5CSEBA6U23I7LN vs 5CSEBA6U19I7N Comparison

Detailed side-by-side comparison of 5CSEBA6U23I7LN by Intel and 5CSEBA6U19I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 5CSEBA6U23I7LN 5CSEBA6U19I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $184.83 $142.75
Family Cyclone V SE SoC FPGA Cyclone V SE SoC FPGA
Logic Elements 110,000 110,000
Processor Cores Dual ARM Cortex-A9 MPCore with CoreSight —
Maximum CPU Clock 925 MHz —
Package 672-pin UBGA (UBG-672) 23x23 mm 484-pin UBGAFBGA (UBGA-484, 19x19 mm)
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Speed Grade I7 (fast) —
Temperature Range Industrial (-40C to +100C junction) —
Suffix L Lead-free —
Suffix N Tray packaging —
RoHS Status Compliant (lead-free suffix) Compliant
Hard Memory Blocks [DATA_NEEDED: total M10K and MLAB bits] —
DSP Blocks [DATA_NEEDED: variable-precision DSP block count] 112 (18x18 multipliers)
HPS Peripherals Gigabit Ethernet, USB 2.0 OTG, CAN, SPI, I2C, UART, SD/SDIO —
Configuration Mode JTAG and Active Serial (AS) —
Process Node TSMC 28 nm low-power —
Design Toolchain Intel Quartus Prime + SoC EDS —
Series — 5CSEBA6
Device Variant — 5CSEA6 (U19 package, 110K LE)
Hard Processor System — Dual-core ARM Cortex-A9 MPCore
HPS Maximum Frequency — 800 MHz
Embedded Memory — 4.45 Mbits (M10K + MLAB)
Hard Memory Controller — DDR3, DDR3L, LPDDR2
Transceivers — Up to 9 channels, 3.125 Gbps
PLLs — 6 (FPGA) + 3 (HPS)
User I/O Banks — 8
Maximum User I/O — 288 (package-dependent)
Operating Temperature — -40C to +100C (Industrial)
Process Technology — TSMC 28 nm low-power
Supply Voltage — Multi-rail (1.1 V core, 1.5/1.8/2.5/3.0/3.3 V I/O)
Configuration Modes — JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP)

Datasheets & Resources

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