10M50DAF484I7P vs 10M40DCF484I7G Comparación
Comparación detallada lado a lado de 10M50DAF484I7P por Intel y 10M40DCF484I7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M50DAF484I7P | 10M40DCF484I7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $112,00 | $71,48 |
| Product Family | MAX 10 | — |
| Logic Elements (LE) | 50,000 | — |
| Embedded Memory (bits) | 1,677,312 | — |
| Embedded Memory Blocks | M9K (and M144K) | — |
| 18x18 Multipliers | 312 | — |
| User I/O Pins (max) | 360 | — |
| Encapsulado | 484-ball FineLine BGA (F484) | 484-FBGA (FineLine BGA, 23 x 23 mm, 1.0 mm pitch) |
| Pitch | 1.0 mm | — |
| Process Node | 55 nm embedded flash (TSMC) | — |
| On-die Configuration Flash | Yes (non-volatile, instant-on) | — |
| On-die ADC | Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs | — |
| PLLs | 8 (general-purpose, fractional on selected devices) | 4 |
| Global Clock Networks | 20 | — |
| Speed Grade | 7 (slowest industrial bin, highest margin) | I7 |
| Temperatura de funcionamiento | -40C to +100C (Tj, industrial) | — |
| Configuration Modes | Internal flash, JTAG, dual-boot image support | — |
| Estado RoHS | Compliant | Compliant |
| Family | — | MAX 10 |
| Logic Elements | — | 40,000 |
| Embedded Memory | — | 1,290,240 bits (Kb) |
| User I/O Count | — | 360 |
| Process Technology | — | 55 nm CMOS |
| Core Voltage | — | 1.2 V |
| Maximum Internal Frequency | — | 472.5 MHz |
| I/O Banks | — | 2 (with LVDS support) |
| Configuration Memory | — | On-chip flash (instant-on, no external boot PROM) |
| Temperature Grade | — | Commercial (DC suffix) |
| Lead-Free Finish | — | Yes (G suffix) |