5CSEBA2U23A7N - Cyclone V SE SoC FPGA 25K LE | Intel / Altera
MPN: 5CSEBA2U23A7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $138.37 | $138.37 |
| 10 | $132.5 | $1,325.00 |
| 100 | $122 | $12,200.00 |
| 500 | $110 | $55,000.00 |
| 1,000 | $99.5 | $99,500.00 |
Drop-in alternatives for 5CSEBA2U23A7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
5CSEBA2U19A7N
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View Datasheet β5CSEMA2U23I7N
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5CSEMA4U23I7N
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5CSEBA5U23I7N
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5CSEBA2U19I7SN
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View Datasheet β5CSEBA2U23A7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| MPN Code | 5CSEBA2U23A7N (Cyclone V SE A2, U23 package) |
| Logic Elements | 25,000 LE |
| Hard Processor System (HPS) | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 700 MHz |
| Process Technology | 28 nm low-power |
| User I/O | 188 |
| Package | 672-UBGA (23x23 mm) |
| Speed Grade | 7 |
| RoHS Status | Compliant (per ampheo listing) |
| Mounting Type | Surface Mount (BGA) |
| Operating Voltage (Core) | 1.1 V (typical FPGA core, multi-rail HPS) |
| Configuration Scheme | HPS-boot of FPGA fabric via configuration QSPI |
5CSEBA2U23A7N 672-ubga (23x23 mm) Pin Configuration Guide
Complete pinout information for 5CSEBA2U23A7N (672-ubga (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA2U23A7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA2U23A7N is suitable for 6 applications: Industrial Motor Control and Drives, Machine Vision and Image Pre-Processing, Broadcast Video Processing, Industrial IoT Edge Gateway, Medical Imaging Front-End, Smart Energy / Sub-Station Controller.
Industrial Motor Control and Drives
The 5CSEBA2U23A7N is well-suited for industrial motor-control platforms because the FPGA fabric executes deterministic PWM generation, encoder feedback, and field-weakening math with sub-microsecond latency while the dual-core ARM Cortex-A9 HPS runs vector-control loops, torque/flux estimators, and the EtherCAT/CANopen stack. The 25K logic elements accommodate up to three-axis FOC plus protection logic, and the DDR3 controller on the HPS handles logging and parameter storage. For factory-automation deployments, the A7N commercial grade covers 0-85C cabinet environments; for harsh sites, the I7N variant on the same U672 footprint extends range to -40C to +100C.
Recommended
Machine Vision and Image Pre-Processing
In machine-vision cameras and AOI systems, the 5CSEBA2U23A7N's FPGA fabric absorbs high-throughput pixel pipelines (MIPI CSI-2, LVDS, sub-LVDS, parallel CCD) and runs pre-processing kernels such as demosaicing, gamma correction, and Bayer-to-YUV conversion in hardware. The HPS Cortex-A9 then hosts Linux with OpenCV, performs defect-detection inference, and pushes results over GigE Vision or USB3 Vision. The 25K LE budget fits typical 1080p60 pipelines, and the HPS-side USB 2.0 + EMAC simplify peripheral integration for compact embedded vision modules.
Recommended
Broadcast Video Processing
Broadcast video appliances using the 5CSEBA2U23A7N benefit from the FPGA's parallel DSP blocks for SDI de/embedding, color-space conversion (REC.709, REC.2020), and audio shuffling at full broadcast rates, while the HPS runs control software, web interfaces, and SNMP. The U672 package exposes enough LVDS pairs for 3G-SDI I/O and the DDR3 controller on the HPS handles frame-buffer memory. Software-defined broadcast upgrades can be deployed over the configuration QSPI flash without changing hardware, extending product lifecycle in studio and OB-truck environments.
Recommended
Industrial IoT Edge Gateway
The 5CSEBA2U23A7N fits industrial IoT gateway designs where the HPS Cortex-A9 runs a secure Linux stack (OP-TEE, secure boot, IPsec/DTLS) while the FPGA fabric aggregates legacy fieldbuses (Modbus RTU/TCP, PROFIBUS, CAN, RS-485) and pre-processes sensor data before publishing to MQTT brokers. The dual-core HPS handles encryption (AES/SHA) and TLS handshakes with cloud platforms, while the fabric accelerates deterministic protocol timers. Industrial temperature variants (I7N) of the same U672 package extend deployment to outdoor enclosures and factory floors with wide thermal swings.
Recommended
Medical Imaging Front-End
Ultrasound, endoscopy, and patient-monitoring front-ends use the 5CSEBA2U23A7N to digitize transducer data in the FPGA fabric (variable-precision DSP for beamforming), then forward beamformed streams to the HPS for image reconstruction, DICOM packaging, and HL7 messaging. The 700 MHz Cortex-A9 with NEON accelerates JPEG2000 and H.264 compression for telemedicine transmission. Medical designs must implement IEC 60601 isolation externally and verify EMI/EMC compliance; the A7N commercial grade is sufficient for controlled clinical environments.
