5CSEBA4U23C8SN - Cyclone V SE SoC FPGA, 40K LE, 672-UBGA | Intel
MPN: 5CSEBA4U23C8SN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $21.68 | $21.68 |
| 10 | $20.45 | $204.50 |
| 100 | $18.92 | $1,892.00 |
| 500 | $17.4 | $8,700.00 |
| 1,000 | $15.95 | $15,950.00 |
Drop-in alternatives for 5CSEBA4U23C8SN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA4U23C8N
✅ Drop-In✓ In Stock
$138.2 / Unit
View Datasheet →5CSEBA4U23C7SN
✅ Drop-In✓ In Stock
$18.2 / Unit
View Datasheet →5CSEBA4U23I7SN
✅ Drop-In✓ In Stock
$98.5 / Unit
View Datasheet →5CSEBA4U23C6N
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View Datasheet →5CSEBA4U23A7N
✅ Drop-In✓ In Stock
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View Datasheet →5CSEBA4U23C8SN Maximum Ratings & Electrical Characteristics
| Series | Cyclone V SE |
| Core Type | Single ARM Cortex-A9 MPCore with CoreSight |
| Logic Elements | 40K |
| Operating Frequency (HPS) | 600 MHz |
| Core Voltage | 1.1 V |
| Embedded Memory (FPGA) | 2,240 Kbits |
| On-chip RAM (HPS) | 64 KB |
| Memory Size | 2931 KB (per datasheets.com summary) |
| DSP Blocks | Variable-precision, 18x19 multipliers |
| Package | 672-UBGA (23x23 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (commercial) |
| Process Technology | TSMC 28 nm low-power |
| RoHS Status | Compliant |
| MSL Level | 3 |
5CSEBA4U23C8SN 672-ubga (23x23 mm) Pin Configuration Guide
Complete pinout information for 5CSEBA4U23C8SN (672-ubga (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA4U23C8SN.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA4U23C8SN is suitable for 6 applications: Industrial Machine Vision, Motor Control and Drives, Automotive Driver Assistance (ADAS), Industrial IoT Gateway, Video Surveillance Encoder, Medical Imaging Equipment.
Industrial Machine Vision
The 5CSEBA4U23C8SN fits industrial machine vision because its single-core ARM Cortex-A9 at 600 MHz handles camera ISP and GigE Vision protocol while the 40K LE FPGA fabric accelerates image preprocessing pipelines (Sobel, threshold, morphology) in parallel. The variable-precision DSP blocks run 18x19 multipliers suitable for FFT-based defect detection, and 2,240 Kbits of embedded SRAM buffer full-HD frame lines at 60 fps. Industrial-grade I/O bank support (LVDS/LVCMOS 1.2-3.3V) interfaces directly to MIPI CSI-2 or LVDS image sensors. The HPS runs Linux with OpenCV, offloading hot-path pixel processing to FPGA fabric.
Recommended
Motor Control and Drives
The 5CSEBA4U23C8SN integrates motor-control logic and a Cortex-A9 control loop on one die, eliminating separate MCU+FPGA partitions in servo drives. The HPS runs FOC (field-oriented control) at 20-50 kHz PWM rates, while the 40K LE fabric implements encoder interfaces (BiSS, EnDat 2.2, Tamagawa) and custom logic-level shifting. Variable-precision DSP blocks accelerate Park/Clarke transforms and SVPWM. The 672-UBGA U23 package exposes enough I/O banks for 3-phase PWM, sigma-delta ADC interfaces, and Ethernet/IP or EtherCAT MII pins.
Recommended
Automotive Driver Assistance (ADAS)
The 5CSEBA4U23C8SN suits ADAS sensor-fusion ECUs by combining a Cortex-A9 host processor with deterministic FPGA accelerators for radar/lidar preprocessing. The 40K LE fabric implements custom DMA, sensor timing, and CAN-FD gating, while the HPS runs AUTOSAR and object-classification algorithms. Note that 5CSEBA4U23C8SN is commercial-grade (0-85C); for AEC-Q100 qualified automotive deployments, the equivalent A7 speed-grade variant 5CSEBA4U23A7N is preferred (same U23 footprint, automotive qualification tier).
Recommended
Industrial IoT Gateway
The 5CSEBA4U23C8SN consolidates protocol-conversion gateways by running Modbus/TCP, OPC-UA, PROFINET, and EtherCAT stacks on the Cortex-A9 HPS while FPGA logic accelerates deterministic packet timestamping, PTP hardware timestamping, and custom fieldbus protocol handling. The 2,240 Kbits embedded SRAM caches protocol buffers, and the wide FPGA I/O bank supports RS-485, RS-232, and isolated digital inputs at 24V industrial levels. 1 Gbit Ethernet MAC in the HPS enables edge-to-cloud connectivity.
