DSP56311VF150 vs DSP56303VF100 Comparison
Detailed side-by-side comparison of DSP56311VF150 by NXP Semiconductors and DSP56303VF100 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | DSP56311VF150 | DSP56303VF100 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | DSP | DSP |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $24.90 | $30.10 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | DSP56300 (Symphony) | — |
| Type | Fixed-Point Digital Signal Processor | — |
| Core Clock Frequency | 150 MHz | — |
| Instruction Throughput | 150 MIPS | — |
| Multiply-Accumulate Performance | 300 MMACS | — |
| Data Bus Width | 24 bit | — |
| On-Chip RAM | 384 KB | 24 KB |
| Bootstrap ROM | 576 B | 576 bytes |
| Enhanced Filter Coprocessor (EFCOP) | Yes, parallel execution | — |
| DMA Channels | 6 | — |
| Serial Interfaces | Host Interface (HI), SSI, SCI | — |
| I/O Voltage | 3.30 V | 3.30 V |
| Input Logic Compatibility | TTL-compatible | — |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: industrial temperature grade] |
| Package | 196-ball MAP-BGA (15x15 mm) | 196-ball LBGA (15x15 mm), MAP-BGA-196 |
| Mounting Type | Surface Mount | Surface Mount |
| Process Technology | High-density CMOS | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance per datasheet] |
| MSL Level | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: moisture sensitivity level] |
| Core Architecture | — | DSP56300 family, 24-bit fixed-point |
| Clock Frequency | — | 100 MHz |
| Performance | — | 100 MIPS (million instructions per second) |
| Instruction Cycle | — | Single clock cycle per instruction |
| Data Word Width | — | 24 bits |
| Address Space | — | 24-bit program and data |
| Core Voltage | — | [DATA_NEEDED: internal core Vdd] |
| Interfaces | — | Host Interface (HI08), ESSI, SCI |
| On-Chip Peripherals | — | Triple Timer, PLL, External Memory Expansion port |
| Debug | — | JTAG/OnCE |
| Packaging | — | Tray |