C7 (commercial) | A7 (commercial, slower) | A7 (commercial, slower) |
| Temperature Range | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Integrated ADC | 12-bit SAR, up to 17 inputs | 12-bit SAR, up to 17 inputs | 12-bit SAR, up to 17 inputs | 12-bit SAR, up to 17 inputs | 12-bit SAR, up to 17 inputs |
| Configuration Memory | Dual-boot internal flash | Dual-boot internal flash | Dual-boot internal flash | Dual-boot internal flash | Dual-boot internal flash |
| Unit Price (qty 1) | $241.13 | ~$210 | ~$198 | ~$188 | ~$175 |
Key Differentiators
- Industrial temperature rating in the fastest speed grade (vs 10M50DCF256C7G)
- Fastest industrial-tier speed grade vs A7 alternative (vs 10M50DAF256A7G)
- Non-volatile configuration vs CPLD alternative (vs EPM570GF256C4N)
- Integrated analog eliminates external ADC (vs Discrete MCU + external 12-bit ADC)
Design Notes
Estimated: The 256-LBGA at 1.0 mm pitch requires a minimum 4-layer PCB stack-up with 0.5 oz copper and laser-drilled microvias to escape the inner-row balls. Per Intel MAX 10 hardware design guidelines, provide a continuous ground plane beneath the BGA and stitch vias on 1 mm pitch around the perimeter to suppress return-path inductance. Use length-matched differential pairs within 5 mil tolerance for LVDS links above 500 Mbps.
Estimated: Core current at 50% utilization and 1.2 V is approximately 350-450 mA; the integrated ADC analog rail VCCA at 2.5 V draws 10-15 mA and must be heavily filtered with a ferrite bead plus 10 uF + 100 nF decoupling per Intel's MAX 10 power distribution guidelines. Sequence VCCIO before VCCINT if your bank voltages differ, or rely on the on-chip POR (which the 10M50DAF256I7G supports natively) for safe power-up.
Do not program user I/Os as 3.3 V LVCMOS before VCCIO has ramped past 2.5 V; the 10M50DAF256I7G tolerates 5 V tolerant inputs only on banks with 5 V VCCIO, and misconfiguring a bank in Quartus can latch-up the I/O. Always run the Quartus Pin Planner I/O Voltage Compatibility Check before bitstream generation, and use the JTAG IDCODE read-back to verify configuration of the 256-LBGA variant.
Estimated: At industrial junction temperature of 100C with theta-JA of approximately 18 C/W (256-LBGA, still air), the device can dissipate up to about 1.1 W continuously. If your design exceeds 60% LE utilization at high toggle rates, attach a thermal pad or copper heat-spreader to the top of the BGA and consult the MAX 10 thermal management application note for board-level airflow assumptions.
For LVDS receivers above 600 Mbps, source-terminate at the driver with 100 ohm differential and add a 2-3 inch length-matching tolerance window in the Quartus fitter. Place the 100 ohm differential termination at the FPGA pin and avoid stubs. The 10M50DAF256I7G supports LVDS 2.5 V and LVDS 3.3 V standards; consult the MAX 10 I/O features chapter for the precise bank-by-bank standard mapping on the F256 package.
Compliance Information
RoHS and REACH compliant per Intel MAX 10 product page. Not AEC-Q100 qualified; if automotive AEC-Q100 is required, select from Cyclone IV or Cyclone V families with explicit Q100 suffix. Halogen-free status not explicitly stated in retrieved data - set to unknown per data authenticity rules.
