5CGXBC5C7F27C8N vs 5CGXBC7C7F23C8N Comparison
Detailed side-by-side comparison of 5CGXBC5C7F27C8N by Intel and 5CGXBC7C7F23C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 5CGXBC5C7F27C8N | 5CGXBC7C7F23C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $54.18 | $29.70 |
| Family | Cyclone® V GX | 5CGXC7 (logic density tier) |
| Logic Elements (LE) | 77,000 | 149,500 |
| Adaptive Logic Modules (ALM) | 29,080 | — |
| Total Embedded Memory | 5,001,216 bits (4,884 Kbits usable) | — |
| Embedded Memory Blocks (M10K + MLAB) | 446 × M10K + 231 × MLAB (approx.) | — |
| 18 × 18 Multipliers | 364 | — |
| PLLs | 6 | Up to 8 |
| Global Clock Networks | 16 | Up to 16 |
| Transceivers | 6 × 3.125 Gbps (GX) | 6 channels, up to 3.125 Gbps |
| PCIe Hard IP | Yes (Gen1/Gen2) | — |
| Maximum User I/O | [DATA_NEEDED: maximum user I/O count] | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Node | 28 nm TSMC low-power | — |
| Package | 672-pin FBGA (F27, 27 mm × 27 mm) | 484-ball FBGA (F23) |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Operating Temperature | 0 °C to +85 °C (commercial, C8) | — |
| Configuration | JTAG (IEEE 1149.1) + Active Serial | — |
| RoHS Status | Compliant | Compliant |
| Series | — | Cyclone V GX |
| Embedded Memory Bits | — | 7,880,704 bits (~963 Kbytes) |
| Embedded 18x18 Multipliers | — | 312 |
| User I/O Pins | — | 240 |
| Process Technology | — | TSMC 28 nm low-power |
| Temperature Grade | — | Commercial (0C to 85C) |
| Speed Grade | — | 8 (slowest commercial) |
| Hard Memory Controllers | — | 2 |