BSC9132NXN7MNMB vs BSC9132NSE7MNMB Vergleich
Detaillierter Direktvergleich von BSC9132NXN7MNMB von NXP Semiconductors und BSC9132NSE7MNMB von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
BSC9132NXN7MNMB - QorIQ Qonverge BSC SoC, 2x e500 + 2x SC3850 | NXP
BSC9132NXN7MNMB ✓ AktivNXP Semiconductors
BSC9132NSE7MNMB - QorIQ Qonverge SoC, 1.333GHz, FCBGA-780 | NXP
BSC9132NSE7MNMB ✓ AktivSpezifikationsvergleich
| Parameter | BSC9132NXN7MNMB | BSC9132NSE7MNMB |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $138,90 | $218,75 |
| Part Number | BSC9132NXN7MNMB | — |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | QorIQ Qonverge BSC | — |
| Core Processor | PowerPC e500 | — |
| Number of Cores / Bus Width | 2 Core, 32-Bit | — |
| CPU Speed | 1.333 GHz | — |
| Co-Processors / DSP | SC3850 StarCore DSP, dual 1.2 GHz; MAPLE-B2P baseband accelerator | — |
| RAM Controllers | DDR3, DDR3L (dual controllers, ECC support) | — |
| Graphics Acceleration | No | — |
| Ethernet | Multiple MACs (10/100/1000) | — |
| USB | USB 2.0 | — |
| PCIe | PCIe lanes (number varies by SerDes config) | — |
| SerDes Lanes | Multi-lane SerDes for CPRI/OBSAI fronthaul | — |
| Gehäuse | 780-FCBGA (23x23 mm) | 780-pin FCBGA (23x23 mm) |
| Betriebstemperatur | -40C to +105C | 0C to +105C |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | Compliant (per NXP product page) | Compliant (per DigiKey) |
| Product Type | — | Multicore Baseband SoC (MPU + DSP) |
| Architecture | — | QorIQ Qonverge BSC |
| CPU Cores | — | 2x PowerPC e500, 1.2 GHz |
| DSP Cores | — | 2x StarCore SC3850, 1.2 GHz |
| Max Core Frequency | — | 1.333 GHz |
| Baseband Accelerator | — | MAPLE-B2P (Turbo + Viterbi + FEC) |
| Security Engine | — | SEC (Integrated) |
| Process Technology | — | 45 nm CMOS |
| MSL-Level | — | 3 (per Partstack listing) |
| Peak Reflow Temperature | — | 245C (per Partstack listing) |
| Lead-Free / Solder Finish | — | e1 (per Partstack listing) |
| Datenbusbreite | — | 32-bit |