10M50DAF484I7G vs 10M50DAF484I7P Comparison

Detailed side-by-side comparison of 10M50DAF484I7G by Intel and 10M50DAF484I7P by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10M50DAF484I7G 10M50DAF484I7P
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $58.20 $112.00
Family MAX 10 —
Logic Elements (LE) 50,000 50,000
Embedded Memory (bits) 1,677,312 1,677,312
Embedded User Flash (bits) 1,677,312 (dual configuration) —
User I/O Count 360 —
Package 484-ball FBGA (F484) 484-ball FineLine BGA (F484)
Package Pitch 1.0 mm —
Package Body Size 23 x 23 mm —
Process Technology TSMC 55 nm —
Supply Voltage - Core 1.2 V —
Operating Temperature Grade Industrial (-40C to +100C) —
On-die Configuration Flash Yes (dual-boot) Yes (non-volatile, instant-on)
Integrated ADC 12-bit, 1 MSPS, up to 18 channels —
DSP Blocks 144 (18x18 multipliers) —
PLLs 4 8 (general-purpose, fractional on selected devices)
Configuration Mode Single-chip (no external boot device required) —
Mounting Type Surface Mount (FBGA) —
MSL Level 3 (per JEDEC J-STD-020) —
RoHS Status Compliant Compliant
Lead-free / Halogen-free Yes / Yes —
Product Family — MAX 10
Embedded Memory Blocks — M9K (and M144K)
18x18 Multipliers — 312
User I/O Pins (max) — 360
Pitch — 1.0 mm
Process Node — 55 nm embedded flash (TSMC)
On-die ADC — Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs
Global Clock Networks — 20
Speed Grade — 7 (slowest industrial bin, highest margin)
Operating Temperature — -40C to +100C (Tj, industrial)
Configuration Modes — Internal flash, JTAG, dual-boot image support

Datasheets & Resources

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