A3PE3000L-FGG896 - 3M Gate Flash FPGA | Microchip Technology
MPN: A3PE3000L-FGG896 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82 | $820.00 |
| 100 | $74.5 | $7,450.00 |
| 500 | $68 | $34,000.00 |
| 1,000 | $62 | $62,000.00 |
| 3,000 | $55 | $165,000.00 |
Drop-in alternatives for A3PE3000L-FGG896 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3PE3000L-1FGG896I
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →A3PE3000L-FGG896I
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$139.9 / Unit
View Datasheet →A3PE3000L-1FGG896I
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →A3PE3000L-FGG896YM
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE3000L-2FGG896I
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
A3PE3000L-FGG896 Maximum Ratings & Electrical Characteristics
| System Gates | 3,000,000 |
| Logic Cells | 75,264 |
| Total SRAM | 504 kbits |
| User I/Os (FGG896) | 620 |
| Package | 896-ball FBGA (FGG896), 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Core Supply Voltage | 1.2 V to 1.5 V |
| Operating Temperature | 0 C to +70 C |
| Logic Family | CMOS |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based |
| Flash*Freeze Support | Yes |
| Live-At-Power-Up | Level 0 support |
| Reconfiguration | Reprogrammable (in-system programmable) |
| Lead-Free Finish | Yes |
| Ball Count | 896 |
A3PE3000L-FGG896 896-ball fbga (fgg896), 1.0 mm pitch Pin Configuration Guide
Complete pinout information for A3PE3000L-FGG896 (896-ball fbga (fgg896), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000L-FGG896.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000L-FGG896 is suitable for 6 applications: Industrial Automation and Control, Communications Infrastructure, Defense and Aerospace Electronics, Medical Electronics and Imaging, Broadcast and Machine Vision, Secure IoT and Edge Computing.
Industrial Automation and Control
The A3PE3000L-FGG896 provides up to 620 user I/Os and 75,264 logic cells, making it well-suited for PLCs, motion control, and factory automation where multiple sensors, actuators, and communication protocols must be bridged. Its flash-based, live-at-power-up operation eliminates boot latency at machine power-on, and the 1.2-1.5V core allows efficient operation in sealed control cabinets with limited airflow. Flash*Freeze mode provides a simple way to reduce standby power during idle cycles. External DDR3 or NOR flash can be connected directly to the FPGA's I/O banks for local data logging and firmware storage, while the wide I/O count supports parallel buses and custom peripheral controllers.
Recommended
Communications Infrastructure
In communications equipment such as Ethernet switches, small-cell base stations, and protocol converters, the A3PE3000L-FGG896 delivers 504 kbits of dual-port SRAM and 620 user I/Os for interfacing to PHYs, SERDES devices, and network processors. The flash-based FPGA does not require external boot memory, simplifying field upgrades and reducing the chance of bitstream corruption. Its low dynamic power and 1.2-1.5V core are compatible with modern transceivers and power-management architectures. The device can handle packet buffering, protocol state machines, and glue logic, while the large I/O count provides enough pins for parallel memory and high-speed buses.
Recommended
Defense and Aerospace Electronics
The A3PE3000L-FGG896 is used in avionics, radar signal conditioning, and secure communication systems where determinism and resistance to bitstream tampering are important. Because configuration is stored in flash, the FPGA is live at power-up and leaves no external configuration footprint that could be probed. The commercial temperature grade is suitable for benign environments, but the YM or industrial variants can be used for extended temperature. The 3M system gates and 504 kbits SRAM are sufficient for sensor preprocessing, protocol conversion, and health-monitoring logic. For high-reliability systems, designers should pair it with radiation-tested companion memories and redundant power supplies.
Recommended
Medical Electronics and Imaging
Medical imaging systems, patient monitors, and diagnostic equipment require deterministic data acquisition and low-latency processing. The A3PE3000L-FGG896's 620 user I/Os can directly connect to CMOS image sensors, ADC arrays, and motor-control interfaces, while its on-chip SRAM enables small FIFOs for real-time data flow. The flash-based architecture supports remote firmware updates in the field without boot flash complexity, and the low static power reduces thermal impact in compact medical devices. When paired with external DDR3 and NOR flash, the FPGA can handle image data de-interleaving, sensor calibration tables, and communication protocol bridging.
