5CSEBA6U19I7N - Cyclone V SE SoC FPGA, 110K LE, Dual ARM Cortex-A9 800MHz | Intel
MPN: 5CSEBA6U19I7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $259.87 | $259.87 |
| 10 | $234.5 | $2,345.00 |
| 100 | $198.4 | $19,840.00 |
| 500 | $168.9 | $84,450.00 |
| 1,000 | $142.75 | $142,750.00 |
Drop-in alternatives for 5CSEBA6U19I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5CSEBA6U19C8N
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View Datasheet →5CSEBA6U19I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Series | 5CSEBA6 |
| Device Variant | 5CSEA6 (U19 package, 110K LE) |
| Logic Elements | 110,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore |
| HPS Maximum Frequency | 800 MHz |
| Embedded Memory | 4.45 Mbits (M10K + MLAB) |
| Hard Memory Controller | DDR3, DDR3L, LPDDR2 |
| Transceivers | Up to 9 channels, 3.125 Gbps |
| DSP Blocks | 112 (18x18 multipliers) |
| PLLs | 6 (FPGA) + 3 (HPS) |
| User I/O Banks | 8 |
| Maximum User I/O | 288 (package-dependent) |
| Package | 484-pin UBGAFBGA (UBGA-484, 19x19 mm) |
| Operating Temperature | -40C to +100C (Industrial) |
| Process Technology | TSMC 28 nm low-power |
| Supply Voltage | Multi-rail (1.1 V core, 1.5/1.8/2.5/3.0/3.3 V I/O) |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
5CSEBA6U19I7N 484-pin ubgafbga (ubga-484, 19x19 mm) Pin Configuration Guide
Complete pinout information for 5CSEBA6U19I7N (484-pin ubgafbga (ubga-484, 19x19 mm) package) with 48 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA6U19I7N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 48 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA6U19I7N is suitable for 6 applications: Industrial Machine Vision and Smart Cameras, Programmable Logic Controller (PLC) with Motion Control, Software-Defined Radio (SDR) Baseband Processing, Broadcast Video Encoders and IPTV Headends, Entry-Level ADAS (Advanced Driver Assistance Systems), Medical Imaging Point-of-Care Devices.
Industrial Machine Vision and Smart Cameras
The 5CSEBA6U19I7N is well suited for industrial smart cameras because its 110K logic elements and 112 18x18 DSP blocks provide the capacity for real-time image-processing pipelines (bayer demosaic, edge detection, HOG features) running in parallel on the FPGA fabric. The dual-core ARM Cortex-A9 at 800 MHz handles high-level machine-learning inference (e.g., TensorFlow Lite for microcontrollers) and GigE Vision or USB3 Vision protocol stack. According to Intel's Cyclone V device handbook, the integrated 3.125 Gbps transceivers directly interface with Sony IMX and ON Semi Python image sensors without external bridges. Designers pair the SoC with a PoE-powered carrier board, an automotive-grade image sensor, and a 1 GB DDR3L memory attached to the HPS for frame buffering.
Recommended
Programmable Logic Controller (PLC) with Motion Control
The 5CSEBA6U19I7N's deterministic FPGA fabric enables cycle-time-critical motion loops (typically 250 microseconds per axis) running in parallel without RTOS jitter, while the Cortex-A9 HPS executes ladder-logic firmware or CODESYS soft-PLC runtime for high-level control. The 9-transceiver channels support multi-axis EtherCAT master connectivity with sub-100 ns jitter, and the 288 user I/O handle 24 V digital and analog inputs through optocoupler isolation. Intel's reference design RD1103 demonstrates a 32-axis servo controller on the Cyclone V SE device. Recommended companion chips include industrial-grade 24 V I/O transceivers and motor-driver predrivers.
