5CGXBC5C7F27C8N vs 5CGXBC9A6U19C7N Comparison

Detailed side-by-side comparison of 5CGXBC5C7F27C8N by Intel and 5CGXBC9A6U19C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 5CGXBC5C7F27C8N 5CGXBC9A6U19C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $54.18 $228.00
Family Cyclone® V GX Cyclone V GX
Logic Elements (LE) 77,000 —
Adaptive Logic Modules (ALM) 29,080 —
Total Embedded Memory 5,001,216 bits (4,884 Kbits usable) —
Embedded Memory Blocks (M10K + MLAB) 446 × M10K + 231 × MLAB (approx.) —
18 × 18 Multipliers 364 —
PLLs 6 6
Global Clock Networks 16 —
Transceivers 6 × 3.125 Gbps (GX) Integrated (per U19 484-FBGA variant)
PCIe Hard IP Yes (Gen1/Gen2) —
Maximum User I/O [DATA_NEEDED: maximum user I/O count] —
Core Voltage 1.1 V —
Process Node 28 nm TSMC low-power —
Package 672-pin FBGA (F27, 27 mm × 27 mm) 484-FBGA (U19, FineLine BGA)
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Operating Temperature 0 °C to +85 °C (commercial, C8) —
Configuration JTAG (IEEE 1149.1) + Active Serial —
RoHS Status Compliant Compliant
Logic Elements — 77000
Logic Array Blocks (LABs) — 29080
Total Registers — 301000
Embedded Memory (M9K blocks) — 14251008 bits (4,460 Kbits)
Number of Terminals — 484
Operating Supply Voltage — 1.1 V (core), per datasheet
Operating Temperature Range — 0°C to +85°C (commercial, C7)
Speed Grade — C7
Lead Free — Yes (N suffix)
Process Technology — TSMC 28 nm low-power

Datasheets & Resources

Browse All Products Create BOM Request Quote