A3PE3000-2FGG896 vs A3PE3000L-FGG896I Comparaison
Comparaison détaillée côte à côte de A3PE3000-2FGG896 par Microchip Technology et A3PE3000L-FGG896I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000-2FGG896 - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-2FGG896 ✓ ActifMicrochip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000-2FGG896 | A3PE3000L-FGG896I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $128,00 | $139,90 |
| Family | ProASIC3E | ProASIC3L |
| Number of System Gates | 3,000,000 | — |
| Number of I/Os | 620 | — |
| Supply Voltage (Core) | 1.425 V to 1.575 V (1.5 V nominal) | — |
| Speed Grade | -2 | Standard (no speed suffix) |
| Boîtier | 896-BGA / 896-FBGA (31x31 mm, 1.0 mm ball pitch) | — |
| Type de montage | Surface Mount | Surface Mount (SMD/SMT) |
| Température de fonctionnement | 0C to 85C (TJ) | Industrial grade (I suffix) |
| Configuration Memory | On-chip Flash (non-volatile, single chip) | — |
| Technology | CMOS flash | — |
| Soft ARM Support | Optional (per ProASIC3E datasheet) | — |
| Packaging | Tray | Tray, standard quantity 27 |
| Statut RoHS | ROHS3 Compliant (G suffix) | [DATA_NEEDED: RoHS status] |
| Manufacturer Lead Time | 8 weeks | — |
| Product Status | Active | — |
| Total System Performance | [DATA_NEEDED: system performance] | — |
| System Gates | — | 3000000 |
| Total RAM Bits | — | 516096 bits |
| Embedded Memory Type | — | True Dual-Port SRAM (504 kbits) |
| Number of I/O | — | 620 |
| Tension d'alimentation | — | 1.14 V to 1.575 V |
| Core Voltage Support | — | 1.2 V to 1.5 V |
| Logic Family / Process | — | CMOS, 130-nm, 7-layer metal (6 copper), flash-based |
| Configuration Technology | — | Nonvolatile Flash, Live-at-Power-Up Level 0 |
| Special Features | — | Flash*Freeze technology, single-chip solution |
| Boîtier / Format | — | 896-BGA (FBGA, 1 mm pitch) |