5CGXBC5C7F27C8N vs 5CGXBC9A6U19C7N Vergleich
Detaillierter Direktvergleich von 5CGXBC5C7F27C8N von Intel und 5CGXBC9A6U19C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 5CGXBC5C7F27C8N | 5CGXBC9A6U19C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $54,18 | $228,00 |
| Family | Cyclone® V GX | Cyclone V GX |
| Logic Elements (LE) | 77,000 | — |
| Adaptive Logic Modules (ALM) | 29,080 | — |
| Total Embedded Memory | 5,001,216 bits (4,884 Kbits usable) | — |
| Embedded Memory Blocks (M10K + MLAB) | 446 × M10K + 231 × MLAB (approx.) | — |
| 18 × 18 Multipliers | 364 | — |
| PLLs | 6 | 6 |
| Global Clock Networks | 16 | — |
| Transceivers | 6 × 3.125 Gbps (GX) | Integrated (per U19 484-FBGA variant) |
| PCIe Hard IP | Yes (Gen1/Gen2) | — |
| Maximum User I/O | [DATA_NEEDED: maximum user I/O count] | — |
| Core Voltage | 1.1 V | — |
| Process Node | 28 nm TSMC low-power | — |
| Gehäuse | 672-pin FBGA (F27, 27 mm × 27 mm) | 484-FBGA (U19, FineLine BGA) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Betriebstemperatur | 0 °C to +85 °C (commercial, C8) | — |
| Configuration | JTAG (IEEE 1149.1) + Active Serial | — |
| RoHS-Status | Compliant | Compliant |
| Logic Elements | — | 77000 |
| Logic Array Blocks (LABs) | — | 29080 |
| Total Registers | — | 301000 |
| Embedded Memory (M9K blocks) | — | 14251008 bits (4,460 Kbits) |
| Number of Terminals | — | 484 |
| Betriebsversorgungsspannung | — | 1.1 V (core), per datasheet |
| Betriebstemperaturbereich | — | 0°C to +85°C (commercial, C7) |
| Speed Grade | — | C7 |
| Lead Free | — | Yes (N suffix) |
| Process Technology | — | TSMC 28 nm low-power |