DSP56311VF150 vs DSP56303VF100 Сравнение
Подробное сравнение бок о бок DSP56311VF150 от NXP Semiconductors и DSP56303VF100 от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | DSP56311VF150 | DSP56303VF100 |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | DSP | DSP |
| Статус жизненного цикла | Obsolete | Obsolete |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $24,90 | $30,10 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | DSP56300 (Symphony) | — |
| Type | Fixed-Point Digital Signal Processor | — |
| Core Clock Frequency | 150 MHz | — |
| Instruction Throughput | 150 MIPS | — |
| Multiply-Accumulate Performance | 300 MMACS | — |
| Разрядность шины данных | 24 bit | — |
| On-Chip RAM | 384 KB | 24 KB |
| Bootstrap ROM | 576 B | 576 bytes |
| Enhanced Filter Coprocessor (EFCOP) | Yes, parallel execution | — |
| DMA Channels | 6 | — |
| Serial Interfaces | Host Interface (HI), SSI, SCI | — |
| I/O Voltage | 3.30 V | 3.30 V |
| Input Logic Compatibility | TTL-compatible | — |
| Рабочая температура | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: industrial temperature grade] |
| Корпус | 196-ball MAP-BGA (15x15 mm) | 196-ball LBGA (15x15 mm), MAP-BGA-196 |
| Тип монтажа | Surface Mount | Surface Mount |
| Process Technology | High-density CMOS | — |
| Статус RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance per datasheet] |
| Уровень MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: moisture sensitivity level] |
| Core Architecture | — | DSP56300 family, 24-bit fixed-point |
| Clock Frequency | — | 100 MHz |
| Performance | — | 100 MIPS (million instructions per second) |
| Instruction Cycle | — | Single clock cycle per instruction |
| Data Word Width | — | 24 bits |
| Address Space | — | 24-bit program and data |
| Core Voltage | — | [DATA_NEEDED: internal core Vdd] |
| Interfaces | — | Host Interface (HI08), ESSI, SCI |
| On-Chip Peripherals | — | Triple Timer, PLL, External Memory Expansion port |
| Debug | — | JTAG/OnCE |
| Packaging | — | Tray |