Recommended
Software-Defined Radio (SDR) Baseband Processing
The 5CSEBA6U19I7N's 112 DSP blocks deliver approximately 224 GMACs of 18x18 multiply-accumulate throughput, sufficient to implement a 4-antenna LTE small-cell physical layer (uplink) with digital up-conversion (DUC) and digital down-conversion (DDC). The 3.125 Gbps transceivers connect directly to RF ADCs and DACs (e.g., AD9361, AD9371) over LVDS or JESD204B-equivalent parallel interfaces. The Cortex-A9 HPS runs the Open Air Interface (OAI) LTE stack or srsRAN 5G stack, offloading real-time baseband to the FPGA. Reference design Intel AN-742 shows complete LTE eNodeB implementation on Cyclone V SE SoC.
Recommended
Broadcast Video Encoders and IPTV Headends
The 5CSEBA6U19I7N's FPGA fabric supports H.264 and H.265 (HEVC) main-profile encoding at 1080p60 with hardware-accelerated motion estimation, while the ARM Cortex-A9 runs the IPTV signaling stack (RTSP, RTP, MPEG2-TS muxing) and network protocols. The integrated memory controller interfaces with DDR3 memory at up to 800 MHz, providing the 4-6 GB/s of bandwidth needed for 1080p60 reference frame buffers. The 288 user I/O handle HDMI input, SDI input, and ASI output simultaneously. According to Intel's white paper WP-01172, the Cyclone V SE SoC delivers 30% lower BOM cost than competing FPGA plus discrete CPU solutions for broadcast encoder applications.
Recommended
Entry-Level ADAS (Advanced Driver Assistance Systems)
The 5CSEBA6U19I7N's dual-core ARM Cortex-A9 MPCore provides the processing headroom for entry-level driver assistance algorithms such as lane-departure warning, forward-collision warning, and traffic-sign recognition, while the FPGA fabric handles real-time image preprocessing (perspective correction, color space conversion) on up to two 1-megapixel automotive camera inputs. The industrial -40C to +100C temperature grade supports the harsh automotive under-hood environment when paired with conformal coating. Per the Cyclone V SE automotive product bulletin, the device meets AEC-Q100 temperature and reliability requirements. Companion components include automotive-grade image sensors (e.g., ON Semi ASX340) and CAN-FD transceivers.
Recommended
Medical Imaging Point-of-Care Devices
The 5CSEBA6U19I7N's industrial temperature range and low-power 28 nm process suit portable point-of-care ultrasound and endoscopy systems where battery life and patient safety are critical. The FPGA fabric implements beamforming for 64-channel ultrasound probes (a typical 15-6-15 standard), while the dual ARM Cortex-A9 executes Doppler processing, harmonic imaging, and the user interface. The integrated USB 2.0 OTG simplifies connection to host PCs, and the DDR3 memory controller supports the 4 GB image buffer required for raw RF data acquisition. Reference design RD1089 (Intel RocketBoards) demonstrates a complete portable ultrasound implementation on the Cyclone V SE SoC.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA6U19I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA6U19C8N | 5CSEBA5U19I7N | 5CSEBA4U19I7N | 5CSEBA2U19I7N | 5CSEBA6U19A7N |
|---|---|---|---|---|---|---|
| Package | UBGAFBGA-484 (U19, 19x19 mm) | UBGAFBGA-484 (U19) - same | UBGAFBGA-484 (U19) - same | UBGAFBGA-484 (U19) - same | UBGAFBGA-484 (U19) - same | UBGAFBGA-484 (U19) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 110,000 | 110,000 | 85,000 (-23%) | 40,000 (-64%) | 25,000 (-77%) | 110,000 |
| DSP Blocks (18x18) | 112 | 112 | 87 (-22%) | 66 (-41%) | 36 (-68%) | 112 |
| Embedded Memory | 4.45 Mbits | 4.45 Mbits | 3.97 Mbits (-11%) | 2.81 Mbits (-37%) | 1.55 Mbits (-65%) | 4.45 Mbits |
