5CSEBA4U19C8N vs 5CSEBA4U19A7N Vergleich

Detaillierter Direktvergleich von 5CSEBA4U19C8N von Intel und 5CSEBA4U19A7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 5CSEBA4U19C8N 5CSEBA4U19A7N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $54,75 $99,90
Family Cyclone V SE SoC FPGA Cyclone V SE SoC FPGA
Logic Elements 40K 40 K
Hard Processor System Dual ARM Cortex-A9 MPCore with CoreSight Dual ARM Cortex-A9 MPCore with CoreSight
HPS Maximum Frequency 600 MHz —
FPGA Fabric Speed Grade -8 —
Gehäuse 484-UBGA (19x19 mm) 484-UBGA (U19), 19x19 mm, 1.0 mm pitch
Betriebstemperatur 0C to +85C (commercial) —
Process Technology TSMC 28nm low-power —
User I/O Count 161 —
Montageart Surface Mount (BGA) Surface Mount (BGA)
RoHS-Status Compliant Compliant
Lead-Free Yes —
MSL-Level 3 (168 hours) 3 (168 hours)
Supply Voltage (Core) [DATA_NEEDED: VCC core voltage] —
DSP Blocks [DATA_NEEDED: number of DSP blocks] —
Embedded Memory (M10K) [DATA_NEEDED: M10K block count] —
Transceivers None (SE variant - no high-speed transceivers) —
Configuration Method Serial (EPCS) and Parallel —
Adaptive Logic Modules — [DATA_NEEDED: ALM count]
Embedded Memory — 3.4 Mbits (M9K)
DSP Blocks (18x18 Multipliers) — 224
PLLs — [DATA_NEEDED: PLL count]
HPS Maximum Application Clock — 925 MHz
Memory Interfaces — DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA
User I/O — 161
Betriebs-Sperrschichttemperatur — -40C to +125C (automotive) / -40C to +100C (industrial)
Process Node — TSMC 28 nm low-power
Core Voltage — 1.1 V (typical)

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