EDB1332BDBH-1DAUT-F-D vs EDB5432BEBH-1DAUT-F-D Comparison
Detailed side-by-side comparison of EDB1332BDBH-1DAUT-F-D by Micron Technology and EDB5432BEBH-1DAUT-F-D by Micron Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Micron Technology
EDB1332BDBH-1DAUT-F-D - 1Gbit LPDDR2 533MHz | Micron
EDB1332BDBH-1DAUT-F-D ✓ ActiveMicron Technology
EDB5432BEBH-1DAUT-F-D - 512Mb LPDDR2 DRAM 533MHz | Micron
EDB5432BEBH-1DAUT-F-D ✓ ActiveSpecification Comparison
| Parameter | EDB1332BDBH-1DAUT-F-D | EDB5432BEBH-1DAUT-F-D |
|---|---|---|
| Brand | Micron Technology | Micron Technology |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2.16 | $2.45 |
| Memory Type | SDRAM - Mobile LPDDR2 | Mobile LPDDR2 SDRAM |
| Memory Size | 1 Gbit | 512 Mbit |
| Organization | 32M x 32 | 16M x 32 |
| Interface | Parallel | Parallel |
| Clock Frequency | 533 MHz | 533 MHz |
| Core Supply Voltage | 1.2 V | — |
| Supply Voltage Range | 1.14 V to 1.95 V | 1.14 V to 1.95 V |
| Access Mode | Single Bank Page Burst | — |
| Package | 134-VFBGA (10 x 11.5 mm) | 134-VFBGA (10 x 11.5 mm) |
| Number of Terminals | 134 | — |
| Mounting Type | Surface Mount | Surface Mount |
| Temperature Grade | Automotive | Automotive |
| Package Shape | Rectangular | Rectangular |
| Packaging Suffix | -D (Dry Pack) | — |
| Moisture Sensitivity | Dry Pack (per -D suffix) | — |
| Operating Temperature | [DATA_NEEDED: Operating Temperature] | [DATA_NEEDED: operating temperature range] |
| Core Voltage | — | 1.2 V (typical, LPDDR2) |
| Terminals | — | 134 balls |
| Terminal Form | — | Ball (VFBGA) |
| RoHS Code | — | Yes (D suffix, lead-free) |
| Part Life Cycle Code | — | Active |
| Access Time / CAS Latency | — | [DATA_NEEDED: CAS latency] |
| Standard Qty per Reel/Tray | — | [DATA_NEEDED: packaging standard quantity] |