A3PE3000-2FGG896 vs A3PE3000L-FGG896I Comparison
Detailed side-by-side comparison of A3PE3000-2FGG896 by Microchip Technology and A3PE3000L-FGG896I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
A3PE3000-2FGG896 - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-2FGG896 ✓ ActiveMicrochip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ ActiveSpecification Comparison
| Parameter | A3PE3000-2FGG896 | A3PE3000L-FGG896I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $128.00 | $139.90 |
| Family | ProASIC3E | ProASIC3L |
| Number of System Gates | 3,000,000 | — |
| Number of I/Os | 620 | — |
| Supply Voltage (Core) | 1.425 V to 1.575 V (1.5 V nominal) | — |
| Speed Grade | -2 | Standard (no speed suffix) |
| Package | 896-BGA / 896-FBGA (31x31 mm, 1.0 mm ball pitch) | — |
| Mounting Type | Surface Mount | Surface Mount (SMD/SMT) |
| Operating Temperature | 0C to 85C (TJ) | Industrial grade (I suffix) |
| Configuration Memory | On-chip Flash (non-volatile, single chip) | — |
| Technology | CMOS flash | — |
| Soft ARM Support | Optional (per ProASIC3E datasheet) | — |
| Packaging | Tray | Tray, standard quantity 27 |
| RoHS Status | ROHS3 Compliant (G suffix) | [DATA_NEEDED: RoHS status] |
| Manufacturer Lead Time | 8 weeks | — |
| Product Status | Active | — |
| Total System Performance | [DATA_NEEDED: system performance] | — |
| System Gates | — | 3000000 |
| Total RAM Bits | — | 516096 bits |
| Embedded Memory Type | — | True Dual-Port SRAM (504 kbits) |
| Number of I/O | — | 620 |
| Supply Voltage | — | 1.14 V to 1.575 V |
| Core Voltage Support | — | 1.2 V to 1.5 V |
| Logic Family / Process | — | CMOS, 130-nm, 7-layer metal (6 copper), flash-based |
| Configuration Technology | — | Nonvolatile Flash, Live-at-Power-Up Level 0 |
| Special Features | — | Flash*Freeze technology, single-chip solution |
| Package / Case | — | 896-BGA (FBGA, 1 mm pitch) |