5CGXBC9A6U19C7N - Cyclone V GX FPGA, 77K LE, 484-FBGA | Intel
MPN: 5CGXBC9A6U19C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $380 | $380.00 |
| 10 | $342 | $3,420.00 |
| 100 | $304 | $30,400.00 |
| 500 | $266 | $133,000.00 |
| 1,000 | $228 | $228,000.00 |
Drop-in alternatives for 5CGXBC9A6U19C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →5CGXBC9A6U19C7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V GX |
| Logic Elements | 77000 |
| Logic Array Blocks (LABs) | 29080 |
| Total Registers | 301000 |
| Embedded Memory (M9K blocks) | 14251008 bits (4,460 Kbits) |
| Package | 484-FBGA (U19, FineLine BGA) |
| Number of Terminals | 484 |
| Operating Supply Voltage | 1.1 V (core), per datasheet |
| Operating Temperature Range | 0°C to +85°C (commercial, C7) |
| Speed Grade | C7 |
| PLLs | 6 |
| Transceivers | Integrated (per U19 484-FBGA variant) |
| Lead Free | Yes (N suffix) |
| Mounting Type | Surface Mount (BGA) |
| Process Technology | TSMC 28 nm low-power |
| RoHS Status | Compliant |
5CGXBC9A6U19C7N Pin Configuration
| Pin A1 | IO — User IO ball; assign per Quartus Prime pin-planner (U19 484-BGA) |
| Pin A2 | IO — User IO ball; assign per Quartus Prime pin-planner |
| Pin B1 | VCC — Core/IO supply ball; see device datasheet for VCC rail mapping |
| Pin B2 | GND — Ground ball |
| Pin C1 | IO — User IO ball |
| Pin C2 | IO — User IO ball |
| Pin D1 | GXB_RX — Transceiver receive (ball assigned per U19 pin table) |
| Pin D2 | GXB_TX — Transceiver transmit (ball assigned per U19 pin table) |
| Pin E1 | CLKIN — Differential clock input pair |
| Pin E2 | CLKIN_n — Differential clock input (negative) |
| Pin F1 | VCCAUX — Auxiliary supply for IO and PLL |
| Pin F2 | VCCINT — Core 1.1 V supply |
| Pin G1 | CONFIG — Configuration (nCONFIG/nSTATUS) ball |
| Pin G2 | MSEL — Configuration mode select |
| Pin H1 | JTAG_TCK — JTAG test clock |
| Pin H2 | JTAG_TMS — JTAG test mode select |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CGXBC9A6U19C7N is suitable for 7 applications: Industrial Machine Vision, Factory Automation Controllers, Motor Control and Drive Front-Ends, Low-Cost PCIe Endpoint Cards, Video Bridging and Display Processing, Embedded Vision Pre-Processing, Industrial Serial-Link Aggregation.
Industrial Machine Vision
The 5CGXBC9A6U19C7N's 77,000 logic elements and 14,251,008 bits of M9K embedded memory make it a strong fit for industrial machine-vision pre-processing pipelines where images arrive over GigE Vision, CoaXPress (via external PHY), or USB3 Vision. The integrated multi-gigabit transceivers accept the high-speed serial image stream without an external PHY, reducing BOM cost; the variable-precision DSP blocks handle Bayer demosaicing and Sobel edge detection in parallel. With 301,000 registers, deep line buffers fit comfortably in the M9K blocks, and the 6 PLLs derive multiple pixel clocks from a single reference. This Cyclone V GX variant is preferred over Cyclone V E for vision systems because transceivers are mandatory for >1 Gbps image links.
Recommended
Factory Automation Controllers
Factory automation controllers benefit from the 5CGXBC9A6U19C7N's combination of deterministic logic, transceivers for industrial Ethernet protocols, and sufficient logic density for multi-axis motion control. The 77K LEs hold soft-core processor IPs (such as Nios II) plus custom motion-control state machines, while the on-chip memory absorbs axis setpoints and trajectory buffers. Designers place this part where EtherCAT, PROFINET, or SERCOS III master/slave stacks are implemented in FPGA fabric; the transceivers simplify PHY integration and reduce board area versus a discrete transceiver-plus-FPGA approach.
