5CSEBA2U23A7N vs 5CSEBA4U19A7N Comparison
Detailed side-by-side comparison of 5CSEBA2U23A7N by Intel and 5CSEBA4U19A7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 5CSEBA2U23A7N | 5CSEBA4U19A7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $99.50 | $99.90 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| MPN Code | 5CSEBA2U23A7N (Cyclone V SE A2, U23 package) | — |
| Logic Elements | 25,000 LE | 40 K |
| Hard Processor System (HPS) | Dual-core ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 700 MHz | — |
| Process Technology | 28 nm low-power | — |
| User I/O | 188 | 161 |
| Package | 672-UBGA (23x23 mm) | 484-UBGA (U19), 19x19 mm, 1.0 mm pitch |
| Speed Grade | 7 | — |
| Temperature Grade | A (Commercial, 0C to +85C) [DATA_NEEDED: exact junction range] | — |
| RoHS Status | Compliant (per ampheo listing) | Compliant |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL Level | [DATA_NEEDED: MSL level] | 3 (168 hours) |
| Operating Voltage (Core) | 1.1 V (typical FPGA core, multi-rail HPS) | — |
| Configuration Scheme | HPS-boot of FPGA fabric via configuration QSPI | — |
| Embedded Memory | M10K blocks (count [DATA_NEEDED: exact M10K/M20K count]) | 3.4 Mbits (M9K) |
| DSP Blocks | Variable-precision DSP (count [DATA_NEEDED: exact count]) | — |
| PLLs | Fractional PLLs (count [DATA_NEEDED: exact PLL count]) | [DATA_NEEDED: PLL count] |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Adaptive Logic Modules | — | [DATA_NEEDED: ALM count] |
| DSP Blocks (18x18 Multipliers) | — | 224 |
| HPS Maximum Application Clock | — | 925 MHz |
| Memory Interfaces | — | DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA |
| Operating Junction Temperature | — | -40C to +125C (automotive) / -40C to +100C (industrial) |
| Process Node | — | TSMC 28 nm low-power |
| Core Voltage | — | 1.1 V (typical) |