5CGXBC5C7F27C8N vs 5CGXBC7C7F23C8N Vergleich
Detaillierter Direktvergleich von 5CGXBC5C7F27C8N von Intel und 5CGXBC7C7F23C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 5CGXBC5C7F27C8N | 5CGXBC7C7F23C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $54,18 | $29,70 |
| Family | Cyclone® V GX | 5CGXC7 (logic density tier) |
| Logic Elements (LE) | 77,000 | 149,500 |
| Adaptive Logic Modules (ALM) | 29,080 | — |
| Total Embedded Memory | 5,001,216 bits (4,884 Kbits usable) | — |
| Embedded Memory Blocks (M10K + MLAB) | 446 × M10K + 231 × MLAB (approx.) | — |
| 18 × 18 Multipliers | 364 | — |
| PLLs | 6 | Up to 8 |
| Global Clock Networks | 16 | Up to 16 |
| Transceivers | 6 × 3.125 Gbps (GX) | 6 channels, up to 3.125 Gbps |
| PCIe Hard IP | Yes (Gen1/Gen2) | — |
| Maximum User I/O | [DATA_NEEDED: maximum user I/O count] | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Node | 28 nm TSMC low-power | — |
| Gehäuse | 672-pin FBGA (F27, 27 mm × 27 mm) | 484-ball FBGA (F23) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Betriebstemperatur | 0 °C to +85 °C (commercial, C8) | — |
| Configuration | JTAG (IEEE 1149.1) + Active Serial | — |
| RoHS-Status | Compliant | Compliant |
| Series | — | Cyclone V GX |
| Embedded Memory Bits | — | 7,880,704 bits (~963 Kbytes) |
| Embedded 18x18 Multipliers | — | 312 |
| User I/O Pins | — | 240 |
| Process Technology | — | TSMC 28 nm low-power |
| Temperature Grade | — | Commercial (0C to 85C) |
| Speed Grade | — | 8 (slowest commercial) |
| Hard Memory Controllers | — | 2 |