A3PE3000L-FG896I - ProASIC3L Flash FPGA 620 I/O | Microchip
MPN: A3PE3000L-FG896I ✓ Active| Qty | Unit Price | Extended |
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| 10 | $0 | $0.00 |
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| 500 | $0 | $0.00 |
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Drop-in alternatives for A3PE3000L-FG896I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE3000L-FGG896I
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$139.9 / Unit
View Datasheet →A3PE3000L-1FGG896I
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View Datasheet →A3PE3000L-FG896
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View Datasheet →A3PE3000L-1FGG896YM
✅ Drop-In📋 Reference alternative (not in catalog)
M1A3PE3000L
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
A3PE3000L-FG896I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 |
| Logic Cells | 75264 |
| User I/O | 620 |
| Core Voltage | 1.2 V to 1.5 V |
| I/O Voltage (minimum) | 1.2 V |
| Configuration Memory | On-chip Flash (single-chip, nonvolatile) |
| Low Power Feature | Flash*Freeze technology (40% dynamic / 50% static power reduction) |
| Package | 896-BGA (FBGA-896) |
| Mounting Type | Surface Mount |
| Temperature Grade | Industrial (-I suffix) |
| Reprogrammability | Yes (in-system reprogrammable) |
| RoHS Status | RoHS Non-Compliant (per distributor listing) |
| Lead Free Status | Contains Lead (per distributor listing) |
A3PE3000L-FG896I 896-bga (fbga-896) Pin Configuration Guide
Complete pinout information for A3PE3000L-FG896I (896-bga (fbga-896) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000L-FG896I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000L-FG896I is suitable for 6 applications: Industrial Automation and Control, Medical and Diagnostic Equipment, Communications Infrastructure, Military and Aerospace Systems, Test and Measurement Instrumentation, Battery-Powered and Low-Power Embedded Systems.
Industrial Automation and Control
The A3PE3000L-FG896I fits industrial automation nodes that aggregate many sensor, encoder, and fieldbus signals into one programmable fabric. Its 620 user I/Os allow glueless interfacing to PLC backplanes, motor controllers, and industrial Ethernet MACs without external fan-out logic, while the industrial (-I) temperature grade covers -40C-class factory-floor environments. The on-chip flash configuration keeps the design single-chip and instant-on at power-up, important for machinery that must resume deterministic operation after power cycles. In systems with idle periods, Flash*Freeze mode trims dynamic power by up to 40% versus the equivalent standard ProASIC3, reducing cabinet heat. Designers typically pair the FPGA with isolated transceivers and supervisors, using the fabric for protocol bridging, safety interlocks, and high-resolution PWM generation.
Recommended
Medical and Diagnostic Equipment
Medical imaging and diagnostic instruments benefit from the A3PE3000L-FG896I's combination of high I/O count, reprogrammability, and nonvolatile single-chip configuration. Front-end boards in ultrasound, digital radiography, and laboratory analyzers use the 620 I/Os to connect multi-channel ADC arrays and detector lines, with the fabric handling timing, framing, and interface conversion. Flash-based configuration avoids external boot memory, reducing BOM and improving uptime behavior at instrument power-on, which matters in clinical workflows. The ProASIC3L's 1.2V-1.5V core and Flash*Freeze mode help meet thermal and battery-backup constraints in portable or cart-based systems. Because compliance targets in medical devices often require RoHS-conformant assemblies, designers can drop in the pin-compatible A3PE3000L-FGG896I variant on the same 896-ball PCB footprint without re-routing.
Recommended
Communications Infrastructure
Line cards, backplane adapters, and network processing assists use the A3PE3000L-FG896I as flexible logic glue between PHYs, framers, and host processors. The 620 user I/Os accommodate wide parallel data buses, multiple low-voltage differential interfaces, and bank voltages down to 1.2V, matching modern chip-to-chip signaling. The ProASIC3L fabric's deterministic timing supports framing, deskew, and status aggregation tasks that would otherwise consume several ASSP devices, cutting total cost of ownership as Microchip emphasizes for the family. Because designs in this domain iterate rapidly, the flash FPGA's in-system reprogrammability allows feature updates in deployed units without hardware changes. Engineering teams should verify speed-grade timing against link rates and consider the faster A3PE3000L-1FGG896I drop-in when static timing analysis is marginal at the standard grade.
Recommended
Military and Aerospace Systems
Flash FPGAs are a staple in defense electronics because on-chip flash configuration offers inherent resistance to configuration upsets compared with SRAM fabrics, and no configuration bitstream travels an exposed bus at boot. The A3PE3000L-FG896I's industrial grading, single-chip instant-on startup, and reprogrammability suit avionics interface boards, radar pre-processing, and secure communications equipment. The 896-ball FBGA provides dense, solder-bump-reliable mounting for high-vibration platforms, while the 620 I/Os map to redundant sensor buses and MIL-STD-style discrete interfaces aggregated in one device. Flash*Freeze allows duty-cycled battery- or vehicle-powered systems to cut dynamic power up to 40% during quiet phases and resume instantly. Long-lifecycle support from Microchip's FPGA portfolio also aligns with multi-decade platform service requirements common in this sector.
