ATSAMB11-XPRO vs ATSAMB11ZR-XPRO Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng ATSAMB11-XPRO sa pamamagitan ng Microchip Technology at ATSAMB11ZR-XPRO sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Microchip Technology
ATSAMB11-XPRO ATSAMB11-XPRO - BLE 4.1 SmartConnect Xplained Pro Kit | Microchip

ATSAMB11-XPRO - BLE 4.1 SmartConnect Xplained Pro Kit | Microchip

ATSAMB11-XPRO ✓ Nakahanda
Microchip Technology
ATSAMB11ZR-XPRO ATSAMB11ZR-XPRO - BLE 4.x SmartConnect Xplained Pro | Microchip

ATSAMB11ZR-XPRO - BLE 4.x SmartConnect Xplained Pro | Microchip

ATSAMB11ZR-XPRO ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro ATSAMB11-XPRO ATSAMB11ZR-XPRO
Brand Microchip Technology Microchip Technology
Kategorya Development Boards Wireless Modules
Katayuan ng Lifecycle Aktibo Aktibo
Product Type Bluetooth Smart Xplained Pro Evaluation Kit RF Evaluation and Development Kit
Target MCU / Module ATSAMB11-MR510CA (ATSAMB11G18A SoC) —
MCU Core ARM Cortex-M0 32-bit —
Bluetooth Version BLE 4.1 (Bluetooth Smart) —
Operating Frequency 2.4 GHz ISM band 2.4 GHz ISM band
Flash Memory 256 KB —
Low-Frequency Clock 32.768 kHz —
Primary CPU Clock 12 MHz —
Form Factor Xplained Pro (Atmel/Microchip standard) —
Extension Header 2x5 100-mil Xplained Pro header —
Current Measurement 1x2 100-mil pin-header for MCU current shunt —
Debug Interface On-board EDBG (USB to SWD/UART) On-board SWD + Virtual COM port over USB
Supported OS Windows 7 / 8 / Vista / XP —
Integrated Radio Transceiver, modem, MAC, PA, TR switch —
Integrated Power Management Yes (on-module PMU) —
Bluetooth Certification Bluetooth SIG 4.1 (module pre-certified) —
Typical Use Case BLE peripheral / beacon prototyping —
Base Part Number — ATSAMB11-ZR210CA
RF Technology — Bluetooth Smart 4.x Low Energy (BLE)
Module Family — SmartConnect (ATSAMB11 Series)
Module Type — SiP/Module (System-in-Package)
Supported Standards — IEEE 802.15.1, Bluetooth 4.x Low Energy
Host Processor — ARM Cortex-M0
Integrated Crystal — 32.768 kHz RTC + 16 MHz main
Power Supply — USB powered via on-board debugger
Extension Connectors — Xplained Pro header + mikroBUS socket
User Interface — 1x user pushbutton, 1x user LED, QT touch header
Temperature na Operasyon — -40C to +85C
Tindminan RoHS — Compliant
Country of Origin — RoHS-compliant Microchip packaging

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