EP1AGX20CF780C6N vs EP1AGX35CF780I6N Vergleich

Detaillierter Direktvergleich von EP1AGX20CF780C6N von Intel und EP1AGX35CF780I6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP1AGX35CF780I6N EP1AGX35CF780I6N - Arria GX FPGA, 33.5K LE, 780-BGA | Intel

EP1AGX35CF780I6N - Arria GX FPGA, 33.5K LE, 780-BGA | Intel

EP1AGX35CF780I6N ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP1AGX20CF780C6N EP1AGX35CF780I6N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $38,95 $278,75
Family Arria GX Arria GX
Logic Elements 21,580 —
Logic Array Blocks (LABs) 1,079 33,520
Embedded Memory (bits) 1,229,184 —
User I/O Pins 341 —
Number of Transceivers 4 (integrated multi-gigabit) —
Max Transceiver Data Rate 3.125 Gbps —
Core Voltage 1.2 V 1.2 V
Process Technology 90 nm 90 nm
Speed Grade C6 (commercial) I6
Temperature Grade Commercial (0 C to +85 C) Industrial
Package Type FBGA-780 (29 x 29 mm, 1.0 mm pitch) —
Montageart Surface Mount Surface Mount
Lead-Free / RoHS Lead free —
Configuration Modes PS, FPP, AS, JTAG —
Manufacturer — Intel (formerly Altera)
Device Series — EP1AGX35
Logic Elements (LE) — 33,250
Embedded Transceivers — Up to 3.125 Gbps
Transceiver Count — [DATA_NEEDED: transceiver count for EP1AGX35 in F780 package]
Gehäuse — 780-pin Flip-Chip BGA (FC-FBGA)
Package Code — BGA-780
Package Dimensions — 29 x 29 mm
Terminal Pitch — 1.00 mm
Terminal Form — Ball
Terminal Shape — [DATA_NEEDED: terminal shape - confirmed SQUARE package per partstack]
Betriebstemperaturbereich — -40C to +100C (Industrial, I6 speed grade)
RoHS-Status — [DATA_NEEDED: RoHS status not stated in verified sources]

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern