10M50DCF256C8G vs 10M50DCF256A7G Comparison
Detailed side-by-side comparison of 10M50DCF256C8G by Intel and 10M50DCF256A7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M50DCF256C8G | 10M50DCF256A7G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $52.85 | $29.80 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50,000 |
| Embedded Memory | 1,677,312 bits (user flash) + 5,151 Kbits (M9K RAM) | M9K blocks, 9 Kbits each |
| User Flash Memory | 1,677,312 bits | 1,677,312 bits |
| DSP Blocks (18x18 Multipliers) | 172 | — |
| Maximum User I/O Pins | 178 | — |
| Package | 256-pin FBGA (FBGA256), 17x17 mm | 256-ball FBGA (F256), 17 x 17 mm, 1.0 mm pitch |
| Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 8 | 7 (DCF = dual-supply, commercial/industrial) |
| PLLs | 4 | — |
| Hard ADC Blocks | 2 (12-bit, 1 MSPS) | — |
| Process Technology | TSMC 55 nm embedded flash CMOS | — |
| Core Voltage | 1.0 V (internal) | 1.2 V |
| I/O Bank Voltage | 2.5 V / 3.3 V (LVCMOS compatible) | — |
| Configuration Method | On-die non-volatile flash (instant-on); dual-boot supported | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS Status | Compliant | Compliant |
| User I/O Count | — | 178 |
| Process Node | — | 55 nm |
| I/O Bank Voltages | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Operating Temperature | — | -40 C to +85 C (industrial) |
| Embedded Multipliers | — | 144 x 18 x 18 |
| PLL | — | 4 |
| On-chip ADC | — | 12-bit, 1 MSPS, 16 channels |
| Configuration | — | Internal flash (single-chip, instant-on) |
| MSL Level | — | 3 (168 hours) |