BSC9132NXN7MNMB vs BSC9132NSE7MNMB Comparison

Detailed side-by-side comparison of BSC9132NXN7MNMB by NXP Semiconductors and BSC9132NSE7MNMB by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
BSC9132NXN7MNMB BSC9132NXN7MNMB - QorIQ Qonverge BSC SoC, 2x e500 + 2x SC3850 | NXP

BSC9132NXN7MNMB - QorIQ Qonverge BSC SoC, 2x e500 + 2x SC3850 | NXP

BSC9132NXN7MNMB ✓ Active
NXP Semiconductors
BSC9132NSE7MNMB BSC9132NSE7MNMB - QorIQ Qonverge SoC, 1.333GHz, FCBGA-780 | NXP

BSC9132NSE7MNMB - QorIQ Qonverge SoC, 1.333GHz, FCBGA-780 | NXP

BSC9132NSE7MNMB ✓ Active

Specification Comparison

Parameter BSC9132NXN7MNMB BSC9132NSE7MNMB
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $138.90 $218.75
Part Number BSC9132NXN7MNMB —
Manufacturer NXP Semiconductors (formerly Freescale) —
Series QorIQ Qonverge BSC —
Core Processor PowerPC e500 —
Number of Cores / Bus Width 2 Core, 32-Bit —
CPU Speed 1.333 GHz —
Co-Processors / DSP SC3850 StarCore DSP, dual 1.2 GHz; MAPLE-B2P baseband accelerator —
RAM Controllers DDR3, DDR3L (dual controllers, ECC support) —
Graphics Acceleration No —
Ethernet Multiple MACs (10/100/1000) —
USB USB 2.0 —
PCIe PCIe lanes (number varies by SerDes config) —
SerDes Lanes Multi-lane SerDes for CPRI/OBSAI fronthaul —
Package 780-FCBGA (23x23 mm) 780-pin FCBGA (23x23 mm)
Operating Temperature -40C to +105C 0C to +105C
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
RoHS Status Compliant (per NXP product page) Compliant (per DigiKey)
Product Type — Multicore Baseband SoC (MPU + DSP)
Architecture — QorIQ Qonverge BSC
CPU Cores — 2x PowerPC e500, 1.2 GHz
DSP Cores — 2x StarCore SC3850, 1.2 GHz
Max Core Frequency — 1.333 GHz
Baseband Accelerator — MAPLE-B2P (Turbo + Viterbi + FEC)
Security Engine — SEC (Integrated)
Process Technology — 45 nm CMOS
MSL Level — 3 (per Partstack listing)
Peak Reflow Temperature — 245C (per Partstack listing)
Lead-Free / Solder Finish — e1 (per Partstack listing)
Data Bus Width — 32-bit

Datasheets & Resources

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