10M50DCF256C8G vs 10M50DCF256A7G 对比

详细并排对比 10M50DCF256C8G 出自 Intel 和 10M50DCF256A7G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
10M50DCF256A7G 10M50DCF256A7G - MAX 10 FPGA, 50K LE, 256-FBGA | Intel

10M50DCF256A7G - MAX 10 FPGA, 50K LE, 256-FBGA | Intel

10M50DCF256A7G ✓ 量产中

规格对比

参数 10M50DCF256C8G 10M50DCF256A7G
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $52.85 $29.80
Family MAX 10 MAX 10
Logic Elements (LE) 50,000 50,000
Embedded Memory 1,677,312 bits (user flash) + 5,151 Kbits (M9K RAM) M9K blocks, 9 Kbits each
User Flash Memory 1,677,312 bits 1,677,312 bits
DSP Blocks (18x18 Multipliers) 172 —
Maximum User I/O Pins 178 —
封装 256-pin FBGA (FBGA256), 17x17 mm 256-ball FBGA (F256), 17 x 17 mm, 1.0 mm pitch
Temperature Grade Commercial (C suffix) —
Speed Grade 8 7 (DCF = dual-supply, commercial/industrial)
PLLs 4 —
Hard ADC Blocks 2 (12-bit, 1 MSPS) —
Process Technology TSMC 55 nm embedded flash CMOS —
Core Voltage 1.0 V (internal) 1.2 V
I/O Bank Voltage 2.5 V / 3.3 V (LVCMOS compatible) —
Configuration Method On-die non-volatile flash (instant-on); dual-boot supported —
安装类型 Surface Mount (BGA) Surface Mount (BGA)
RoHS 状态 Compliant Compliant
User I/O Count — 178
Process Node — 55 nm
I/O Bank Voltages — 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V
工作温度 — -40 C to +85 C (industrial)
Embedded Multipliers — 144 x 18 x 18
PLL — 4
On-chip ADC — 12-bit, 1 MSPS, 16 channels
Configuration — Internal flash (single-chip, instant-on)
MSL 等级 — 3 (168 hours)

数据手册与资源

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