Recommended
Test and Measurement Instrumentation
Bench and modular instruments use the A3PE3000L-FG896I for trigger engines, timing generators, and bus-interface logic across 620 available I/Os. Flash configuration means the instrument is functional the instant power is applied, avoiding SRAM-FPGA boot latency that can delay measurement readiness. The ProASIC3L architecture supports bridging between acquisition front ends and embedded processors, with bank I/O voltages down to 1.2V matching modern probe and digitizer silicon. In-system reprogrammability lets manufacturers ship one hardware platform and deliver instrument capabilities via firmware, reducing SKU proliferation. Power-sensitive battery-operated field instruments exploit Flash*Freeze to cut dynamic power up to 40% between acquisitions. For designs pushed to timing limits, the pin-compatible A3PE3000L-1FGG896I provides a faster speed grade without PCB changes.
Recommended
Battery-Powered and Low-Power Embedded Systems
Duty-cycled systems such as portable data loggers, battery-backed controllers, and remote monitoring nodes exploit the ProASIC3L family's defining feature: Flash*Freeze technology. According to the Microchip ProASIC3L datasheet (DS50003268), the family reduces dynamic power by 40% and static power by 50% versus the equivalent standard ProASIC3 device, and Flash*Freeze preserves the entire logic state while clocks and I/O are frozen, so the system wakes instantly without reconfiguration. The A3PE3000L-FG896I's 1.2V-1.5V core operation and 1.2V-capable I/O banks reduce rail power, while single-chip flash configuration removes boot ROM current and area. Designers should budget wake/exit timing from the datasheet and verify the industrial (-I) grade if the system operates outdoors; the FGG896I variant offers the same footprint with Pb-free finishing for compliant products.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000L-FG896I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000L-FGG896I | A3PE3000L-1FGG896I | A3PE3000L-FG896 | A3PE3000L-1FGG896YM |
|---|---|---|---|---|---|
| Package | 896-BGA (FBGA-896) | 896-BGA (FBGA-896) - same footprint | 896-BGA (FBGA-896) - same footprint | 896-BGA (FBGA-896) - same footprint | PBGA896 - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| User I/O Count | 620 | 620 | 620 | 620 | 620 |
| Logic Cells | 75264 | 75264 | 75264 | 75264 | 75264 |
| Speed Grade | Standard | Standard | -1 (faster) | Standard | -1 (faster) |
| Temperature Grade | Industrial (-I) | Industrial (-I) | Industrial (-I) | Commercial (no -I suffix) | [DATA_NEEDED] |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| RoHS / Lead Status | RoHS Non-Compliant, Contains Lead (per distributor listing) | Pb-free / green variant (verify declaration) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Configuration Memory | On-chip Flash (single-chip) | On-chip Flash (single-chip) | On-chip Flash (single-chip) | On-chip Flash (single-chip) | On-chip Flash (single-chip) |
Key Differentiators
- Nonvolatile single-chip flash configuration (vs SRAM-based FPGAs of similar density)
- Flash*Freeze low-power mode (vs A3PE3000 (standard ProASIC3))
- 620 user I/Os in a dense 896-ball footprint (vs A3PE3000L-FGG484I)
- Lead-containing finish can be a liability (vs A3PE3000L-FGG896I)
Design Notes
An 896-ball FBGA with 620 used I/Os demands careful fan-out planning: escape routing typically requires microvias or at minimum 0.15 mm drill vias under the array, and power/ground ball allocation must follow the Microchip ProASIC3L packaging document (DS50003268 companion pinout tables). Confirm the exact ball map before routing - do not copy layouts from FG484/FGG484 variants of the same family, as the 896-ball map differs. Plan I/O bank voltages early since banks support operation down to 1.2V; mixing 3.3V and 1.2V banks requires bank-level supply planning on the PCB.
Estimated: core rails at 1.2V to 1.5V for a 75264-cell fabric can draw significant current at high utilization; size the core regulator and decoupling network from a power estimation run in Libero SoC (Microchip's design suite) rather than from a fixed figure. The Flash*Freeze mode can reduce dynamic power by up to 40% and static power by 50% versus standard ProASIC3, per DS50003268, so implement the Flash*Freeze control pin in your power-management scheme for duty-cycled systems. Provide adequate bulk capacitance near the 896-ball package for simultaneous switching noise on 620 I/Os.
Do not assume RoHS compliance: this -I FG variant is listed as lead-containing/RoHS non-compliant in verified distributor data, which can block shipments into RoHS markets. Use the pin-compatible A3PE3000L-FGG896I for green/RoHS builds - same footprint, same die - and verify the compliance declaration on the Microchip product page. Also match speed grade to timing closure: if static timing fails at the standard grade, move to the A3PE3000L-1FGG896I (-1 grade) rather than re-architecting, since it is pin-to-pin compatible.
Compliance Information
Distributor listing (digichip.com) states Lead Free Status: Contains Lead; RoHS Status: RoHS Non-Compliant. Pin-compatible Pb-free variant A3PE3000L-FGG896I exists for compliant builds. Verify current declarations on the Microchip product page.
