5CSEBA4U23C7SN - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
MPN: 5CSEBA4U23C7SN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.62 | $28.62 |
| 10 | $25.84 | $258.40 |
| 100 | $22.9 | $2,290.00 |
| 500 | $20.45 | $10,225.00 |
| 1,000 | $18.2 | $18,200.00 |
Drop-in alternatives for 5CSEBA4U23C7SN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA4U23C7N
✅ Drop-In✓ In Stock
$124.5 / Unit
View Datasheet →5CSEBA4U23C6N
✅ Drop-In✓ In Stock
$86.2 / Unit
View Datasheet →5CSEBA4U23A7N
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →5CSEBA2U23C7SN
✅ Drop-In✓ In Stock
$13.73 / Unit
View Datasheet →5CSEBA5U23C7SN
✅ Drop-In📋 Reference alternative (not in catalog)
5CSEBA6U23C7SN
✅ Drop-In📋 Reference alternative (not in catalog)
5CSEBA4U23C7SN Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Device Logic Elements | 40,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz |
| Embedded Memory (Kbits) | 2,460 |
| DSP Blocks (18x18) | 112 |
| Maximum User I/Os | 364 |
| Package | 672-ball UBGA, 23x23 mm |
| Ball Pitch | 0.8 mm |
| Process Node | TSMC 28 nm low-power |
| Operating Temperature | -40C to +85C (industrial) |
| Memory Interfaces | DDR2, DDR3, LPDDR2 (hard controller) |
| Peripherals (HPS) | USB 2.0 OTG, GbE MAC, CAN, SPI, I2C, UART |
| Configuration Modes | JTAG, serial passive/active |
| Speed Grade | C7 |
| RoHS Status | Compliant |
5CSEBA4U23C7SN 672-ball ubga, 23x23 mm Pin Configuration Guide
Complete pinout information for 5CSEBA4U23C7SN (672-ball ubga, 23x23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA4U23C7SN.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA4U23C7SN is suitable for 6 applications: Industrial Motor Control and Drives, Machine Vision and Video Inspection, Automotive ADAS and Driver Assistance ECUs, Software-Defined Radio Baseband Preprocessing, Medical Imaging Pre-Processing, Industrial IoT Gateway with Edge Analytics.
Industrial Motor Control and Drives
The 5CSEBA4U23C7SN fits industrial motor control because its dual-core ARM Cortex-A9 HPS at 800 MHz runs Linux/RTOS supervisory loops while the 40K-logic-element FPGA fabric accelerates field-oriented-control (FOC) algorithms in dedicated hardware. The 112 DSP (18x18) blocks execute parallel Park/Clarke transforms and SVPWM modulation at sub-microsecond latency. Integrated DDR3 controller supports encoder feedback buffering, and the CAN peripherals interface with industrial servo buses. A 672-UBGA industrial-grade package at -40C to +85C survives factory-floor thermal stress, while the AXI-coherent HPS-to-FPGA bridges eliminate DMA overhead between Linux control software and hardware PWM generators. Compared to discrete MCU+FPGA designs, this SoC reduces BOM count and PCB area by roughly 40%.
Recommended
Machine Vision and Video Inspection
For machine vision pipelines, the 5CSEBA4U23C7SN pairs 40K logic elements with 112 DSP blocks to deliver real-time 1080p60 image processing at the FPGA fabric edge, while the dual-core ARM A9 HPS runs OpenCV-based classification and TCP/IP communication to factory MES systems. The integrated DDR3 hard memory controller sustains 12.8 Gbps memory bandwidth for line-buffer and frame-buffer operations. Hard USB 2.0 OTG and Gigabit Ethernet MAC simplify connection to industrial cameras (GigE Vision) and PLC backplanes. The 364 available user I/Os accommodate multiple parallel sensor interfaces (LVDS, sub-LVDS, HiSPi). Cyclone V SE industrial-grade qualification supports 24/7 factory operation, and the coherent AXI bridge lets the HPS access processed frames without CPU-busy DMA.
Recommended
Automotive ADAS and Driver Assistance ECUs
The 5CSEBA4U23C7SN suits automotive ADAS prototyping where the dual-core ARM Cortex-A9 with NEON media engine handles sensor fusion and CAN-FD vehicle network I/O, while the 40K-LE Cyclone V fabric accelerates radar/lidar preprocessing such as FFT-based Doppler extraction or point-cloud clustering. Hard DDR3 controller with ECC supports safety-critical memory, and integrated CAN interfaces connect directly to vehicle bus networks. The Cyclone V SE family meets automotive reliability targets per the 5CSEBA4U23A7N (A7 speed grade) variant qualified for production ECUs. Compared to discrete ASSPs, this SoC FPGA enables iterative hardware/software partitioning during ADAS algorithm development, then freezes the partition for production. The 672-UBGA package withstands automotive underhood thermal stress when properly heatsunk.
Recommended
Software-Defined Radio Baseband Preprocessing
For SDR baseband preprocessing, the 5CSEBA4U23C7SN delivers 112 DSP blocks (18x18 multipliers) executing channelization, FIR filtering, and FFT operations at sample rates up to ~150 MSPS, while the dual-core ARM A9 HPS runs Linux-based protocol stack (LTE, WiFi, custom waveforms) and TCP/IP backhaul. The integrated DDR3 controller buffers IQ samples at line rate, and AXI coherent bridging lets the HPS access demodulated symbols without DMA staging. Multiple LVDS pairs (up to 364 user I/Os) interface with high-speed ADCs/DACs such as AD9680-1000. Cyclone V's 28 nm low-power process balances computational density against thermal dissipation in compact radio enclosures. Industrial temperature grade supports outdoor small-cell deployments.
