BSC9132NXN7MNMB vs BSC9132NSE7MNMB Comparación
Comparación detallada lado a lado de BSC9132NXN7MNMB por NXP Semiconductors y BSC9132NSE7MNMB por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
BSC9132NXN7MNMB - QorIQ Qonverge BSC SoC, 2x e500 + 2x SC3850 | NXP
BSC9132NXN7MNMB ✓ ActivoNXP Semiconductors
BSC9132NSE7MNMB - QorIQ Qonverge SoC, 1.333GHz, FCBGA-780 | NXP
BSC9132NSE7MNMB ✓ ActivoComparación de especificaciones
| Parámetro | BSC9132NXN7MNMB | BSC9132NSE7MNMB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $138,90 | $218,75 |
| Part Number | BSC9132NXN7MNMB | — |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | QorIQ Qonverge BSC | — |
| Core Processor | PowerPC e500 | — |
| Number of Cores / Bus Width | 2 Core, 32-Bit | — |
| CPU Speed | 1.333 GHz | — |
| Co-Processors / DSP | SC3850 StarCore DSP, dual 1.2 GHz; MAPLE-B2P baseband accelerator | — |
| RAM Controllers | DDR3, DDR3L (dual controllers, ECC support) | — |
| Graphics Acceleration | No | — |
| Ethernet | Multiple MACs (10/100/1000) | — |
| USB | USB 2.0 | — |
| PCIe | PCIe lanes (number varies by SerDes config) | — |
| SerDes Lanes | Multi-lane SerDes for CPRI/OBSAI fronthaul | — |
| Encapsulado | 780-FCBGA (23x23 mm) | 780-pin FCBGA (23x23 mm) |
| Temperatura de funcionamiento | -40C to +105C | 0C to +105C |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | Compliant (per NXP product page) | Compliant (per DigiKey) |
| Product Type | — | Multicore Baseband SoC (MPU + DSP) |
| Architecture | — | QorIQ Qonverge BSC |
| CPU Cores | — | 2x PowerPC e500, 1.2 GHz |
| DSP Cores | — | 2x StarCore SC3850, 1.2 GHz |
| Max Core Frequency | — | 1.333 GHz |
| Baseband Accelerator | — | MAPLE-B2P (Turbo + Viterbi + FEC) |
| Security Engine | — | SEC (Integrated) |
| Process Technology | — | 45 nm CMOS |
| Nivel MSL | — | 3 (per Partstack listing) |
| Peak Reflow Temperature | — | 245C (per Partstack listing) |
| Lead-Free / Solder Finish | — | e1 (per Partstack listing) |
| Ancho del bus de datos | — | 32-bit |