Recommended
Motor Control and Drive Front-Ends
For motor-control and variable-frequency drive front-ends, the 5CGXBC9A6U19C7N provides the necessary PWM generation, encoder-decoder logic, and serial links in a single device. The 6 PLLs synchronize PWM switching frequencies up to several hundred kHz with current-sampling ADCs, while the embedded M9K blocks hold field-oriented control state variables. The integrated transceivers handle RS-485, CAN, or industrial Ethernet side-channels for drive-parameter updates. The 77K-LE density is typically adequate for 2-4 axis drives; engineers needing more axes should consider 5CGXBC7-tier devices.
Recommended
Low-Cost PCIe Endpoint Cards
The 5CGXBC9A6U19C7N supports PCIe Gen2 endpoint implementations through its hard PCIe controller blocks, eliminating the need for an external bridge chip. In a typical 1-lane configuration, the FPGA exposes user registers or DMA engines over PCIe to a host CPU; this suits low-cost data-acquisition cards, FPGA-based coprocessors, and protocol-analyzer cards. The 77K LEs implement PCIe transaction layer plus application logic in a single chip, while the 484-ball BGA exposes the PCIe edge connector signals and additional user IOs for companion ADCs/DACs. For higher-lane-count designs, the 5CGXBC7-tier F27/F31 parts are recommended.
Recommended
Video Bridging and Display Processing
Video bridging applications such as HDMI-to-SDI, SDI-to-LVDS, and dual-camera stitching leverage the 5CGXBC9A6U19C7N's transceivers for SDI input/output, M9K memory for line buffers, and DSP blocks for color-space conversion. At SD/HD/3G-SDI rates up to 2.97 Gbps, the on-chip transceivers accept and emit serial video directly, while the 14,251,008-bit memory budget accommodates multi-line buffering for format conversions. Designers use the 6 PLLs to derive the various pixel clocks for simultaneous input and output at different resolutions. For 4K/UHD bridging, the higher-density 5CGXBC7-tier devices are typically required.
Recommended
Embedded Vision Pre-Processing
Embedded vision pre-processing in drones, robotics, and surveillance edge devices benefits from the 5CGXBC9A6U19C7N's low-power 28 nm process, on-chip transceivers for camera links, and DSP blocks for early-stage vision algorithms. Common workloads - lens distortion correction, histogram equalization, and Haar/Harris corner detection - map efficiently onto the 18x18 multipliers and M9K memory. The 77K-LE density fits mid-sized pipelines up to about 720p at 60 fps; the integrated transceivers accept MIPI-CSI2 (with external bridge) or GigE Vision streams. For battery-powered or thermally constrained designs, the 28 nm low-power process keeps thermal envelope manageable.
Recommended
Industrial Serial-Link Aggregation
Industrial serial-link aggregation - merging multiple RS-485, CAN, or industrial Ethernet channels into a single upstream fiber or Ethernet uplink - is a natural fit for the 5CGXBC9A6U19C7N. The transceivers aggregate multi-protocol industrial traffic, the M9K blocks buffer packet queues, and the 77K LEs implement protocol-conversion soft cores. The 484-ball U19 package is sufficient for designs aggregating 4-8 channels; designs with more channels or requiring 10G uplinks should consider the F27 or F31 packaged 5CGXBC7 variants. The commercial temperature range suits indoor control cabinets.
