A3PE3000-2FGG896 vs A3PE3000L-FGG896I Vergleich
Detaillierter Direktvergleich von A3PE3000-2FGG896 von Microchip Technology und A3PE3000L-FGG896I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE3000-2FGG896 - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-2FGG896 ✓ AktivMicrochip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ AktivSpezifikationsvergleich
| Parameter | A3PE3000-2FGG896 | A3PE3000L-FGG896I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $128,00 | $139,90 |
| Family | ProASIC3E | ProASIC3L |
| Number of System Gates | 3,000,000 | — |
| Number of I/Os | 620 | — |
| Supply Voltage (Core) | 1.425 V to 1.575 V (1.5 V nominal) | — |
| Speed Grade | -2 | Standard (no speed suffix) |
| Gehäuse | 896-BGA / 896-FBGA (31x31 mm, 1.0 mm ball pitch) | — |
| Montageart | Surface Mount | Surface Mount (SMD/SMT) |
| Betriebstemperatur | 0C to 85C (TJ) | Industrial grade (I suffix) |
| Configuration Memory | On-chip Flash (non-volatile, single chip) | — |
| Technology | CMOS flash | — |
| Soft ARM Support | Optional (per ProASIC3E datasheet) | — |
| Packaging | Tray | Tray, standard quantity 27 |
| RoHS-Status | ROHS3 Compliant (G suffix) | [DATA_NEEDED: RoHS status] |
| Manufacturer Lead Time | 8 weeks | — |
| Product Status | Active | — |
| Total System Performance | [DATA_NEEDED: system performance] | — |
| System Gates | — | 3000000 |
| Total RAM Bits | — | 516096 bits |
| Embedded Memory Type | — | True Dual-Port SRAM (504 kbits) |
| Number of I/O | — | 620 |
| Versorgungsspannung | — | 1.14 V to 1.575 V |
| Core Voltage Support | — | 1.2 V to 1.5 V |
| Logic Family / Process | — | CMOS, 130-nm, 7-layer metal (6 copper), flash-based |
| Configuration Technology | — | Nonvolatile Flash, Live-at-Power-Up Level 0 |
| Special Features | — | Flash*Freeze technology, single-chip solution |
| Gehäuse / Bauform | — | 896-BGA (FBGA, 1 mm pitch) |