DSP56311VF150 vs DSP56303VF100 Comparación

Comparación detallada lado a lado de DSP56311VF150 por NXP Semiconductors y DSP56303VF100 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
DSP56311VF150 DSP56311VF150 - 150MHz 24-Bit Fixed-Point DSP | NXP

DSP56311VF150 - 150MHz 24-Bit Fixed-Point DSP | NXP

DSP56311VF150 Obsolete
NXP Semiconductors
DSP56303VF100 DSP56303VF100 - 24-Bit 100MHz/100MIPS DSP | NXP | BGA-196

DSP56303VF100 - 24-Bit 100MHz/100MIPS DSP | NXP | BGA-196

DSP56303VF100 Obsolete

Comparación de especificaciones

Parámetro DSP56311VF150 DSP56303VF100
Marca NXP Semiconductors NXP Semiconductors
Categoría DSP DSP
Estado del ciclo de vida Obsolete Obsolete
Estado del stock In Stock In Stock
Precio unitario (USD) $24,90 $30,10
Manufacturer NXP Semiconductors (formerly Freescale) —
Series DSP56300 (Symphony) —
Type Fixed-Point Digital Signal Processor —
Core Clock Frequency 150 MHz —
Instruction Throughput 150 MIPS —
Multiply-Accumulate Performance 300 MMACS —
Ancho del bus de datos 24 bit —
On-Chip RAM 384 KB 24 KB
Bootstrap ROM 576 B 576 bytes
Enhanced Filter Coprocessor (EFCOP) Yes, parallel execution —
DMA Channels 6 —
Serial Interfaces Host Interface (HI), SSI, SCI —
I/O Voltage 3.30 V 3.30 V
Input Logic Compatibility TTL-compatible —
Temperatura de funcionamiento [DATA_NEEDED: operating temperature range] [DATA_NEEDED: industrial temperature grade]
Encapsulado 196-ball MAP-BGA (15x15 mm) 196-ball LBGA (15x15 mm), MAP-BGA-196
Tipo de montaje Surface Mount Surface Mount
Process Technology High-density CMOS —
Estado RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance per datasheet]
Nivel MSL [DATA_NEEDED: MSL rating] [DATA_NEEDED: moisture sensitivity level]
Core Architecture — DSP56300 family, 24-bit fixed-point
Clock Frequency — 100 MHz
Performance — 100 MIPS (million instructions per second)
Instruction Cycle — Single clock cycle per instruction
Data Word Width — 24 bits
Address Space — 24-bit program and data
Core Voltage — [DATA_NEEDED: internal core Vdd]
Interfaces — Host Interface (HI08), ESSI, SCI
On-Chip Peripherals — Triple Timer, PLL, External Memory Expansion port
Debug — JTAG/OnCE
Packaging — Tray

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