10M50DAF484I7G vs 10M50DAF484I7P Vergleich

Detaillierter Direktvergleich von 10M50DAF484I7G von Intel und 10M50DAF484I7P von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 10M50DAF484I7G 10M50DAF484I7P
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $58,20 $112,00
Family MAX 10 —
Logic Elements (LE) 50,000 50,000
Embedded Memory (bits) 1,677,312 1,677,312
Embedded User Flash (bits) 1,677,312 (dual configuration) —
User I/O Count 360 —
Gehäuse 484-ball FBGA (F484) 484-ball FineLine BGA (F484)
Package Pitch 1.0 mm —
Package Body Size 23 x 23 mm —
Process Technology TSMC 55 nm —
Supply Voltage - Core 1.2 V —
Operating Temperature Grade Industrial (-40C to +100C) —
On-die Configuration Flash Yes (dual-boot) Yes (non-volatile, instant-on)
Integrated ADC 12-bit, 1 MSPS, up to 18 channels —
DSP Blocks 144 (18x18 multipliers) —
PLLs 4 8 (general-purpose, fractional on selected devices)
Configuration Mode Single-chip (no external boot device required) —
Montageart Surface Mount (FBGA) —
MSL-Level 3 (per JEDEC J-STD-020) —
RoHS-Status Compliant Compliant
Lead-free / Halogen-free Yes / Yes —
Product Family — MAX 10
Embedded Memory Blocks — M9K (and M144K)
18x18 Multipliers — 312
User I/O Pins (max) — 360
Pitch — 1.0 mm
Process Node — 55 nm embedded flash (TSMC)
On-die ADC — Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs
Global Clock Networks — 20
Speed Grade — 7 (slowest industrial bin, highest margin)
Betriebstemperatur — -40C to +100C (Tj, industrial)
Configuration Modes — Internal flash, JTAG, dual-boot image support

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