10M50DAF484I7P vs 10M40DCF484I7G Comparison
Detailed side-by-side comparison of 10M50DAF484I7P by Intel and 10M40DCF484I7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M50DAF484I7P | 10M40DCF484I7G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $112.00 | $71.48 |
| Product Family | MAX 10 | — |
| Logic Elements (LE) | 50,000 | — |
| Embedded Memory (bits) | 1,677,312 | — |
| Embedded Memory Blocks | M9K (and M144K) | — |
| 18x18 Multipliers | 312 | — |
| User I/O Pins (max) | 360 | — |
| Package | 484-ball FineLine BGA (F484) | 484-FBGA (FineLine BGA, 23 x 23 mm, 1.0 mm pitch) |
| Pitch | 1.0 mm | — |
| Process Node | 55 nm embedded flash (TSMC) | — |
| On-die Configuration Flash | Yes (non-volatile, instant-on) | — |
| On-die ADC | Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs | — |
| PLLs | 8 (general-purpose, fractional on selected devices) | 4 |
| Global Clock Networks | 20 | — |
| Speed Grade | 7 (slowest industrial bin, highest margin) | I7 |
| Operating Temperature | -40C to +100C (Tj, industrial) | — |
| Configuration Modes | Internal flash, JTAG, dual-boot image support | — |
| RoHS Status | Compliant | Compliant |
| Family | — | MAX 10 |
| Logic Elements | — | 40,000 |
| Embedded Memory | — | 1,290,240 bits (Kb) |
| User I/O Count | — | 360 |
| Process Technology | — | 55 nm CMOS |
| Core Voltage | — | 1.2 V |
| Maximum Internal Frequency | — | 472.5 MHz |
| I/O Banks | — | 2 (with LVDS support) |
| Configuration Memory | — | On-chip flash (instant-on, no external boot PROM) |
| Temperature Grade | — | Commercial (DC suffix) |
| Lead-Free Finish | — | Yes (G suffix) |