Recommended
Medical Imaging Pre-Processing
The 5CSEBA4U23C7SN serves medical imaging front-ends such as ultrasound beamforming and endoscopy video processing where the dual-core ARM A9 runs patient-interface software while the FPGA fabric executes real-time image-pipeline algorithms (bandpass filtering, log compression, scan conversion). The 2,460 Kbits embedded RAM supports line buffers for ultrasound beam delay-and-sum operations, and the 112 DSP blocks handle per-channel FIR filtering. The integrated DDR3 hard controller with ECC provides reliable image-frame buffering for downstream JPEG compression or DICOM transfer via Gigabit Ethernet. The 672-UBGA package's -40C to +85C industrial range supports operating-room equipment ambient requirements. The coherent AXI bridge lets the HPS access pre-processed frames directly for annotation or compression without intermediate staging buffers.
Recommended
Industrial IoT Gateway with Edge Analytics
The 5CSEBA4U23C7SN anchors industrial IoT gateways because the dual-core ARM Cortex-A9 HPS at 800 MHz runs Linux with containerized edge-analytics workloads (Node-RED, AWS IoT Greengrass, MQTT brokers) while the 40K-LE FPGA fabric handles deterministic protocol conversion for legacy fieldbuses (Modbus RTU, Profibus, CANopen) into OPC-UA or MQTT. The integrated GbE MAC and USB 2.0 OTG provide uplink and local configuration paths, and the DDR3 hard controller sustains data historian logging. The 672-UBGA industrial-temperature package survives factory-floor conditions and the coherent AXI bridge allows Linux to monitor FPGA-side diagnostics without polling overhead. Cyclone V SE long-term availability (10+ years per Intel product roadmap) supports multi-decade industrial deployments.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA4U23C7SN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA4U23C7N | 5CSEBA2U23C7SN | 5CSEBA5U23C7SN | 5CSEBA6U23C7SN |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23) - same | 672-UBGA (U23) - same | 672-UBGA (U23) - same | 672-UBGA (U23) - same |
| Logic Elements | 40,000 | 40,000 | 25,000 | 85,000 | 110,000 |
| DSP Blocks (18x18) | 112 | 112 | 66 | 240 | 300 |
| Embedded RAM (Kbits) | 2,460 | 2,460 | 1,400 | 4,400 | 5,500 |
| HPS Cores / Frequency | Dual-core ARM A9 / 800 MHz | Dual-core ARM A9 / 800 MHz | Dual-core ARM A9 / 800 MHz | Dual-core ARM A9 / 800 MHz | Dual-core ARM A9 / 800 MHz |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Speed Grade | C7 (industrial) | C7 | C7 | C7 | C7 |
Key Differentiators
- SoC integration eliminates FPGA-MCU inter-chip latency (vs Discrete Cyclone V FPGA + external MCU)
- 40K-LE sweet spot for mid-range embedded designs (vs 5CSEBA2U23C7SN (25K LE))
- Pin-compatible scale path to higher densities (vs 5CSEBA6U23C7SN (110K LE))
- Long-term industrial availability (vs Shorter-lifecycle Cyclone IV or Cyclone 10 families)
Design Notes
The 672-UBGA at 0.8 mm pitch requires a 6- or 8-layer PCB with microvia stack-up and sequential lamination. Standard 4-layer JEDEC boards cannot route this BGA breakout. Place escape vias in-pad or via-in-pad for the inner rows; dog-bone fanout is acceptable for the outermost two rows but limits routing channels. Match BGA pad diameter to the Intel-recommended 0.40 mm non-solder-mask-defined (NSMD) pads for reliable assembly.
The Cyclone V SE requires separate power rails for the HPS and FPGA fabric with strict power-up sequencing: VCC_HPS ramps before VCC, and VCCIO for HPS banks must precede HPS I/O activation. Use a POR (power-on reset) supervisor with adjustable delay to enforce sequencing per the Cyclone V Device Handbook Volume 1. Decoupling requires 0.1 uF and 0.01 uF X7R ceramics within 2 mm of every supply pin, plus bulk 47-100 uF polymer tantalum per rail.
Estimated: at full HPS utilization (both A9 cores at 800 MHz) plus ~70% FPGA logic utilization toggling at 200 MHz, the 5CSEBA4U23C7SN dissipates approximately 3-4 W. The 672-UBGA package's theta_JA is approximately 14 C/W with 8-layer JEDEC-compliant test board (no heatsink). With 70C ambient, junction reaches ~115-130C - within the 85C industrial spec only if the effective ambient is lower or a small heatsink is added. Confirm with actual board thermal characterization before deployment.
DDR3 interfaces up to 533 MHz (1066 Mbps) require length-matched routing with 25 mil impedance-controlled traces, fly-by topology for multiple ranks, and proper write leveling calibration in Quartus Prime. Use the Intel-provided DDR3 pin controller IP and follow the Cyclone V External Memory Interface Handbook. LVDS channels toggle up to 800 Mbps; use 100-ohm differential routing and minimize stubs to avoid reflections.
Do not assume the 'N' suffix vs 'SN' suffix changes pinout - per the Cyclone V ordering guide, the suffix only flags optional features (security, soft-touch). All U23 package variants are pin-compatible. Configuration mode (JTAG/serial) and MSEL[3:0] strapping determine load behavior - configure MSEL resistors correctly before first power-up to avoid locking the device. Always generate the .jic or .pof using Quartus Prime Convert Programming Files for production programming.
Compliance Information
RoHS and REACH compliant per Intel/Altera product declarations. Not AEC-Q100 qualified in this part number (use 5CSEBA4U23A7N for automotive). Halogen-free per JEDEC JS709.
