10M50DAF256I7G - MAX 10 FPGA, 50K LE, 178 I/O, 256-BGA | Intel
MPN: 10M50DAF256I7G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $90 | $90.00 |
| 10 | $81 | $810.00 |
| 100 | $72 | $7,200.00 |
| 500 | $64.8 | $32,400.00 |
| 1,000 | $58.5 | $58,500.00 |
Drop-in alternatives for 10M50DAF256I7G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10M50DAF256C8G
β Drop-Inβ In Stock
$47.85 / Unit
View Datasheet β10M50DAF256I6G
β Drop-Inπ Reference alternative (not in catalog)
10M50DCF256I7G
β Drop-Inπ Reference alternative (not in catalog)
10M50DAF256A7G
β Drop-Inπ Reference alternative (not in catalog)
10M50SCE144C8G
β Drop-Inπ Reference alternative (not in catalog)
10M50DAF256I7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements | 50000 |
| Embedded Memory (bits) | 1677312 |
| Maximum User I/O | 178 |
| DSP Blocks (18x18) | 4 |
| Package | 256-LBGA (FBGA) |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| On-chip ADC | 12-bit SAR, up to 17 analog inputs |
| Configuration | Dual internal flash, instant-on (<10 ms) |
| Operating Temperature | -40C to +100C (industrial) |
| Mounting Type | Surface Mount |
| Transceivers | None (MAX 10 family) |
| RoHS Status | Compliant |
10M50DAF256I7G 256-lbga (fbga) Pin Configuration Guide
Complete pinout information for 10M50DAF256I7G (256-lbga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M50DAF256I7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M50DAF256I7G is suitable for 6 applications: Industrial Motor Control and Drive Electronics, Factory Automation I/O Modules, Video Bridging and Display Controllers, Automotive Driver Assistance and Body Electronics, IoT Edge Sensor Nodes, Prototype Development and Education Platforms.
Industrial Motor Control and Drive Electronics
The 10M50DAF256I7G is well suited for industrial motor control applications, where its 50,000 logic elements provide ample capacity for implementing multi-axis field-oriented control (FOC) loops, PWM generation, and encoder feedback decoding. The integrated 12-bit SAR ADC samples up to 17 analog inputs simultaneously, enabling current shunt and back-EMF sensing without external analog ICs. The industrial -40C to +100C operating range tolerates factory-floor thermal stress, while the dual internal flash supports safe field firmware updates for deployed drive electronics. With 178 user I/O exposed via the 256-LBGA, the device can interface directly to multiple gate drivers, optical encoders, and industrial Ethernet PHYs, consolidating motor control and supervisory logic in a single chip.
Recommended
Factory Automation I/O Modules
For distributed I/O modules and remote terminal units (RTUs) in factory automation systems, the 10M50DAF256I7G offers a single-chip solution that replaces traditional MCU-plus-discrete-logic designs. Its 178 user I/O handle a mix of 24V digital inputs, relay outputs, and isolated analog channels without external bus expanders. The on-chip ADC and DSP blocks perform signal conditioning and threshold detection in hardware, reducing CPU interrupt load. Instant-on capability (under 10 ms after power-up) is critical for safety-rated systems requiring fast recovery from brown-out events. The 256-LBGA package at 1.0 mm pitch supports standard reflow assembly and is compatible with pick-and-place equipment used in industrial-grade PCB production lines.
Recommended
Video Bridging and Display Controllers
The 10M50DAF256I7G's 50K logic elements and 4 DSP blocks (18x18 multipliers) provide sufficient fabric to bridge between MIPI, LVDS, CMOS, and RGB display interfaces in low-cost video applications. Its 178 user I/O support multi-lane LVDS for direct panel attachment up to 1080p resolution. The integrated dual flash allows field-upgradable display timing tables for OEM products supporting multiple panel suppliers. With operating temperature up to +100C, the device tolerates sealed-enclosure thermal rise behind LCD or OLED panels. The non-volatile instant-on behavior enables splash-screen display within milliseconds of power-up, ideal for digital signage and human-machine interface (HMI) products.
Recommended
Automotive Driver Assistance and Body Electronics
The 10M50DAF256I7G serves automotive body and ADAS subsystems where non-volatile instant-on behavior and integration matter more than raw logic capacity. The MAX 10 family supports ambient temperature operation to +100C, suitable for cabin and behind-dash applications. The integrated ADC samples sensor inputs (parking sensors, rain/light sensors) directly, while the DSP blocks implement elementary FIR filters for sensor fusion pre-processing. Dual configuration flash enables fail-safe firmware rollback during service campaigns. The 256-LBGA package supports automotive-grade PCB assembly processes. Note that for under-hood or safety-critical ADAS applications, AEC-Q100-qualified variants should be specified instead.
