5CGXBC5C7F27C8N vs 5CGXBC7C7F23C8N Comparación
Comparación detallada lado a lado de 5CGXBC5C7F27C8N por Intel y 5CGXBC7C7F23C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 5CGXBC5C7F27C8N | 5CGXBC7C7F23C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $54,18 | $29,70 |
| Family | Cyclone® V GX | 5CGXC7 (logic density tier) |
| Logic Elements (LE) | 77,000 | 149,500 |
| Adaptive Logic Modules (ALM) | 29,080 | — |
| Total Embedded Memory | 5,001,216 bits (4,884 Kbits usable) | — |
| Embedded Memory Blocks (M10K + MLAB) | 446 × M10K + 231 × MLAB (approx.) | — |
| 18 × 18 Multipliers | 364 | — |
| PLLs | 6 | Up to 8 |
| Global Clock Networks | 16 | Up to 16 |
| Transceivers | 6 × 3.125 Gbps (GX) | 6 channels, up to 3.125 Gbps |
| PCIe Hard IP | Yes (Gen1/Gen2) | — |
| Maximum User I/O | [DATA_NEEDED: maximum user I/O count] | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Node | 28 nm TSMC low-power | — |
| Encapsulado | 672-pin FBGA (F27, 27 mm × 27 mm) | 484-ball FBGA (F23) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Temperatura de funcionamiento | 0 °C to +85 °C (commercial, C8) | — |
| Configuration | JTAG (IEEE 1149.1) + Active Serial | — |
| Estado RoHS | Compliant | Compliant |
| Series | — | Cyclone V GX |
| Embedded Memory Bits | — | 7,880,704 bits (~963 Kbytes) |
| Embedded 18x18 Multipliers | — | 312 |
| User I/O Pins | — | 240 |
| Process Technology | — | TSMC 28 nm low-power |
| Temperature Grade | — | Commercial (0C to 85C) |
| Speed Grade | — | 8 (slowest commercial) |
| Hard Memory Controllers | — | 2 |