5CSEBA4U19A7N - Cyclone V SE SoC FPGA, 40K LE, 484-UBGA | Intel
MPN: 5CSEBA4U19A7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $147.21 | $147.21 |
| 10 | $138.5 | $1,385.00 |
| 100 | $124.8 | $12,480.00 |
| 500 | $112.4 | $56,200.00 |
| 1,000 | $99.9 | $99,900.00 |
Drop-in alternatives for 5CSEBA4U19A7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA5U19A7N
✅ Drop-In📋 Reference alternative (not in catalog)
5CSEBA2U19A7N
✅ Drop-In✓ In Stock
$92.1 / Unit
View Datasheet →5CSEBA2U23A7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$99.5 / Unit
View Datasheet →5CGTFD9A5U19A7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$241.5 / Unit
View Datasheet →5CSEBA4U19A7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Logic Elements | 40 K |
| Embedded Memory | 3.4 Mbits (M9K) |
| DSP Blocks (18x18 Multipliers) | 224 |
| HPS Maximum Application Clock | 925 MHz |
| Memory Interfaces | DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA |
| User I/O | 161 |
| Package | 484-UBGA (U19), 19x19 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount (BGA) |
| Operating Junction Temperature | -40C to +125C (automotive) / -40C to +100C (industrial) |
| Process Node | TSMC 28 nm low-power |
| Core Voltage | 1.1 V (typical) |
| RoHS Status | Compliant |
| MSL Level | 3 (168 hours) |
5CSEBA4U19A7N 484-ubga (u19), 19x19 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for 5CSEBA4U19A7N (484-ubga (u19), 19x19 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA4U19A7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA4U19A7N is suitable for 6 applications: Industrial Motor Control, Machine Vision Edge Nodes, Automotive Driver Assistance (ADAS), Medical Imaging Preprocessing, Rugged Military Communications, Smart HMI Panels.
Industrial Motor Control
The 5CSEBA4U19A7N is well-suited for industrial motor controllers because its dual ARM Cortex-A9 MPCore cores run Linux or RTOS-based supervisory loops while the 40K-logic-element Cyclone V FPGA fabric accelerates deterministic current-loop and PWM generation. The hard DDR3 controller with ECC supports 32-bit memory transactions, and the 161 user I/O pins provide flexible encoder, resolver, and gate-driver interfaces for multi-axis drives.
Recommended
Machine Vision Edge Nodes
For machine vision edge nodes, the 5CSEBA4U19A7N pairs its dual 925 MHz ARM cores for image pre-processing and network connectivity with FPGA fabric acceleration for image-pipeline operations. The 224 18x18 multipliers deliver DSP bandwidth for convolution and Sobel filters, while the 3.4 Mbit embedded memory provides on-chip line buffers reducing external DDR bandwidth. Power consumption stays low thanks to the 28 nm low-power process.
Recommended
Automotive Driver Assistance (ADAS)
In ADAS sensor-fusion appliances, the 5CSEBA4U19A7N automotive-grade operating range to +125C junction and its AEC-Q-style Cyclone V qualification path make it a strong host for camera and radar pre-processing. The ARM Cortex-A9 cores run perception stacks while the FPGA fabric implements low-latency object detection pipelines. Hardware SEU mitigation via ECC memory and CRC scrubbing is supported in the Quartus tool flow.
Recommended
Medical Imaging Preprocessing
The 5CSEBA4U19A7N enables medical imaging subsystems to combine ARM Cortex-A9 host processing for DICOM handling and user interface with FPGA-accelerated FIR filtering and pixel-pipeline operations. The 161 user I/O accommodates Camera Link or LVDS camera interfaces, and the hard DDR3 controller manages frame-buffer memory. The 484-UBGA package supports the small form factors required for portable and cart-based equipment.
Recommended
Rugged Military Communications
For ruggedized tactical radios, the 5CSEBA4U19A7N provides ARM Cortex-A9 cores for protocol stack management and the Cyclone V FPGA fabric for modem PHY and crypto-acceleration offload. The wide industrial temperature range, BGA package reliability under shock and vibration, and DDR3 controller with ECC for high-altitude radiation hardening via software scrubbing make it well-suited to defense applications.