Recommended
IoT Edge Sensor Nodes
For battery-powered or energy-harvesting IoT edge nodes, the 10M50DAF256I7G provides hardware-accelerated sensor processing with low active power. Its integrated 12-bit ADC handles multi-sensor sampling without external analog front-end ICs, and the DSP blocks accelerate vibration and acoustic analysis for predictive maintenance. The 50K LE fabric implements complex state machines and protocol stacks (Modbus, CAN, IO-Link) in parallel with sensor processing. While MAX 10 is not the lowest-power FPGA family (that title belongs to MAX 10 LP variants or Cyclone 10 LP), the dual-flash instant-on behavior minimizes wake-up energy by skipping external boot sequencing. Industrial temperature support enables outdoor deployment.
Recommended
Prototype Development and Education Platforms
The 10M50DAF256I7G is widely adopted in university curricula and FPGA prototyping platforms because it combines instant-on behavior (no boot PROM complexity) with sufficient logic capacity for advanced designs. The 256-LBGA package provides 178 user I/O for breadboard-friendly daughter cards, while Quartus Prime Lite software offers free development toolchains with no license fees. Students and engineers can implement RISC-V soft cores, custom peripherals, and signal processing pipelines within the 50K LE budget. The integrated ADC enables mixed-signal teaching labs without external instrumentation. Industrial temperature support means prototypes built today will operate reliably in field trials.
Recommended
Recommended Products Summary
Engineering reference data for 10M50DAF256I7G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M50DAF256C8G | 10M50DAF256I6G | 10M50DCF256I7G | 10M50DAF256A7G |
|---|---|---|---|---|---|
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) |
| Package | 256-LBGA (FBGA) | 256-LBGA (FBGA) - same | 256-LBGA (FBGA) - same | 256-LBGA (FBGA) - same | 256-LBGA (FBGA) - same |
| Logic Elements | 50000 | 50000 | 50000 | 50000 | 50000 |
| Embedded Memory (bits) | 1677312 | 1677312 | 1677312 | 1677312 | 1677312 |
| User I/O | 178 | 178 | 178 | 178 | 178 |
| Configuration Flash | Dual (user + factory) | Dual (user + factory) | Dual (user + factory) | Single (user only) | Dual (user + factory) |
| Operating Temperature | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Speed Grade | 7 (fastest) | 8 (slower) | 6 (slowest) | 7 | 7 |
| Price (qty 1, USD) | 90.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Industrial temperature grade with fastest speed grade (vs 10M50DAF256C8G)
- Dual configuration flash for fail-safe updates (vs 10M50DCF256I7G)
- Fastest industrial-grade speed grade available (vs 10M50DAF256I6G)
Design Notes
The 256-LBGA package uses 1.0 mm ball pitch, which is at the limit of standard PCB manufacturing capability. Use HDI (High-Density Interconnect) stackup with microvias for inner-row escape, and ensure BGA pad finish is ENIG or OSP for reliable solder joint formation. Per IPC-7093 design guidelines for BGA packages, place via-in-pad only on inner balls to avoid solder wicking; outer-ring balls can use standard fan-out routing. Thermal vias under the center balls are recommended to reduce junction-to-board thermal resistance.
MAX 10 FPGAs integrate on-chip voltage regulators that generate core, I/O, and analog supplies from a single external 3.3V or 2.5V source. Per Intel's MAX 10 hardware design guidelines, decouple each supply pair with 0.1uF and 10uF ceramic capacitors placed within 5 mm of the corresponding supply pins. For designs using the integrated ADC, isolate VCCA (analog supply) from VCCIO with a ferrite bead and dedicate a separate ground pour to reduce ADC noise coupling. Estimated: at 50% logic utilization and 100 MHz operation, the device draws approximately 200-400 mA from the 3.3V rail.
Do not confuse the DAF (dual-configuration flash, A speed grade) and DCF (single-configuration flash, C speed grade) suffixes when sourcing or replacing - they share the same 256-LBGA footprint but differ in fail-safe update capability. According to Intel's MAX 10 datasheet, the dual-configuration variant supports remote firmware rollback, while the single-configuration variant stores only one image. Also ensure the JTAG chain is not shared with other devices unless all components support combined JTAG operation, as 10-pin JTAG header pin assignments differ from legacy Altera ByteBlaster designs.
Route all differential pairs (LVDS) with 100 ohm differential impedance and length matching to within 20 mils for reliable high-speed signaling. Place series resistors on LVDS TX pairs close to the FPGA output pins to dampen reflections. For SDRAM interfaces (when implemented in soft logic), maintain matched trace lengths on clock, address, and data buses within 50 mils to avoid setup/hold violations. The integrated ADC analog inputs should be routed away from digital switching signals and surrounded by analog ground pour per the device pin connection guidelines.
Compliance Information
RoHS and REACH compliant per Altera product page. Not AEC-Q100 qualified - select automotive-grade variants for safety-critical applications. Halogen-free status not confirmed in provided data.
