A3PE3000L-FG896I vs A3PE3000L-FGG896I Comparison

Detailed side-by-side comparison of A3PE3000L-FG896I by Microchip Technology and A3PE3000L-FGG896I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
A3PE3000L-FG896I A3PE3000L-FG896I - ProASIC3L Flash FPGA 620 I/O | Microchip

A3PE3000L-FG896I - ProASIC3L Flash FPGA 620 I/O | Microchip

A3PE3000L-FG896I ✓ Active
Microchip Technology
A3PE3000L-FGG896I A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip

A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip

A3PE3000L-FGG896I ✓ Active

Specification Comparison

Parameter A3PE3000L-FG896I A3PE3000L-FGG896I
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $0.00 $139.90
Family ProASIC3L (Low Power Flash FPGA) ProASIC3L
System Gates 3000000 3000000
Logic Cells 75264 —
User I/O 620 —
Core Voltage 1.2 V to 1.5 V —
I/O Voltage (minimum) 1.2 V —
Configuration Memory On-chip Flash (single-chip, nonvolatile) —
Low Power Feature Flash*Freeze technology (40% dynamic / 50% static power reduction) —
Package 896-BGA (FBGA-896) —
Mounting Type Surface Mount Surface Mount (SMD/SMT)
Temperature Grade Industrial (-I suffix) —
Reprogrammability Yes (in-system reprogrammable) —
RoHS Status RoHS Non-Compliant (per distributor listing) [DATA_NEEDED: RoHS status]
Lead Free Status Contains Lead (per distributor listing) —
Speed Grade [DATA_NEEDED: speed grade / grade code] Standard (no speed suffix)
Operating Temperature Range [DATA_NEEDED: exact operating temperature range in C] —
Embedded Memory [DATA_NEEDED: embedded SRAM block capacity] —
Total RAM Bits — 516096 bits
Embedded Memory Type — True Dual-Port SRAM (504 kbits)
Number of I/O — 620
Supply Voltage — 1.14 V to 1.575 V
Core Voltage Support — 1.2 V to 1.5 V
Logic Family / Process — CMOS, 130-nm, 7-layer metal (6 copper), flash-based
Configuration Technology — Nonvolatile Flash, Live-at-Power-Up Level 0
Special Features — Flash*Freeze technology, single-chip solution
Package / Case — 896-BGA (FBGA, 1 mm pitch)
Operating Temperature — Industrial grade (I suffix)
Packaging — Tray, standard quantity 27

Datasheets & Resources

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