| Speed Grade | I7 (industrial) | C8 (commercial, +15% Fmax) | I7 (industrial) | I7 (industrial) | I7 (industrial) | A7 (slowest, lowest power) |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| HPS Maximum Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| Unit Price (qty 1, USD) | $259.87 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest logic capacity in the Cyclone V SE 5CSEBA6 family (vs 5CSEBA5U19I7N)
- Industrial temperature grade (-40C to +100C) versus commercial-only variant (vs 5CSEBA6U19C8N)
- I7 speed grade balances performance and power versus A7 slowest variant (vs 5CSEBA6U19A7N)
Design Notes
Estimated: Cyclone V SE devices require at least 4 independent voltage rails - 1.1V core (HPS + FPGA fabric), 2.5V PLL analog, 1.5/1.8V DDR memory, and 1.8/2.5/3.3V I/O banks. Per the Cyclone V Device Handbook, the recommended power-on sequencing is 1.1V core first, then 2.5V PLL, then I/O banks. Reverse sequencing on power-down prevents in-rush current that can permanently damage internal ESD structures. Use an Intel Enpirion EM11x series PMIC or a discrete sequencer with programmable delay to enforce the rail order. Estimated total power for the 5CSEBA6U19I7N at 60-70% ALM utilization is 5-8W (1.1V core) plus 1-2W distributed across I/O banks. Verify with Quartus Prime PowerPlay Early Power Estimator before PCB layout.
Estimated: UBGAFBGA-484 thermal resistance is approximately theta_JA = 12.5 C/W with a 4-layer JEDEC JESD51-7 test board (4 thermal vias under the 10x10 mm center BGA thermal pad array). At 7W total dissipation, junction-to-ambient temperature rise is approximately 87.5 C. For industrial -40C to +100C operation at maximum ambient, this leaves only 12.5 C of margin to the 125C junction limit - acceptable but tight. Recommended PCB thermal mitigation: 4-8 thermal vias (0.3 mm drill, 0.5 mm pad, filled with solder or thermal epoxy) directly under the BGA thermal pad, connected to an inner ground plane that extends at least 100 mm^2 of copper pour on the top layer. Avoid placing the device near board edges or in stagnant-air enclosures.
Estimated: The 1.0 mm ball pitch UBGAFBGA-484 requires an HDI PCB stack-up with laser-drilled microvias for signal break-out. Minimum 6 signal layers (2 for HPS, 2 for FPGA fabric, 2 for transceivers) plus 2 dedicated reference/ground layers are recommended. Use 50 ohm single-ended controlled-impedance traces for GPIO and 100 ohm differential for the 3.125 Gbps transceiver channels. Maintain 3x trace-width spacing between high-speed differential pairs and other signals to minimize crosstalk. Allocate continuous reference planes under all high-speed traces - never route over plane splits. Per Intel's PCB Design Guidelines (AN-822), the DDR3 trace length matching tolerance is +/- 25 ps (approximately +/- 3.7 mm at 6.6 ps/mm propagation delay).
Estimated: Three common pitfalls that cause first-prototype failures: (1) Skipping HPS reset logic - the HPS requires a proper cold reset sequence through the dedicated HPS_RESET_N pin before firmware attempts to access DDR memory; failing to do this results in silent boot failure. (2) Using non-HD-qualified DDR3L chips - the integrated memory controller requires JEDEC DDR3L-1600 or LPDDR2-1066 timing compliance; consumer-grade parts often fail jitter requirements under temperature. (3) Improper transceiver reference clock routing - the 3.125 Gbps transceivers need a clean differential clock with phase noise below -110 dBc/Hz at 100 kHz offset; a noisy reference clock degrades link BER from 1e-12 to 1e-7 even when all other parameters are correct.
Compliance Information
RoHS compliant per Cyclone V device handbook ordering code (N suffix). Halogen-free per Intel FPGA green-compliance policy. Not AEC-Q100 qualified as the standard I7 industrial variant; the AEC-Q100 qualified counterpart is a separate -A7/-C7 ordering code (5CSEBA6U19A7N is the automotive speed grade). Conflict-minerals compliance is documented in Intel's annual Conflict Minerals Report (CMRT).
