5CSEBA4U19C8N vs 5CSEBA4U19A7N Comparaison
Comparaison détaillée côte à côte de 5CSEBA4U19C8N par Intel et 5CSEBA4U19A7N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
5CSEBA4U19C8N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U19C8N ✓ ActifComparaison des spécifications
| Paramètre | 5CSEBA4U19C8N | 5CSEBA4U19A7N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $54,75 | $99,90 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Logic Elements | 40K | 40 K |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 600 MHz | — |
| FPGA Fabric Speed Grade | -8 | — |
| Boîtier | 484-UBGA (19x19 mm) | 484-UBGA (U19), 19x19 mm, 1.0 mm pitch |
| Température de fonctionnement | 0C to +85C (commercial) | — |
| Process Technology | TSMC 28nm low-power | — |
| User I/O Count | 161 | — |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA) |
| Statut RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Niveau MSL | 3 (168 hours) | 3 (168 hours) |
| Supply Voltage (Core) | [DATA_NEEDED: VCC core voltage] | — |
| DSP Blocks | [DATA_NEEDED: number of DSP blocks] | — |
| Embedded Memory (M10K) | [DATA_NEEDED: M10K block count] | — |
| Transceivers | None (SE variant - no high-speed transceivers) | — |
| Configuration Method | Serial (EPCS) and Parallel | — |
| Adaptive Logic Modules | — | [DATA_NEEDED: ALM count] |
| Embedded Memory | — | 3.4 Mbits (M9K) |
| DSP Blocks (18x18 Multipliers) | — | 224 |
| PLLs | — | [DATA_NEEDED: PLL count] |
| HPS Maximum Application Clock | — | 925 MHz |
| Memory Interfaces | — | DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA |
| User I/O | — | 161 |
| Température de jonction en fonctionnement | — | -40C to +125C (automotive) / -40C to +100C (industrial) |
| Process Node | — | TSMC 28 nm low-power |
| Core Voltage | — | 1.1 V (typical) |