A3PE3000-2FGG896 vs A3PE3000L-FGG896I Comparación
Comparación detallada lado a lado de A3PE3000-2FGG896 por Microchip Technology y A3PE3000L-FGG896I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000-2FGG896 - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-2FGG896 ✓ ActivoMicrochip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000-2FGG896 | A3PE3000L-FGG896I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $128,00 | $139,90 |
| Family | ProASIC3E | ProASIC3L |
| Number of System Gates | 3,000,000 | — |
| Number of I/Os | 620 | — |
| Supply Voltage (Core) | 1.425 V to 1.575 V (1.5 V nominal) | — |
| Speed Grade | -2 | Standard (no speed suffix) |
| Encapsulado | 896-BGA / 896-FBGA (31x31 mm, 1.0 mm ball pitch) | — |
| Tipo de montaje | Surface Mount | Surface Mount (SMD/SMT) |
| Temperatura de funcionamiento | 0C to 85C (TJ) | Industrial grade (I suffix) |
| Configuration Memory | On-chip Flash (non-volatile, single chip) | — |
| Technology | CMOS flash | — |
| Soft ARM Support | Optional (per ProASIC3E datasheet) | — |
| Packaging | Tray | Tray, standard quantity 27 |
| Estado RoHS | ROHS3 Compliant (G suffix) | [DATA_NEEDED: RoHS status] |
| Manufacturer Lead Time | 8 weeks | — |
| Product Status | Active | — |
| Total System Performance | [DATA_NEEDED: system performance] | — |
| System Gates | — | 3000000 |
| Total RAM Bits | — | 516096 bits |
| Embedded Memory Type | — | True Dual-Port SRAM (504 kbits) |
| Number of I/O | — | 620 |
| Tensión de alimentación | — | 1.14 V to 1.575 V |
| Core Voltage Support | — | 1.2 V to 1.5 V |
| Logic Family / Process | — | CMOS, 130-nm, 7-layer metal (6 copper), flash-based |
| Configuration Technology | — | Nonvolatile Flash, Live-at-Power-Up Level 0 |
| Special Features | — | Flash*Freeze technology, single-chip solution |
| Encapsulado / Carcasa | — | 896-BGA (FBGA, 1 mm pitch) |