Recommended
Recommended Products Summary
Engineering reference data for 5CGXBC9A6U19C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CGXBC7C7U19C8N | 5CGXBC7C6U19C7N | 5CGXBC5C7U19C8N | 5CGXBC5C7F27C8N | 5CGTFD9A5U19A7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (U19) | 484-FBGA (U19) - same | 484-FBGA (U19) - same | 484-FBGA (U19) - same | 672-FBGA (F27) - differs | 484-FBGA (U19) - same |
| Logic Elements | 77000 | 149500 | 149500 | 85000 (approx, 5CGXC5 tier) | 85000 (approx, 5CGXC5 tier) | 301000 LEs (Cyclone V GT 5CGTFD9 tier) |
| Embedded Memory | 14,251,008 bits | 27,440,640 bits (5CGXBC7 tier) | 27,440,640 bits | varies by tier; smaller than 5CGXBC9 | varies by tier | approximately 19,753,472 bits (5CGTFD9 tier) |
| Speed Grade | C7 (commercial) | C8 (industrial) | C7 (commercial) - matches | C8 (industrial) | C8 (industrial) | A7 (automotive) |
| PLLs | 6 | 7 | 7 | 6 | 6 | 8 (Cyclone V GT) |
| Transceivers | Integrated (per U19 484-BGA) | Integrated (more channels in F31 package) | Integrated | Integrated | Integrated | Integrated (Cyclone V GT) |
| Operating Temperature | 0°C to +85°C (commercial) | -40°C to +100°C (industrial) | 0°C to +85°C (commercial) - matches | -40°C to +100°C (industrial) | -40°C to +100°C (industrial) | -40°C to +125°C (automotive) |
| Family / Tier | Cyclone V GX / 5CGXBC9 | Cyclone V GX / 5CGXBC7 | Cyclone V GX / 5CGXBC7 | Cyclone V GX / 5CGXBC5 | Cyclone V GX / 5CGXBC5 | Cyclone V GT / 5CGTFD9 |
Key Differentiators
- 77K-LE 5CGXC9 logic tier with integrated transceivers in 484-ball U19 BGA (vs 5CGXBC5C7U19C8N)
- U19 484-ball package enables smaller footprint than F27/F31 BGA options (vs 5CGXBC7D7F31C8N)
- C7 commercial speed grade balances performance and cost (vs 5CGXBC7C7U19C8N (C8 industrial))
Design Notes
The 484-ball U19 BGA at full transceiver utilization can dissipate 3-5 W, requiring PCB thermal relief via inner ground planes and thermal vias under the exposed pad. Estimated: with 28 nm Cyclone V GX static current of approximately 1-2 W plus dynamic power scaling with toggle rate, designers should simulate with the Quartus Prime PowerPlay tool and budget thermal headroom for commercial 0°C to +85°C ambient operation. For industrial deployments, select the 'I7' industrial variant instead of the 'C7' commercial speed/temperature designator.
BGA breakout routing on the 484-ball U19 package requires a high-layer-count PCB (typically 8+ layers with HDI micro-vias). The transceiver balls must be routed with 100 Ω differential impedance to the edge connector or external PHY; signal-integrity simulation is recommended for data rates above 1 Gbps. Decoupling capacitors should be placed as close as possible to each VCC/VCCAUX/GND ball pair, following the Intel Cyclone V GX device pin-table's recommended decoupling scheme.
Do not assume 5CGXC5-tier or 5CGXBC7-tier MPNs share a pin-for-pin ball map with 5CGXBC9-tier devices even when the package code (U19) matches - transceiver channel count and IO bank assignments differ between logic-density tiers. Always run the design through Quartus Prime pin-planner with the target device's exact MPN before tape-out. Also verify configuration mode (MSEL) strapping against the desired configuration scheme (AS, PS, JTAG, or FPP) per the Cyclone V GX configuration handbook.
Compliance Information
RoHS compliance and lead-free N suffix per Altera/Intel product page. Halogen-free status not explicitly stated in verified data. Not AEC-Q100 qualified - choose A7 automotive-tier MPNs (e.g. 5CGTFD9A5U19A7N) for automotive.
