5CSEBA6U23I7LN - Cyclone V SE SoC FPGA 110K LE Dual ARM A9 | Intel
MPN: 5CSEBA6U23I7LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $273.45 | $273.45 |
| 10 | $259.78 | $2,597.80 |
| 100 | $232.43 | $23,243.00 |
| 500 | $205.09 | $102,545.00 |
| 1,000 | $184.83 | $184,830.00 |
5CSEBA6U23I7LN Overview
A System-on-Chip FPGA (SoC FPGA) is a heterogeneous computing device that fuses a general-purpose processor subsystem with a programmable FPGA fabric on the same silicon. The processor subsystem typically executes high-level OS stacks such as Linux while the FPGA fabric accelerates parallel, deterministic, or interface bridging tasks. Compared with a discrete CPU + standalone FPGA pair, an SoC FPGA reduces board area, lowers latency between the two domains, and provides coherent shared-memory access through a high-bandwidth interconnect. The Cyclone V SE family sits in Intel's mid-range low-power SoC FPGA portfolio, optimized for industrial, motor control, and video/imagery pipelines.
Key features of the 5CSEBA6U23I7LN include approximately 110K logic elements, embedded hard memory blocks, variable-precision DSP blocks, and a dual ARM Cortex-A9 MPCore subsystem with NEON media engine and single/double-precision FPU. The hard processor system includes peripherals such as Gigabit Ethernet, USB 2.0 OTG, CAN, SPI, I2C, UART, and SD/SDIO controllers. The 925 MHz CPU frequency quoted by distributors refers to the maximum ARM core clock; FPGA fabric performance is governed by logic-element count, DSP blocks, and memory bandwidth rather than a single MHz figure.
Architecturally, the device couples an FPGA fabric built on a low-power process with a separate ARM subsystem that communicates via a 32-bit or 64-bit AMBA AXI bridge. This allows Linux or RTOS workloads on the Cortex-A9 side to control DMA streams that are processed in real time by the FPGA fabric, a common pattern in machine vision and industrial Ethernet gateways.
Typical applications include industrial motor control, machine vision, video surveillance, factory automation gateways, smart energy / smart grid edge nodes, and portable medical imaging pre-processing. The integrated ARM cores run the user interface and networking stack while the FPGA fabric handles high-throughput sensor interfaces and deterministic control loops.
Designers should evaluate power-rail sequencing, thermal dissipation on the 672-ball BGA, and the JTAG/AS configuration mode (the I7 speed grade and LN suffix denote industrial temperature range and lead-free packaging). Quartus Prime is the supported design toolchain for both HDL synthesis and the SoC EDS for software development.
This page synthesizes distributor pricing from DigiKey, Mouser, Heisener and Octopart, enumerates same-family and cross-brand drop-in SoC FPGA alternatives, and provides PCB layout and thermal design notes beyond the data the manufacturer datasheet alone surfaces.
Drop-in alternatives for 5CSEBA6U23I7LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 5CSEBA6U23I7LN (same form factor and footprint) — differing in Package, Process Technology, DSP Blocks, Logic Elements, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA6U23C8SN
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1420 / Unit
View Datasheet →5CSEBA6U23C7N
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$185 / Unit
View Datasheet →5CSEBA6U23A7N
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$225 / Unit
View Datasheet →5CSEBA5U23I7N
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$132.1 / Unit
View Datasheet →5CSEBA4U23I7N
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
Contact for price
View Datasheet →5CSEBA6U19I7N
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$142.75 / Unit
View Datasheet →5CSEBA6U23I7LN Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 110,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum CPU Clock | 925 MHz |
| Package | 672-pin UBGA (UBG-672) 23x23 mm |
| Mounting Type | Surface Mount (BGA) |
| Speed Grade | I7 (fast) |
| Temperature Range | Industrial (-40C to +100C junction) |
| Suffix L | Lead-free |
| Suffix N | Tray packaging |
| RoHS Status | Compliant (lead-free suffix) |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, CAN, SPI, I2C, UART, SD/SDIO |
| Configuration Mode | JTAG and Active Serial (AS) |
| Process Node | TSMC 28 nm low-power |
| Design Toolchain | Intel Quartus Prime + SoC EDS |
5CSEBA6U23I7LN 672-pin ubga (ubg-672) 23x23 mm Pin Configuration Guide
Pin configuration for 5CSEBA6U23I7LN (672-pin ubga (ubg-672) 23x23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA6U23I7LN.
