5CGXBC9A6U19C7N vs 5CGXBC5C7F27C8N Comparison
Detailed side-by-side comparison of 5CGXBC9A6U19C7N by Intel and 5CGXBC5C7F27C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 5CGXBC9A6U19C7N | 5CGXBC5C7F27C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $228.00 | $54.18 |
| Family | Cyclone V GX | Cyclone® V GX |
| Logic Elements | 77000 | — |
| Logic Array Blocks (LABs) | 29080 | — |
| Total Registers | 301000 | — |
| Embedded Memory (M9K blocks) | 14251008 bits (4,460 Kbits) | — |
| Package | 484-FBGA (U19, FineLine BGA) | 672-pin FBGA (F27, 27 mm × 27 mm) |
| Number of Terminals | 484 | — |
| Operating Supply Voltage | 1.1 V (core), per datasheet | — |
| Operating Temperature Range | 0°C to +85°C (commercial, C7) | — |
| Speed Grade | C7 | — |
| PLLs | 6 | 6 |
| Transceivers | Integrated (per U19 484-FBGA variant) | 6 × 3.125 Gbps (GX) |
| Lead Free | Yes (N suffix) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Process Technology | TSMC 28 nm low-power | — |
| RoHS Status | Compliant | Compliant |
| Logic Elements (LE) | — | 77,000 |
| Adaptive Logic Modules (ALM) | — | 29,080 |
| Total Embedded Memory | — | 5,001,216 bits (4,884 Kbits usable) |
| Embedded Memory Blocks (M10K + MLAB) | — | 446 × M10K + 231 × MLAB (approx.) |
| 18 × 18 Multipliers | — | 364 |
| Global Clock Networks | — | 16 |
| PCIe Hard IP | — | Yes (Gen1/Gen2) |
| Maximum User I/O | — | [DATA_NEEDED: maximum user I/O count] |
| Core Voltage | — | 1.1 V |
| Process Node | — | 28 nm TSMC low-power |
| Operating Temperature | — | 0 °C to +85 °C (commercial, C8) |
| Configuration | — | JTAG (IEEE 1149.1) + Active Serial |