10M50DCF256C8G vs 10M50DCF256A7G Vergleich
Detaillierter Direktvergleich von 10M50DCF256C8G von Intel und 10M50DCF256A7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M50DCF256C8G | 10M50DCF256A7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $52,85 | $29,80 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50,000 |
| Embedded Memory | 1,677,312 bits (user flash) + 5,151 Kbits (M9K RAM) | M9K blocks, 9 Kbits each |
| User Flash Memory | 1,677,312 bits | 1,677,312 bits |
| DSP Blocks (18x18 Multipliers) | 172 | — |
| Maximum User I/O Pins | 178 | — |
| Gehäuse | 256-pin FBGA (FBGA256), 17x17 mm | 256-ball FBGA (F256), 17 x 17 mm, 1.0 mm pitch |
| Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 8 | 7 (DCF = dual-supply, commercial/industrial) |
| PLLs | 4 | — |
| Hard ADC Blocks | 2 (12-bit, 1 MSPS) | — |
| Process Technology | TSMC 55 nm embedded flash CMOS | — |
| Core Voltage | 1.0 V (internal) | 1.2 V |
| I/O Bank Voltage | 2.5 V / 3.3 V (LVCMOS compatible) | — |
| Configuration Method | On-die non-volatile flash (instant-on); dual-boot supported | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| User I/O Count | — | 178 |
| Process Node | — | 55 nm |
| I/O Bank Voltages | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Betriebstemperatur | — | -40 C to +85 C (industrial) |
| Embedded Multipliers | — | 144 x 18 x 18 |
| PLL | — | 4 |
| On-chip ADC | — | 12-bit, 1 MSPS, 16 channels |
| Configuration | — | Internal flash (single-chip, instant-on) |
| MSL-Level | — | 3 (168 hours) |