EP1AGX20CF780C6N vs EP1AGX35CF780I6N Comparison

Detailed side-by-side comparison of EP1AGX20CF780C6N by Intel and EP1AGX35CF780I6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP1AGX35CF780I6N EP1AGX35CF780I6N - Arria GX FPGA, 33.5K LE, 780-BGA | Intel

EP1AGX35CF780I6N - Arria GX FPGA, 33.5K LE, 780-BGA | Intel

EP1AGX35CF780I6N ⚠ Last Time Buy

Specification Comparison

Parameter EP1AGX20CF780C6N EP1AGX35CF780I6N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last Time Buy
Stock Status In Stock In Stock
Unit Price (USD) $38.95 $278.75
Family Arria GX Arria GX
Logic Elements 21,580 —
Logic Array Blocks (LABs) 1,079 33,520
Embedded Memory (bits) 1,229,184 —
User I/O Pins 341 —
Number of Transceivers 4 (integrated multi-gigabit) —
Max Transceiver Data Rate 3.125 Gbps —
Core Voltage 1.2 V 1.2 V
Process Technology 90 nm 90 nm
Speed Grade C6 (commercial) I6
Temperature Grade Commercial (0 C to +85 C) Industrial
Package Type FBGA-780 (29 x 29 mm, 1.0 mm pitch) —
Mounting Type Surface Mount Surface Mount
Lead-Free / RoHS Lead free —
Configuration Modes PS, FPP, AS, JTAG —
Manufacturer — Intel (formerly Altera)
Device Series — EP1AGX35
Logic Elements (LE) — 33,250
Embedded Transceivers — Up to 3.125 Gbps
Transceiver Count — [DATA_NEEDED: transceiver count for EP1AGX35 in F780 package]
Package — 780-pin Flip-Chip BGA (FC-FBGA)
Package Code — BGA-780
Package Dimensions — 29 x 29 mm
Terminal Pitch — 1.00 mm
Terminal Form — Ball
Terminal Shape — [DATA_NEEDED: terminal shape - confirmed SQUARE package per partstack]
Operating Temperature Range — -40C to +100C (Industrial, I6 speed grade)
RoHS Status — [DATA_NEEDED: RoHS status not stated in verified sources]

Datasheets & Resources

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