Refer to the datasheet for full pin configuration.
Typical Applications
5CSEBA6U23I7LN is suitable for 6 applications: Industrial Motor Control, Machine Vision Edge Node, Smart Energy / Grid Edge Gateway, Video Surveillance Encoder, Factory Automation Protocol Bridge, Portable Medical Imaging Pre-Processor.
Industrial Motor Control
The 5CSEBA6U23I7LN suits multi-axis industrial motor drives where the dual ARM Cortex-A9 runs the control loop, EtherCAT master, and HMI while the 110K LE FPGA fabric implements sub-microsecond current-loop PWM and encoder decoding. The hard processor system runs Linux with PREEMPT_RT or a bare-metal RTOS for deterministic torque control, while the FPGA fabric handles the high-rate ADC sampling and PWM generation that the A9 cannot service alone. Compared to a discrete MCU + FPGA design, the SoC FPGA reduces latency between position feedback and PWM update, which directly improves servo bandwidth. Quartus Prime and SoC EDS deliver the AXI bridge IP needed to share data between the HPS and fabric without DMA contention.
Recommended
Machine Vision Edge Node
The 5CSEBA6U23I7LN powers GigE Vision or USB3 Vision edge nodes where the FPGA fabric ingests raw sensor pixels at line rate and the Cortex-A9 runs OpenCV-based object detection. The 110K logic elements implement Bayer demosaic, gamma correction, and a hardware-accelerated CNN front-end, offloading the A9 cores from pixel-rate work. The hard Gigabit Ethernet MAC and USB 2.0 OTG in the HPS handle network and host connectivity without consuming fabric logic. This SoC FPGA approach cuts BOM versus a discrete CPU + FPGA + DDR design and avoids the inter-chip latency that limits inspection throughput.
Recommended
Smart Energy / Grid Edge Gateway
The 5CSEBA6U23I7LN fits IEC 61850 substation gateways and smart-meter concentrators that must run a TLS-terminated MQTT broker on the ARM side while timestamping PMU samples in the FPGA. The hard Cortex-A9 handles the encrypted uplink and OS-level tasks, while the FPGA fabric implements IEEE 1588 precision time protocol (PTP) hardware stamping with sub-microsecond accuracy that software timestamping cannot match. The industrial -40C to +100C junction range covers outdoor cabinet deployments, and the lead-free LN finish meets RoHS for sale in EU markets.
Recommended
Video Surveillance Encoder
The 5CSEBA6U23I7LN serves as a multi-channel H.264/H.265 video encoder in IP cameras and NVR appliances, with the FPGA fabric implementing motion estimation and the A9 cores handling the Linux streaming stack. The 110K LE budget is sufficient for one 1080p60 stream at high quality or two 1080p30 streams simultaneously, while the HPS Gigabit Ethernet pushes RTSP streams to the NVR. The integrated SD/SDIO controller enables local microSD recording for edge retention.
Recommended
Factory Automation Protocol Bridge
The 5CSEBA6U23I7LN bridges legacy industrial protocols (PROFIBUS, Modbus RTU, RS-485) to modern Ethernet/IP or OPC UA on a single device. The FPGA fabric implements the real-time bit-stuffing and CRC of PROFIBUS slave messaging, while the Cortex-A9 runs the OPC UA server and TLS-secured Ethernet stack. The hard CAN and UART peripherals in the HPS provide additional industrial interfaces without burning fabric logic. This consolidation replaces a discrete industrial PC plus dedicated protocol converter card, reducing panel space and BOM cost.
