5CSEBA4U19C8N vs 5CSEBA4U19A7N Comparison

Detailed side-by-side comparison of 5CSEBA4U19C8N by Intel and 5CSEBA4U19A7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 5CSEBA4U19C8N 5CSEBA4U19A7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $54.75 $99.90
Family Cyclone V SE SoC FPGA Cyclone V SE SoC FPGA
Logic Elements 40K 40 K
Hard Processor System Dual ARM Cortex-A9 MPCore with CoreSight Dual ARM Cortex-A9 MPCore with CoreSight
HPS Maximum Frequency 600 MHz —
FPGA Fabric Speed Grade -8 —
Package 484-UBGA (19x19 mm) 484-UBGA (U19), 19x19 mm, 1.0 mm pitch
Operating Temperature 0C to +85C (commercial) —
Process Technology TSMC 28nm low-power —
User I/O Count 161 —
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
RoHS Status Compliant Compliant
Lead-Free Yes —
MSL Level 3 (168 hours) 3 (168 hours)
Supply Voltage (Core) [DATA_NEEDED: VCC core voltage] —
DSP Blocks [DATA_NEEDED: number of DSP blocks] —
Embedded Memory (M10K) [DATA_NEEDED: M10K block count] —
Transceivers None (SE variant - no high-speed transceivers) —
Configuration Method Serial (EPCS) and Parallel —
Adaptive Logic Modules — [DATA_NEEDED: ALM count]
Embedded Memory — 3.4 Mbits (M9K)
DSP Blocks (18x18 Multipliers) — 224
PLLs — [DATA_NEEDED: PLL count]
HPS Maximum Application Clock — 925 MHz
Memory Interfaces — DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA
User I/O — 161
Operating Junction Temperature — -40C to +125C (automotive) / -40C to +100C (industrial)
Process Node — TSMC 28 nm low-power
Core Voltage — 1.1 V (typical)

Datasheets & Resources

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