Recommended
Smart Energy / Sub-Station Controller
Sub-station automation and smart-energy controllers using the 5CSEBA2U23A7N leverage the FPGA fabric for IEC 61850 GOOSE message timestamping at 4 kHz, sampled-value (SV) processing, and parallel protection logic, while the HPS runs the IEC 61850 station-bus stack, SCADA protocols, and analytics. The wide temperature range of the I7N variant on the same U672 footprint is required for sub-station cabinets from -40C to +70C. Hardware crypto on the HPS (AES, SHA, PKA) secures grid communications per NERC CIP requirements.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA2U23A7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA2U19A7N | 5CSEMA2U23I7N | 5CSEMA4U23I7N | 5CSEBA5U23I7N | 5CSEBA2U19I7SN |
|---|---|---|---|---|---|---|
| Package | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U19, 19x19 mm) | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U19, 19x19 mm) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC |
| Logic Elements | 25,000 LE | 25,000 LE | 25,000 LE | ~40,000 LE (+60%) | ~85,000 LE (+240%) | 25,000 LE |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore |
| Temperature Grade | Commercial (A7N, 0C to +85C) | Commercial (A7N) | Industrial (I7N, -40C to +100C) | Industrial (I7N) | Industrial (I7N) | Industrial (I7N) |
| Process / Core Voltage | 28 nm / 1.1 V typical | 28 nm / 1.1 V | 28 nm / 1.1 V | 28 nm / 1.1 V | 28 nm / 1.1 V | 28 nm / 1.1 V |
| Approx. Unit Price (qty 1, as of 2026-09-06) | $138.37 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Lowest-density Cyclone V SE SoC variant for cost-sensitive designs (vs 5CSEBA5U23I7N)
- Commercial A7N grade at lower cost than industrial I7N (vs 5CSEMA2U23I7N)
- Dual-core Cortex-A9 HPS at 700 MHz on a single SoC (vs 5CGXBC7C7F23C8N (Cyclone V GX FPGA without HPS))
Design Notes
Cyclone V SE SoC devices use a multi-rail supply scheme: VCCINT (core, typically 1.1 V), VCCAUX/VAUX, VCCPD (I/O pre-drivers), per-bank VCCIO, plus HPS-specific VCC_HPS, VCC_HPS_IO, DDR_VTT. Decouple each rail with 0.1 uF + bulk ceramic near each BGA pin group; the HPS core rail in particular needs a 22 uF + 0.1 uF pair for boot inrush. Use the Cyclone V SE Pin Connection Guidelines to identify every power pin and recommended bulk/cap values. Power sequencing must follow the device datasheet - failure to sequence HPS rails can prevent boot.
Estimated: at full utilization (FPGA fabric 80% toggle rate, HPS at 700 MHz dual-core), the 672-UBGA package dissipates approximately 5-8 W. The U23 23x23 mm BGA has a typical theta_JA around 15 C/W with sufficient PCB copper pour (8-layer, 2 oz inner layers, dedicated thermal via array under the exposed die pad). For fan-less enclosures, attach a heatsink with thermal interface material to the package top; for sealed IP67 enclosures, derate to I7N industrial grade which has higher thermal margin. Always simulate in Quartus Prime PowerPlay early in the design cycle.
The 672-UBGA at 0.8 mm or 1.0 mm pitch (verify from device-specific package drawing) requires HDI PCB stack-up with microvias and 1 oz finished copper on outer layers. Route DDR3 traces from the HPS controller as fly-by topology with matched lengths (within +/- 25 mil on byte lanes); use the Cyclone V SE External Memory Interface Handbook for the exact tDVBP/tDS constraints. Keep HPS clock traces short and reference continuous ground pour; place the 25 MHz HPS reference crystal within 200 mils of the CLK1 pins with a guard ring.
Common pitfalls on Cyclone V SE SoC designs include: (1) assuming the FPGA fabric boots automatically - the HPS must boot first from QSPI/NAND/SD and load the fabric bitstream via the HPS-to-FPGA bridge; (2) forgetting to configure the HPS pin multiplexing - most HPS pins have up to 8 alternate functions set in System Manager; (3) under-budgeting M10K blocks - each EMIF interface and soft CPU implementation consumes M10K; (4) missing BSDL/IBIS models for production test - generate via Quartus Prime before tape-out. Always validate boot via the SoC EDS prebuilt U-Boot image on hardware before custom firmware.
Compliance Information
RoHS compliant and lead-free per ampheo listing. REACH, halogen-free, and conflict-mineral status should be requested from Intel product compliance portal. Not AEC-Q100 qualified - the SE family is not automotive-grade; for automotive, see Cyclone V SE Auto variants.
