DSP56311VF150 vs DSP56303VF100 Vergleich
Detaillierter Direktvergleich von DSP56311VF150 von NXP Semiconductors und DSP56303VF100 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | DSP56311VF150 | DSP56303VF100 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | DSP | DSP |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $24,90 | $30,10 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | DSP56300 (Symphony) | — |
| Type | Fixed-Point Digital Signal Processor | — |
| Core Clock Frequency | 150 MHz | — |
| Instruction Throughput | 150 MIPS | — |
| Multiply-Accumulate Performance | 300 MMACS | — |
| Datenbusbreite | 24 bit | — |
| On-Chip RAM | 384 KB | 24 KB |
| Bootstrap ROM | 576 B | 576 bytes |
| Enhanced Filter Coprocessor (EFCOP) | Yes, parallel execution | — |
| DMA Channels | 6 | — |
| Serial Interfaces | Host Interface (HI), SSI, SCI | — |
| I/O Voltage | 3.30 V | 3.30 V |
| Input Logic Compatibility | TTL-compatible | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: industrial temperature grade] |
| Gehäuse | 196-ball MAP-BGA (15x15 mm) | 196-ball LBGA (15x15 mm), MAP-BGA-196 |
| Montageart | Surface Mount | Surface Mount |
| Process Technology | High-density CMOS | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance per datasheet] |
| MSL-Level | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: moisture sensitivity level] |
| Core Architecture | — | DSP56300 family, 24-bit fixed-point |
| Clock Frequency | — | 100 MHz |
| Performance | — | 100 MIPS (million instructions per second) |
| Instruction Cycle | — | Single clock cycle per instruction |
| Data Word Width | — | 24 bits |
| Address Space | — | 24-bit program and data |
| Core Voltage | — | [DATA_NEEDED: internal core Vdd] |
| Interfaces | — | Host Interface (HI08), ESSI, SCI |
| On-Chip Peripherals | — | Triple Timer, PLL, External Memory Expansion port |
| Debug | — | JTAG/OnCE |
| Packaging | — | Tray |