Recommended
Portable Medical Imaging Pre-Processor
The 5CSEBA6U23I7LN suits handheld ultrasound or endoscopy pre-processor boards where size, weight, and power are constrained. The FPGA fabric performs beamforming or pixel-level image enhancement, while the A9 cores handle the user interface, wireless link, and battery management. The integrated DDR3 controller in the HPS avoids a discrete memory chip on the board, and the industrial temperature grade supports disinfection-tolerant enclosures. The LN lead-free finish supports medical device RoHS compliance for global sales.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA6U23I7LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA6U23C8SN | 5CSEBA6U23C7N | 5CSEBA6U23A7N | 5CSEBA5U23I7N | 5CSEBA4U23I7N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-pin UBGA (UBG-672) 23x23 mm | 672-pin UBGA (UBG-672) - same | 672-pin UBGA (UBG-672) - same | 672-pin UBGA (UBG-672) - same | 672-pin UBGA (UBG-672) - same | 672-pin UBGA (UBG-672) - same |
| Logic Elements | 110,000 | 110,000 | 110,000 | 110,000 | 85,000 | 49,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Maximum CPU Clock | 925 MHz | 925 MHz (C8 speed grade) | 925 MHz (C7 speed grade) | 925 MHz (A7 speed grade) | 925 MHz | 925 MHz |
| Temperature Range | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Lead-Free Finish | Yes (L suffix) | Yes (L suffix) | No | No | No | No |
Key Differentiators
- Industrial temperature grade in a lead-free package (vs 5CSEBA6U23C7N)
- Maximum 110K logic elements at I7 speed grade (vs 5CSEBA5U23I7N)
- Hard ARM Cortex-A9 subsystem integrated on-die (vs 5CGXBC7C7U19C8N (Cyclone V GX FPGA-only))
Design Notes
The 672-ball UBGA package has a published theta_JB in the Cyclone V device datasheet; for a typical 5W workload on a 4-layer JEDEC JESD51-7 board the junction-to-ambient thermal resistance theta_JA is approximately 14 C/W, giving a 70C rise above 25C ambient. Estimated: at full 8W dissipation the junction would rise 112C above ambient, requiring thermal vias under the BGA and, in enclosed cabinets, forced-air cooling. Industrial temperature range only guarantees operation if the die stays below +100C junction.
Use a minimum 6-layer stackup for the 672-ball UBGA, with at least one inner ground plane adjacent to the top layer for return-path integrity. Escape the BGA with 0.4 mm pitch micro-vias (laser-drilled, copper-filled) to inner layers; the Cyclone V device datasheet pinout guide specifies which signals must route on the top layer for short matched-length DDR3 traces. Decoupling: place 0402 0.1 uF caps within 2 mm of every VCCINT/VCCA ball, plus bulk 47 uF polymer on each rail. Impedance-control DDR3 to the HPS at 533 MHz DDR.
The Cyclone V SE SoC FPGA requires at minimum four rails: VCCINT (core, typically 1.1 V), VCCA (PLL analog, 2.5 V), VCCPD (I/O pre-driver, 2.5 V or 3.0 V), and VCCIO (I/O bank, per bank). The hard processor system adds HPS_VCC, HPS_VCCIO, DDR3_VTT, and DDR3_VREF rails. Power sequencing per the device datasheet requires VCCINT before VCCPD before VCCIO. Use the Quartus Prime Early Power Estimator spreadsheet before board bring-up to size each rail.
Route the HPS-to-DDR3 interface with matched-length traces (target skew < 25 ps) on inner layers with reference ground plane. FPGA fabric interfaces to external peripherals should be 3.3 V LVCMOS or 1.8 V LVDS depending on the I/O bank assignment; mismatched I/O standards between bank VCCIO and the driving device are a common cause of configuration failures. The configuration JTAG chain (TCK/TMS/TDO/TDI) must be pulled to known logic levels at power-up; floating JTAG lines cause intermittent programming failures.
Do not assume all five 5CSEBA6U23I7LN suffixes are interchangeable: only the I7 industrial temp grade matches the I7N variant's -40C to +100C specification. A common pitfall is ordering 5CSEBA6U23C7N (commercial 0C to +85C) for an outdoor cabinet that drops below 0C. Verify the temperature suffix before placing the order. Also confirm the Quartus Prime device support level: Cyclone V requires Quartus Prime Standard (not Lite) for full fabric utilization.
Compliance Information
Lead-free finish confirmed by LN suffix per distributor listing. REACH, halogen-free and conflict-minerals status not stated in the verified web data and should be requested from Intel directly for compliance documentation.
