5CSEBA4U23C7SN vs 5CSEBA4U23C8SN Comparison

Detailed side-by-side comparison of 5CSEBA4U23C7SN by Intel and 5CSEBA4U23C8SN by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 5CSEBA4U23C7SN 5CSEBA4U23C8SN
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $18.20 $15.95
Family Cyclone V SE SoC FPGA —
Device Logic Elements 40,000 —
Hard Processor System Dual-core ARM Cortex-A9 MPCore with CoreSight —
HPS Maximum Frequency 800 MHz —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory (Kbits) 2,460 —
DSP Blocks (18x18) 112 —
Maximum User I/Os 364 —
Package 672-ball UBGA, 23x23 mm 672-UBGA (23x23 mm)
Ball Pitch 0.8 mm —
Process Node TSMC 28 nm low-power —
Operating Temperature -40C to +85C (industrial) 0C to +85C (commercial)
Memory Interfaces DDR2, DDR3, LPDDR2 (hard controller) —
Peripherals (HPS) USB 2.0 OTG, GbE MAC, CAN, SPI, I2C, UART —
Configuration Modes JTAG, serial passive/active —
Speed Grade C7 —
RoHS Status Compliant Compliant
Series — Cyclone V SE
Core Type — Single ARM Cortex-A9 MPCore with CoreSight
Logic Elements — 40K
Operating Frequency (HPS) — 600 MHz
Core Voltage — 1.1 V
Embedded Memory (FPGA) — 2,240 Kbits
On-chip RAM (HPS) — 64 KB
Memory Size — 2931 KB (per datasheets.com summary)
DSP Blocks — Variable-precision, 18x19 multipliers
Mounting Type — Surface Mount
Process Technology — TSMC 28 nm low-power
MSL Level — 3

Datasheets & Resources

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