Recommended
Broadcast and Machine Vision
Real-time video capture, frame buffering, and pixel processing require an FPGA with high I/O bandwidth and deterministic timing. The A3PE3000L-FGG896 offers 620 user I/Os that can connect to multiple camera interfaces, DisplayPort or HDMI bridge chips, and memory devices. Its 504 kbits of true dual-port SRAM are useful for line buffers and small image buffers, while external DDR3 handles large frames. Flash*Freeze mode can reduce power during standby, and the 1.2-1.5V core lowers heat dissipation in dense video processing boards. The FPGA can implement color-space conversion, pattern generation, and trigger logic for synchronized multi-camera capture.
Recommended
Secure IoT and Edge Computing
Edge nodes and smart sensors benefit from the A3PE3000L-FGG896's low static power, flash-based security, and live-at-power-up capability. The FPGA can manage sensor readout, implement custom cryptographic logic, and offload protocol parsing from a host MCU or MPU. Flash*Freeze mode provides an ultra-low-power state for battery-powered devices, retaining all logic and memory state. With 3M gates, it has room for soft-core processors, custom peripherals, and communication controllers. Paired with SPI NOR flash for keys and certificates, the A3PE3000L-FGG896 creates a robust secure element for edge computing.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000L-FGG896 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000L-1FGG896I | A3PE3000L-FGG896I | A3PE3000L-2FGG896I |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | FBGA-896 | FBGA-896 | FBGA-896 | FBGA-896 |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Logic Cells | 75,264 | 75,264 | 75,264 | 75,264 |
| Total SRAM | 504 kbits | 504 kbits | 504 kbits | 504 kbits |
| User I/Os | 620 | 620 | 620 | 620 |
| Core Supply Voltage | 1.2V - 1.5V | 1.2V - 1.5V | 1.2V - 1.5V | 1.2V - 1.5V |
| Operating Temperature | 0 to +70C | -40 to +100C | -40 to +100C | -40 to +100C |
| Speed Grade | [DATA_NEEDED] | -1 | Standard | -2 |
Key Differentiators
- Standard speed grade with commercial temperature, offering the lowest cost in the FGG896 family (vs A3PE3000L-1FGG896I)
- Flash-based, live-at-power-up operation eliminates external boot memory (vs SRAM-based FPGAs from other vendors)
- 620 user I/Os in an 896-ball package provide high connectivity for memory and peripheral interfaces (vs A3PE3000L-1FGG896I)
Design Notes
Estimated: The A3PE3000L-FGG896 core operates at 1.2V to 1.5V. Many designs use a 1.5V core supply. With 75,264 logic cells, dynamic power depends heavily on toggle rate and clock frequency; a 50 MHz design with 30% utilization may draw roughly 200-400 mA from the core, but this is an estimate. Place a 10uF bulk capacitor and multiple 100nF ceramics near the core supply balls. Use a low-noise LDO or DC-DC converter rated for the total current draw, and verify with the Microchip power estimator tool.
The 896-ball FBGA package has a large thermal pad (exposed pad at the center of the package). For reliable operation above 50C ambient, connect the thermal pad to a solid ground plane with thermal vias (at least 9 vias, 0.3mm drill) placed under the pad. The commercial temperature grade (0 to +70C) limits junction temperature; for extended temperature applications, choose an industrial or YM variant. Estimate junction rise using theta_JA from the datasheet and the specific power consumption of your design.
Do not confuse the FGG896 package with the FG896 or FG484 variants. The FGG896 has a 1.0mm ball pitch and 896 balls, while other package codes may use different footprints or ball counts. Always confirm the exact ball map from the datasheet before laying out the PCB. When using Flash*Freeze, ensure the Flash*Freeze pin is properly driven and that all I/O states are intended to be preserved; otherwise, floating I/Os can cause unnecessary leakage.
Compliance Information
Mouser lists A3PE3000L-FGG896 as LEAD FREE. RoHS/REACH status not explicitly stated in verified web data; confirm with manufacturer or distributor for full compliance certificates.