Recommended
Video Surveillance Encoder
The 5CSEBA4U23C8SN enables multi-channel H.264/H.265 video encoding by partitioning motion estimation, DCT/IDCT, and deblocking filters into the FPGA fabric, while the Cortex-A9 runs the encoder orchestration and stream management. The variable-precision DSP blocks accelerate motion-estimation ME (sum-of-absolute-differences) at 200+ MHz. Embedded M20K memory blocks buffer macroblock rows, and FPGA I/O banks interface directly to BT.656, BT.1120, or MIPI CSI-2 camera inputs.
Recommended
Medical Imaging Equipment
The 5CSEBA4U23C8SN fits portable ultrasound or endoscopy image processors where the HPS runs the application UI, patient data, and DICOM stack while the FPGA fabric accelerates beamforming, FIR filtering, and envelope detection in the ultrasound pipeline. The 40K LE and 2240 Kbits embedded SRAM support 32-channel beamformer implementations. Industrial temp grade suits hospital environments; for IEC 60601 medical safety certification, pair with appropriate isolation. The 672-UBGA U23 footprint enables compact handheld form factors.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA4U23C8SN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA4U23C8N | 5CSEBA4U23C7SN | 5CSEBA4U23I7SN | 5CSEBA4U23C6N |
|---|---|---|---|---|---|
| Package | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 40K | 40K | 40K | 40K | 40K |
| Speed Grade | 8 (C8) | 8 (C8) | 7 (C7) | 7 (I7) | 6 (C6) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| HPS Cortex-A9 Cores | 1 | 1 | 1 | 1 | 1 |
| Embedded Memory | 2,240 Kbits | 2,240 Kbits | 2,240 Kbits | 2,240 Kbits | 2,240 Kbits |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Pin-and-function compatible with full U23 672-UBGA Cyclone V SE family (vs 5CSEBA4U23C7SN)
- Industrial-temp variant available for harsh environments (vs 5CSEBA4U23I7SN)
- Single-core HPS vs dual-core options - cost optimization (vs 5CSEBA5U23C8SN (dual-core variant))
Design Notes
The 5CSEBA4U23C8SN requires multiple supply rails: VCC (1.1V core), VCCPLL (1.1V PLL analog), VCCIO for HPS and FPGA I/O banks (1.2V-3.3V depending on I/O standard), VCCPD (2.5V/3.0V/3.3V pre-driver), and VCCRSTCLK (2.5V for HPS reset/clock). Decouple each rail with 0.1 uF ceramic and 10 uF bulk capacitors placed within 5 mm of the corresponding pins. Use a sequenced power supply (e.g., LTC3612 or Intel EN5339) to ensure VCC ramps before VCCIO/VCCPD to avoid latch-up. Estimated: at 600 MHz HPS with 40K LE at typical toggle rates, total power consumption is approximately 3-5W depending on utilization.
The 672-UBGA U23 package has 1.0 mm ball pitch. PCB layout requires microvia (HDI) stackup with at least 4-6 layers, blind/buried vias for inner-row BGA breakouts, and a 0.4-0.5 mm via-in-pad design with planar filling to escape the center balls. Use 50 ohm controlled impedance for high-speed HPS interfaces (DDR3, RGMII) and 90 ohm differential for LVDS channels. Ground plane directly under the BGA must be continuous to provide return path and thermal dissipation.
The 672-UBGA U23 package has theta-JA of approximately 12-15 C/W on a 4-layer JEDEC test board. At full HPS load (600 MHz) plus 50% FPGA utilization, the device can dissipate 3-5W, yielding 36-75 C junction temperature rise above ambient. For commercial-grade (0-85C) operation in enclosed housings, attach a heatsink or thermal pad to the top of the package, and ensure at least 4 thermal vias in the BGA center array to the inner ground plane.
Do not confuse 5CSEBA4U23C8SN (single-core HPS, 40K LE) with 5CSEMA4U23C8SN or 5CSEBA6U23C8SN variants - the SE suffix denotes the SoC tier with hard ARM core, the second digit (4 vs 6) indicates logic element count, and missing 'A' vs 'AE' indicates HPS core count. The 'SN' suffix means lead-free (Pb-free) while bare 'N' also indicates lead-free but with different MSL handling. The package letter U23 vs U19 vs U15 is critical - it identifies the BGA ball count and PCB footprint, and these are NOT pin-compatible.
Compliance Information
RoHS compliant per Cyclone V Device Overview datasheet and Intel product page. SN suffix denotes Pb-free lead finish. Standard commercial variant is not AEC-Q100 qualified; choose 5CSEBA4U23A7N for automotive-grade applications.
