10M50DAF484I7P vs 10M40DCF484I7G Vergleich
Detaillierter Direktvergleich von 10M50DAF484I7P von Intel und 10M40DCF484I7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M50DAF484I7P | 10M40DCF484I7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $112,00 | $71,48 |
| Product Family | MAX 10 | — |
| Logic Elements (LE) | 50,000 | — |
| Embedded Memory (bits) | 1,677,312 | — |
| Embedded Memory Blocks | M9K (and M144K) | — |
| 18x18 Multipliers | 312 | — |
| User I/O Pins (max) | 360 | — |
| Gehäuse | 484-ball FineLine BGA (F484) | 484-FBGA (FineLine BGA, 23 x 23 mm, 1.0 mm pitch) |
| Pitch | 1.0 mm | — |
| Process Node | 55 nm embedded flash (TSMC) | — |
| On-die Configuration Flash | Yes (non-volatile, instant-on) | — |
| On-die ADC | Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs | — |
| PLLs | 8 (general-purpose, fractional on selected devices) | 4 |
| Global Clock Networks | 20 | — |
| Speed Grade | 7 (slowest industrial bin, highest margin) | I7 |
| Betriebstemperatur | -40C to +100C (Tj, industrial) | — |
| Configuration Modes | Internal flash, JTAG, dual-boot image support | — |
| RoHS-Status | Compliant | Compliant |
| Family | — | MAX 10 |
| Logic Elements | — | 40,000 |
| Embedded Memory | — | 1,290,240 bits (Kb) |
| User I/O Count | — | 360 |
| Process Technology | — | 55 nm CMOS |
| Core Voltage | — | 1.2 V |
| Maximum Internal Frequency | — | 472.5 MHz |
| I/O Banks | — | 2 (with LVDS support) |
| Configuration Memory | — | On-chip flash (instant-on, no external boot PROM) |
| Temperature Grade | — | Commercial (DC suffix) |
| Lead-Free Finish | — | Yes (G suffix) |