Recommended
Smart HMI Panels
Smart HMI panels benefit from the 5CSEBA4U19A7N's dual ARM Cortex-A9 cores running Linux-based GUI frameworks like Qt alongside FPGA-accelerated display refresh, touch processing, and backlight control. The 3.4 Mbit embedded memory can buffer frame layers, and the 161 user I/O interfaces easily to LVDS or RGB LCD panels, capacitive touch controllers, and industrial fieldbus peripherals in panel-mount enclosures.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA4U19A7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA5U19A7N | 5CSEBA2U19A7N | 5CSEBA2U23A7N | 5CGTFD9A5U19A7N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-UBGA (U19), 19x19 mm | 484-UBGA (U19), 19x19 mm - same | 484-UBGA (U19), 19x19 mm - same | 484-UBGA (U23), 23x23 mm - larger | 484-UBGA (U19), 19x19 mm - same |
| Logic Elements | 40K | 85K (+112%) | 25K (-38%) | 25K (-38%) | 300K (+650%) |
| DSP Blocks (18x18 Multipliers) | 224 | 350 | 66 | 66 | [DATA_NEEDED] |
| Embedded Memory | 3.4 Mbits | 4.6 Mbits | 1.6 Mbits | 1.6 Mbits | [DATA_NEEDED] |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore - same | Dual ARM Cortex-A9 MPCore - same | Dual ARM Cortex-A9 MPCore - same | Dual ARM Cortex-A9 MPCore - same |
| Maximum HPS Clock | 925 MHz | 925 MHz - same | 925 MHz - same | 925 MHz - same | 925 MHz - same |
| Memory Controller | DDR3/DDR3L/LPDDR2 with ECC | DDR3/DDR3L/LPDDR2 with ECC - same | DDR3/DDR3L/LPDDR2 with ECC - same | DDR3/DDR3L/LPDDR2 with ECC - same | DDR3/DDR3L/LPDDR2 with ECC - same |
Key Differentiators
- Higher DSP density than lower-tier Cyclone V SE variants (vs 5CSEBA2U19A7N)
- Smaller package footprint than U23 alternatives (vs 5CSEBA2U23A7N)
- Cost-optimized versus higher-density Cyclone V SE A5 (vs 5CSEBA5U19A7N)
Design Notes
The 484-UBGA package uses a 1.0 mm ball pitch, which is at the threshold of standard 4-mil dry-film PCB manufacturing. Use laser-drilled microvias (4-6 mil capture pads, 8-10 mil drill) and HDI stack-ups with at least 1-2-1 or 2-4-2 build-up layers on the top and bottom. Escape routing on the top layer should fan-out to break-out vias on a 1.2 mm grid, with the remaining traces routed on inner signal layers.
Estimated: at typical industrial SoC FPGA utilization of 60% logic, 50% DSP, and 100% HPS at 925 MHz, the 5CSEBA4U19A7N draws approximately 4-6 W from the 1.1 V core rail. Use a 4-layer PCB with a dedicated 1.1 V plane; place 0402 0.1 uF X7R decoupling caps within 100 mil of every VCC/VCCIO ball pair, plus 10 uF bulk caps every 5-8 mm along the power plane.
The 484-UBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 12-15 C/W on a JEDEC 4-layer test board. At 5 W dissipation this yields a 60-75 C rise above ambient, which is fine for industrial applications but may require a heat spreader or forced airflow for automotive +125C junction operation. Use the Quartus PowerPlay early power estimator before committing to a cooling solution.
Do not assume that the same bitstream works across A4 and A5 family variants despite the identical U19 package footprint. The 5CSEBA4U19A7N requires a Quartus Prime compilation targeting the 40K-LE density, and migrating to A5 requires a recompile with the larger device selected. Mixing part numbers across a single production panel can cause configuration failures that are difficult to diagnose in the field.
Compliance Information
RoHS and REACH compliance confirmed on Intel Cyclone V family datasheet. AEC-Q100 grade availability is part-number dependent; check -I7N / -I7SN / -A7N suffixes for industrial or automotive temperature grades. Cyclone V SoC FPGAs are manufactured on a TSMC 28 nm low-power process.
