ATSAMB11-XPRO vs ATSAMB11ZR-XPRO Comparação

Comparação detalhada lado a lado de ATSAMB11-XPRO por Microchip Technology e ATSAMB11ZR-XPRO por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Microchip Technology
ATSAMB11-XPRO ATSAMB11-XPRO - BLE 4.1 SmartConnect Xplained Pro Kit | Microchip

ATSAMB11-XPRO - BLE 4.1 SmartConnect Xplained Pro Kit | Microchip

ATSAMB11-XPRO ✓ Ativo
Microchip Technology
ATSAMB11ZR-XPRO ATSAMB11ZR-XPRO - BLE 4.x SmartConnect Xplained Pro | Microchip

ATSAMB11ZR-XPRO - BLE 4.x SmartConnect Xplained Pro | Microchip

ATSAMB11ZR-XPRO ✓ Ativo

Comparação de especificações

Parâmetro ATSAMB11-XPRO ATSAMB11ZR-XPRO
Marca Microchip Technology Microchip Technology
Categoria Development Boards Wireless Modules
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $36,14 $45,00
Product Type Bluetooth Smart Xplained Pro Evaluation Kit RF Evaluation and Development Kit
Target MCU / Module ATSAMB11-MR510CA (ATSAMB11G18A SoC) —
MCU Core ARM Cortex-M0 32-bit —
Bluetooth Version BLE 4.1 (Bluetooth Smart) —
Operating Frequency 2.4 GHz ISM band 2.4 GHz ISM band
Flash Memory 256 KB —
Low-Frequency Clock 32.768 kHz —
Primary CPU Clock 12 MHz —
Form Factor Xplained Pro (Atmel/Microchip standard) —
Extension Header 2x5 100-mil Xplained Pro header —
Current Measurement 1x2 100-mil pin-header for MCU current shunt —
Debug Interface On-board EDBG (USB to SWD/UART) On-board SWD + Virtual COM port over USB
Supported OS Windows 7 / 8 / Vista / XP —
Integrated Radio Transceiver, modem, MAC, PA, TR switch —
Integrated Power Management Yes (on-module PMU) —
Bluetooth Certification Bluetooth SIG 4.1 (module pre-certified) —
Typical Use Case BLE peripheral / beacon prototyping —
Base Part Number — ATSAMB11-ZR210CA
RF Technology — Bluetooth Smart 4.x Low Energy (BLE)
Module Family — SmartConnect (ATSAMB11 Series)
Module Type — SiP/Module (System-in-Package)
Supported Standards — IEEE 802.15.1, Bluetooth 4.x Low Energy
Host Processor — ARM Cortex-M0
Integrated Crystal — 32.768 kHz RTC + 16 MHz main
Power Supply — USB powered via on-board debugger
Extension Connectors — Xplained Pro header + mikroBUS socket
User Interface — 1x user pushbutton, 1x user LED, QT touch header
Temperatura de operação — -40C to +85C
Status RoHS — Compliant
Country of Origin — RoHS-compliant Microchip packaging

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